Monterey Conference Center and Monterey Marriott
Monterey, California, United States
15 - 19 September 2019
Conference 11148
Photomask Technology
Sunday - Thursday 15 - 19 September 2019
Conference
Committee
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Monday 16 September Show All Abstracts
Opening Remarks: Joint with conferences 11147 and 11148
Monday 16 September 2019
8:00 AM - 8:30 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Session 1:
Plenary Session: Joint session with conferences 11147 and 11148
Monday 16 September 2019
8:30 AM - 9:50 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Plenary TBD (Plenary Presentation)
Paper 11147-300
Author(s):
Show Abstract
Chip to city: the future of mobility (Plenary Presentation)
Paper 11148-300
Author(s):
Show Abstract
Photomask Opening Remarks
Monday 16 September 2019
10:20 AM - 10:30 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Session 2:
Survey
Monday 16 September 2019
10:30 AM - 10:55 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Jed H. Rankin, GLOBALFOUNDRIES Inc. (United States) ;
Moshe E. Preil, KLA Corp. (United States)
2019 mask maker survey results (Invited Paper)
Paper 11148-1
Author(s): Jan Willis, eBeam Initiative (United States); Aki Fujimura, D2S, Inc. (United States)
Show Abstract
Session 3:
Mature Mask Support
Monday 16 September 2019
10:55 AM - 12:20 PM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Jed H. Rankin, GLOBALFOUNDRIES Inc. (United States) ;
Moshe E. Preil, KLA Corp. (United States)
Sustaining the mask manufacturing base (Invited Paper)
Paper 11148-2
Author(s): Franklin D. Kalk, Toppan Photomasks, Inc. (United States)
Show Abstract
Creating nonideality: enabling mask cross-platform process matching solutions with MPC and a lot of hard work
Paper 11148-3
Author(s): Jed H. Rankin, GLOBALFOUNDRIES Inc. (United States); Ingo Bork, Peter Buck, Robin Chia, Bhardwaj S. Durvasula, Mentor, a Siemens Business (United States); Daniel M. Hill, GLOBALFOUNDRIES Inc. (United States); Gazi Huda, Ken Jantzen, Mentor, a Siemens Business (United States); Matthew Leuthold, GLOBALFOUNDRIES Inc. (United States); Jianliang Li, Joerg Mellmann, Kushlendra Mishra, Nageswara Rao, Malavika Sharma, Rachit Sharma, Mentor, a Siemens Business (United States); Adam C. Smith, Michaela Wentz, Charles Whiting, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Extending a multi-beam laser writer for optical and EUV masks
Paper 11148-4
Author(s): H. Christopher Hamaker, Applied Materials, Inc. (United States)
Show Abstract
Software-based optimization methods for the ULTRA semiconductor maskwriter
Paper 11148-5
Author(s): Alexander Forozan, Heidelberg Instruments Mikrotechnik GmbH (Germany)
Show Abstract
Lunch Break 12:20 PM - 1:50 PM
Session 4:
Deep Learning Mask Applications
Monday 16 September 2019
1:50 PM - 3:40 PM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Aki Fujimura, D2S, Inc. (United States) ;
Yuyang Sun, Mentor Graphics Corp. (United States)
Development of deep learning applications in holistic lithography (Invited Paper)
Paper 11148-6
Author(s): Yu Cao, ASML Brion (United States)
Show Abstract
Five deep learning recipes for the mask making industry
Paper 11148-7
Author(s): Ajay K. Baranwal, Mike Meyer, Suhas Pillai, Thang Nguyen, The Ctr. for Deep Learning in Electronics Manufacturing (United States); Noriaki Nakayamada, NuFlare Technology, Inc. (Japan); Mikael L. Wahlsten, Mycronic AB (Sweden); Aki Fujimura, Mariusz Niewczas, Michael Pomerantsev, D2S, Inc. (United States)
