SPIE Photomask Technology (aka BACUS) is a global forum for scientists and engineers to present and discuss photomask design, fabrication, quality control, and applications in the semiconductor industry. Its co-location with the EUV Lithography Symposium in a single setting presents a unique opportunity to meet and share results, challenges, and potential solutions in the EUV and DUV worlds.

EUV is now used in high-volume manufacturing, in parallel with on-going innovation in 193i lithography to support multiple patterning in critical layers as well as applications in prototyping and larger-feature layers. Research continues to develop new mask materials, EUV pellicles, MDP (OPC, MPC, Fracture) methods, and metrology and inspection capabilities. Innovations in device packaging has become an important enabler in the improvement of IC performance following Moore’s Law. Substrates used in packaging have evolved into complex structures patterned with multi-mask layers. Additionally, the growth in legacy technology driven by AI as well as 5G, silicon photonics, IoT, MEMS, and similar products is creating a resurgence in demand across nodes, challenging mask makers to not only maintain but expand capacity for established processes with mature equipment.

This conference is an excellent opportunity for the information exchange that keeps our industry moving. We encourage technologists in the photomask and related fields to attend and share their work. We particularly welcome students to submit papers on their research activities. Scholarship support is available, and the BACUS organization bestows awards for best student paper and best student poster.

Papers addressing aspects of photomask research, development, manufacturing, and use are all solicited, including: As Conference Chairs, we urge you to participate by submitting your abstract(s) and encouraging your colleagues to do the same. We are grateful for the technical contributions and participating companies’ support that make this symposium happen. ;
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Conference PM22

Photomask Technology

This conference has an open call for papers:
Abstract Due: 4 May 2022
Author Notification: 5 July 2022
Manuscript Due: 22 September 2022
SPIE Photomask Technology (aka BACUS) is a global forum for scientists and engineers to present and discuss photomask design, fabrication, quality control, and applications in the semiconductor industry. Its co-location with the EUV Lithography Symposium in a single setting presents a unique opportunity to meet and share results, challenges, and potential solutions in the EUV and DUV worlds.

EUV is now used in high-volume manufacturing, in parallel with on-going innovation in 193i lithography to support multiple patterning in critical layers as well as applications in prototyping and larger-feature layers. Research continues to develop new mask materials, EUV pellicles, MDP (OPC, MPC, Fracture) methods, and metrology and inspection capabilities. Innovations in device packaging has become an important enabler in the improvement of IC performance following Moore’s Law. Substrates used in packaging have evolved into complex structures patterned with multi-mask layers. Additionally, the growth in legacy technology driven by AI as well as 5G, silicon photonics, IoT, MEMS, and similar products is creating a resurgence in demand across nodes, challenging mask makers to not only maintain but expand capacity for established processes with mature equipment.

This conference is an excellent opportunity for the information exchange that keeps our industry moving. We encourage technologists in the photomask and related fields to attend and share their work. We particularly welcome students to submit papers on their research activities. Scholarship support is available, and the BACUS organization bestows awards for best student paper and best student poster.

Papers addressing aspects of photomask research, development, manufacturing, and use are all solicited, including:
  • Design automation and data prep (DFM, OPC, SMO)
  • Curvilinear masks and inverse lithography technology
  • Mask writing, corrections, process compensation
  • Mask blanks, defects, and metrology
  • E-beam and optical resists
  • Mask patterning process (resist, develop, etch)
  • Metrology (CD, placement, AFM, AIMS)
  • Mask inspection and repair
  • Defects and defect control
  • Mask cleaning
  • Pellicles
  • Simulation and imaging: mask transfer to wafer (LER, SWA, surface roughness)
  • Effects of mask error and compensation
  • Use of deep learning and machine learning
  • Novel and maskless processes
  • Mature processes and legacy equipment use
  • Emerging device technology (AR/VR, quantum) requiring advanced patterning.
As Conference Chairs, we urge you to participate by submitting your abstract(s) and encouraging your colleagues to do the same. We are grateful for the technical contributions and participating companies’ support that make this symposium happen.
Conference Chair
HOYA Corp. (United States)
Conference Co-Chair
Intel Corp. (United States)
Program Committee
Intel Corp. (United States)
Program Committee
UBC Microelectronics (Germany)
Program Committee
Mentor, a Siemens Business (United States)
Program Committee
Aki Fujimura
D2S, Inc. (United States)
Program Committee
imec (Belgium)
Program Committee
Dai Nippon Printing Co., Ltd. (Japan)
Program Committee
Photronics, Inc. (United States)
Program Committee
ESOL, Inc. (Korea, Republic of)
Program Committee
IBM Thomas J. Watson Research Ctr. (United States)
Program Committee
Synopsys, Inc. (United States)
Program Committee
Toppan Photomasks, Inc. (United States)
Program Committee
Takahiro Onoue
HOYA Corp. (Japan)
Program Committee
KLA Corp. (United States)
Program Committee
GLOBALFOUNDRIES Inc. (United States)
Program Committee
Canon Nanotechnologies, Inc. (United States)
Program Committee
Mentor Graphics Corp. (United States)
Program Committee
Lasertec U.S.A., Inc. Zweigniederlassung Deutschland (Germany)
Program Committee
ASML Netherlands B.V. (Netherlands)
Program Committee
Applied Materials, Inc. (United States)
Program Committee
FUJIFILM Corp. (Japan)
Program Committee
NuFlare Technology, Inc. (Japan)
Program Committee
Keysight Technologies, Inc. (United States)