Show Abstract
Mask modeling using a Deep Learning Approach
Paper 11148-8
Author(s): Alex Zepka, Sabrina Aliyeva, Parikshit Kulkarni, Synopsys, Inc. (United States); Narendra Chaudhary, Texas A&M Univ. (United States)
Show Abstract
Making digital twins using the Deep Learning Kit (DLK)
Paper 11148-9
Author(s): Linyong Pang, Mariusz Niewczas, D2S, Inc. (United States); Mike Meyer, The Ctr. for Deep Learning in Electronics Manufacturing (United States); Ryan Pearman, Aki Fujimura, D2S, Inc. (United States)
Show Abstract
Loading effect correction set up by supplementing CD measurement analysis with machine learning
Paper 11148-10
Author(s): Christian Buergel, Martin Sczyrba, Clemens S. Utzny, Advanced Mask Technology Ctr. GmbH Co. KG (Germany)
Show Abstract
Selected Poster Speed Talks: Joint Session with conference 11147 and 11148
Monday 16 September 2019
4:00 PM - 5:50 PM
Location: Monterey Marriott, San Carlos Ballroom 4
Poster Session
Monday 16 September 2019
6:00 PM - 7:30 AM
Location: Monterey Marriott, San Carlos Ballroom 4

Symposium attendees are invited to attend the poster session on Monday evening in the Monterey Marriott, San Carlos 4, Mezzanine Level. Authors will be present during the poster reception for the from 6:00 pm to 7:30 pm to answer questions and provide in-depth discussion regarding their work.

Attendees are requested to wear their conference registration badges.
Investigation of reducing mask writing time with shot count management solution
Paper 11148-35
Author(s): ShiZhi Lyu, Mentor Graphics Shanghai Electronic Technology Co. (China)
Show Abstract
EUV mask defect printability simulations using S2A
Paper 11148-36
Author(s): Daeho Hwang, SK Hynix System ic Inc. (Korea, Republic of)
Show Abstract
Wafer alignment mark placement accuracy impact on the layer to layer overlay performance
Paper 11148-37
Author(s): Richard J. F. van Haren, ASML Netherlands B.V. (Netherlands)
Show Abstract
Lithography printability review: an essential application during mask making on advanced technology mask for enhancing mask yield and cycle time
Paper 11148-38
Author(s): Wen Jun Ling, De Jian Li, Xue Fei Qin, Fen Xue, Jie Wang, Cong Lu, Mingjing Tian, Ming Chen, Semiconductor Manufacturing International Corp. (China); Vikram L. Tolani, Gregg A. Inderhees, Yi Heng Chang, Alexander Tan, Suo Li, Xiao Di Liu, KLA Corp. (China)
Show Abstract
A model-based OPC method to add serifs for corner rounding design of CMOS image sensor
Paper 11148-39
Author(s): Zengzhi Huang, Lingyun Ni, Huaian Image Device Manufacturer Corp. (China); Koichi Fujii, Huaian Image Device Manufacturer Corp. (China), Imaging Device Technologies Corp. (Japan); Xiaolu Huang, Huaian Image Device Manufacturer Corp. (China)
Show Abstract
Strategy for the breakthrough of RLS trade-off relationship in the development of novel resist materials and a developer
Paper 11148-40
Author(s): Ayako Nakajima, Osaka Univ. (Japan); Manabu Hoshino, Kazunori Taguchi, Zeon Corp. (Japan); Takahiro Kozawa, Osaka Univ. (Japan)
Show Abstract
Fabrication of NIL template with multi-beam mask writer for DRAM and Logic application
Paper 11148-41
Author(s): Yasuhiro Okawa, Dai Nippon Printing Co., Ltd. (Japan)
Show Abstract
High temperature bake process study in advanced mask
Paper 11148-42
Author(s): Dejian Li, Semiconductor Manufacturing International Corp. (China)
Show Abstract
Low reflection phase shift mask blanks for high resolution flat panel displays
Paper 11148-43
Author(s): Narihiro Morosawa, Eiji Shiozaki, Kagehiro Kageyama, ULVAC Coating Corp. (Japan)
Show Abstract
A fast DFM-driven standard cell qualification approach for critical layers of 14nm technology node
Paper 11148-44
Author(s): Xiaojing Su, Yayi Wei, Rui Chen, Yajuan Su, Institute of Microelectronics, Chinese Academy of Sciences (China)
Show Abstract
CMP model guided dummy fill optimization
Paper 11148-45
Author(s): Liwei Jiang, Fang Wei, Jun Zhu, Yun Cao, Jiajia Li, Jiao Zhang, Shanghai Huali Microelectronics Corp. (China); Zhengfang Liu, Chunshan Du, Liguo Zhang, Mentor Graphics Shanghai Electronic Technology Co. (China); Ruben G. Ghulghazaryan, Mentor Graphics Corp. (Armenia); Qijian Wan, Xinyi Hu, Mentor Graphics Shanghai Electronic Technology Co. (China)
Show Abstract
Large dies stitching a technical and cross-functional teams challenge
Paper 11148-46
Author(s): Philippe Morey-Chaisemartin, Eric Beisser, Frederic Brault, Farid Benzakour, XYALIS (France)
Show Abstract
Exploring alternative EUV mask absorbers for iN5 self-aligned block and contact layers
Paper 11148-47
Author(s): Rajiv Sejpal, Mentor, a Siemens Business (United States); Vicky Philipsen, IMEC (Belgium); Ana Armeanu, Mentor Graphics (Ireland) Ltd. French Branch (France); Chih-I Wei, Mentor Graphics Corp. (Belgium); Neal V. Lafferty, Germain L. Fenger, Mentor, a Siemens Business (United States); Eric Hendrickx, Werner Gillijns, IMEC (Belgium)
Show Abstract
A study of curvilinear routing in IN5 standard cells: challenges and opportunities
Paper 11148-48
Author(s): Amit Dounde, Syed Muhammad Yasser Sherazi, Ryoung-Han R. Kim, Darko Trivkovic, Werner Gillijns, Youssef Drissi, IMEC (Belgium)
Show Abstract
Post draw or post OPC CMP assisted negative segments or dummy features to improve BEOL interconnects
Paper 11148-49
Author(s): Ping Shi, Guo Xiang Ning, Sunoo Kim, Paul W. Ackmann, Chin-Teong Lim, Ernesto G. de la Garza, Ushasree Katakamsetty, Jonathan Rullan, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
High throughput AFM inspection system with parallel active cantilevers
Paper 11148-50
Author(s): Mathias Holz, Christoph Reuter, Ahmad Ahmad, Alexander Reum, nano analytik GmbH (Germany); Tzvetan Ivanov, Martin Hofmann , Stephan Mechold, Ivo W. Rangelow, Technische Univ. Ilmenau (Germany)
Show Abstract
Atomic force microscope integrated into a scanning electron microscope for fabrication and metrology at the nanometer scale
Paper 11148-51
Author(s): Mathias Holz, Christoph Reuter, nano analytik GmbH (Germany); Martin Hofmann , Technische Univ. Ilmenau (Germany); Ahmad Ahmad, nano analytik GmbH (Germany); Stephan Mechold, Technische Univ. Ilmenau (Germany); Alexander Reum, nano analytik GmbH (Germany); Tzvetan Ivanov, Ivo W. Rangelow, Technische Univ. Ilmenau (Germany)
Show Abstract
193nm mask inspection challenges and approaches for 5nm technology and beyond
Paper 11148-52
Author(s): Ariel Shkalim, Evgeny Bal, Ronen Madmon, Alexander Chereshnya, Oren Cohen, Oded Dassa, Ori Petel, Boaz Cohen, Applied Materials Israel, Ltd. (Israel)
Show Abstract
Practical lithography hotspot identification using mask process model
Paper 11148-53
Author(s): Young M. Ham, Photronics, Inc. (United States)
Show Abstract
Characterization of quartz etched depth for the wafer CD behavior on advanced mask
Paper 11148-54
Author(s): Young M. Ham, Photronics, Inc. (United States)
Show Abstract
Growth mask formed by photolithography on a micro spherical lens
Paper 11148-55
Author(s): Liliia N. Dvoretckaia, St. Petersburg Academic Univ. (Russian Federation)
Show Abstract
Evaluation of neighborhood pattern matching algorithm in MPC processing
Paper 11148-56
Author(s): Kohei Yanagisawa, Kota Kobayashi, Kiyoshi Kageyama, Toppan Printing Co., Ltd. (Japan); Sebastian Munoz, Fabian Saso, Parikshit Kulkarni, John Valadez, Kokoro Kato, Synopsys, Inc. (United States)
Show Abstract
A case study of benefits for the "IOFF" MDP automation project: development, integration, and optimization of the Integrated-Optimized-Fracture-Flow (IOFF) into production
Paper 11148-57
Author(s): Hari Konnanur, Synopsys, Inc. (United States); Adam Smith, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
LDP EUV light source for mask inspection
Paper 11148-58
Author(s): Takahiro Shirai, Yoshihiko Sato, Hironobu Yabuta, Akihisa Nagano, Ushio Inc. (Japan); Yusuke Teramoto, BLV Licht-und Vakuumtechnik Gmbh (Germany)
Show Abstract
Development of an EUV and OoB neflectometer at NewSUBARU synchrotron light facility
Paper 11148-59
Author(s): Keisuke Tsuda, Tetsuo Harada, Takeo Watanabe, Univ. of Hyogo (Japan)
Show Abstract
Demonstrating the value of integrated reticle automation solutions in high volume wafer fab manufacturing
Paper 11148-60
Author(s): Chien Ming Wu, Chin Kuei Chang, United Semiconductor (Xiamen) Co., Ltd. (China); Wei Chen, KLA China (China); Donghwan Song, KLA Corp. (United States); Yousheng Yin, Jeffery Liang, Chia Ping Chen, United Semiconductor (Xiamen) Co., Ltd. (China); Jinghua Zeng, KLA China (China); Kunal Rohilla, Alexander Tan, KLA Corp. (United States); Steven Liu, KLA China (China)
Show Abstract
Theory of transformation-invariant compact process modeling
Paper 11148-61
Author(s): Yuri Granik, Mentor, a Siemens Business (United States)
Show Abstract
Evaluation Of local CD and placement distribution on EUV mask and its impact on wafer
Paper 11148-62
Author(s): Vidya Vaenkatesan, ASML Netherlands B.V. (Netherlands)
Show Abstract
Tuesday 17 September Show All Abstracts
Announcements
Tuesday 17 September 2019
8:00 AM - 8:10 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Session 5:
EUV Mask and Lithography Integration: Joint Session with conferences 11147 and 11148
Tuesday 17 September 2019
8:10 AM - 10:10 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Frank E. Abboud, Intel Corp. (United States) ;
Rik Jonckheere, IMEC (Belgium)
Advanced reticles for improved EUV imaging at low k1 (Invited Paper)
Paper 11147-11
Author(s): Claire van Lare, Frank J. Timmermans, Jo Finders, ASML Netherlands B.V. (Netherlands)
Show Abstract
The role of EPE in process definition (Invited Paper)
Paper 11148-11
Author(s): Robert M. Bigwood, Intel Corp. (United States)
Show Abstract
Improving exposure latitudes and aligning best focus through pitch by mitigating M3D effects with controlled aberrations
Paper 11147-12
Author(s): Joern-Holger Franke, Joost Bekaert, Victor M. Blanco Carballo, Lieve Van Look, IMEC (Belgium); Felix Wahlisch, Kateryna Lyakhova, Paul van Adrichem, Mark J. Maslow, Guido Schiffelers, ASML Netherlands B.V. (Netherlands); Eric Hendrickx, IMEC (Belgium)
Show Abstract
A portrait of the complex signature of EUV masks in the EUV imaging process
Paper 11147-13
Author(s): Renzo Capelli, Carl Zeiss SMT GmbH (Germany); Eelco van Setten, ASML Netherlands B.V. (Netherlands); Grizelda Kersteen, Walter Pauls, Carl Zeiss SMT GmbH (Germany); Natalia Davydova, Stan Peters, Guido Schiffelers, Mark van de Kerkhof, ASML Netherlands B.V. (Netherlands); Scott Chegwidden, Firoz Ghadiali, Intel Corp. (United States); John McNamara, Joost Gielis, ASML Netherlands B.V. (Netherlands)
Show Abstract
Evaluations of the impact of reticle measurement methods and reticle variability on mask proximity and optical proximity correction model accuracy
Paper 11148-12
Author(s): Thomas I. Wallow, Adam Lyons, Chris A. Spence, Chumeng Zheng, ASML San Jose (United States); Yohei Torigoe, Nippon Control System Corp. (Japan); Dai Tsunoda, Nippon Control System Corp. (United States); Brid Connoly, Toppan Photomasks, Inc. (Germany); Franklin D. Kalk, Toppan Photomasks, Inc. (United States); Christian Buergel, Markus Bender, Advanced Mask Technology Ctr. GmbH Co. KG (Germany)
Show Abstract
Session 6:
Mask Writer and Mask Process Correction (MPC)
Tuesday 17 September 2019
10:30 AM - 12:30 PM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chair:
Uwe F.W. Behringer, UBC Microelectronics (Germany)
Requirements of data technology for EUV photomask (Invited Paper)
Paper 11148-13
Author(s): Jin Choi, Jonggul Doh, Min Ah Kim, Chan-Uk Jeon, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Show Abstract
Resist-slope aware modeling for mask process correction applications
Paper 11148-14
Author(s): Rachit Sharma, Mentor Graphics (India) Private Ltd. (India); Ingo Bork, Mentor, a Siemens Business (United States); Kushlendra Mishra, Mentor Graphics (India) Private Ltd. (India); ShiZhi Lyu, Mentor Graphics Shanghai Electronic Technology Co. (China); Elena Cong, Mingjing Tian, Semiconductor Manufacturing International Corp. (China); Malavika Sharma, Bhardwaj S. Durvasula, Nageswara Rao, Mentor Graphics (India) Private Ltd. (India); Peter Buck, Mentor, a Siemens Business (United States)
Show Abstract
MPC simplification for established model-based mask process correction solutions
Paper 11148-15
Author(s): Gek Soon Chua, Weijie Lu, Yee Mei Foong, GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore); Wei-Long Wang, Todd Bailey, Paul W. Ackmann, Jed H. Rankin, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Multi-beam mask writer, MBM-1000
Paper 11148-16
Author(s): Hiroshi Matsumoto, Hayato Kimura, Noriaki Nakayamada, Kenji Ohtoshi, NuFlare Technology, Inc. (Japan)
Show Abstract
MBMW-201: most recent developments in multi-beam mask writing
Paper 11148-17
Author(s): Mathias Tomandl, Christof Klein, Hans Loeschner, Elmar Platzgummer, IMS Nanofabrication GmbH (Austria)
Show Abstract
Necessity is the mother of invention: support vector machines for CD control
Paper 11148-18
Author(s): Christian Buergel, Martin Sczyrba, Clemens S. Utzny, Advanced Mask Technology Ctr. GmbH Co. KG (Germany)
Show Abstract
Lunch Break 12:30 PM - 1:50 PM
Session 7:
Processing, Photoresist and NanoImprint Lithography
Tuesday 17 September 2019
1:50 PM - 3:30 PM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Thomas B. Faure, GLOBALFOUNDRIES Inc. (United States) ;
Shalini Sharma, JSR Micro, Inc. (United States)
Improving chip performance by photomask tuning: ultimate intra-field CD control as a major part of an overall excursion prevention strategy
Paper 11148-19
Author(s): Rolf Seltmann, RS Lithoconsult (Germany); Thomas Thamm, Aravind Narayana Samy, GLOBALFOUNDRIES Dresden Module Two, GmbH & Co. KG (Germany); Ofir Sharoni, Avi Cohen, Yael Sufrin, Thomas Scherübl, Carl Zeiss SMS Ltd. (Israel)
Show Abstract
Patterning, mask life and throughput improvements for high volume semiconductor manufacturing using nanoimprint lithography
Paper 11148-20
Author(s): Osamu Morimoto, Yukio Takabayashi, Keita Sakai, Takehiko Iwanaga, Canon Inc. (Japan); Wei Zhang, Byung Jin Choi, Douglas J. Resnick, Canon Nanotechnologies, Inc. (United States)
Show Abstract
Novel cleaning technology for nanoparticle removal
Paper 11148-21
Author(s): Mana Tanabe, Kosuke Takai, Kyo Otsubo, Kaori Umezawa, Minako Iinuma, Hideaki Sakurai, Shingo Kanamitsu, Toshiba Memory Corp. (Japan)
Show Abstract
Development of plasma etching process using machine learning: utilizing profile data and basic physical data in etching
Paper 11148-22
Author(s): Takeshi Ohmori, Hitachi, Ltd. (Japan)
Show Abstract
Photoresist development as a reaction-diffusion process
Paper 11148-23
Author(s): Gurdaman Khaira, Yuri Granik, Mentor, a Siemens Business (United States)
Show Abstract
Session 8:
Mask Data Prep MPD and Curvlinear Data Handling
Tuesday 17 September 2019
4:00 PM - 5:50 PM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Peter Buck, Mentor, a Siemens Business (United States) ;
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)
Machine Learning guided Curvilinear MPC (Invited Paper)
Paper 11148-24
Author(s): Malavika Sharma, Bhardwaj S. Durvasula, Nageswara Rao, Mentor Graphics (India) Private Ltd. (India); Ingo Bork, Mentor, a Siemens Business (United States); Rachit Sharma, Kushlendra Mishra, Mentor Graphics (India) Private Ltd. (India); Peter Buck, Mentor, a Siemens Business (United States)
Show Abstract
Computational lithographic challenges of curvilinear mask-making
Paper 11148-25
Author(s): Harsha Grunes, Intel Corp. (United States)
Show Abstract
Design to silicon flow challenges for silicon photonics
Paper 11148-26
Author(s): Ian Stobert, Karen Badger, GLOBALFOUNDRIES Inc. (United States); Gek Soon Chua, GLOBALFOUNDRIES Inc. (Singapore); Mohamed Gheith, Matthew Kinzler, Adam Smith, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Adopting curvilinear shapes for production ILT: challenges and opportunities
Paper 11148-27
Author(s): Ryan Pearman, P. Jeffrey Ungar, Nagesh Shirali, Mariusz Niewczas, Leo Pang, Aki Fujimura, D2S, Inc. (United States)
Show Abstract
Study of mask and wafer co-design that utilizes a new extreme SIMD approach to computing in memory manufacturing
Paper 11148-28
Author(s): Ezequiel V. Russell, Micron Technology, Inc. (United States); Linyong Pang, D2S, Inc. (United States); Bill Baggenstoss, Michael Lee, Jennefir Digaum, Ming-Chuan Yang, Micron Technology, Inc. (United States); P. Jeffrey Ungar, Kechang Wang, Bo Su, Ryan Pearman, Aki Fujimura, D2S, Inc. (United States)
Show Abstract
Wednesday 18 September Show All Abstracts
Announcements
Wednesday 18 September 2019
8:00 AM - 8:10 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Session 9:
EUV Blank and Films: Joint Session with conference 11147 and 11148
Wednesday 18 September 2019
8:10 AM - 10:00 AM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Onoue Takahiro, HOYA Corp. (Japan) ;
Ted Liang, Intel Corp. (United States)
Development of high-k alternative absorber material system for next generation EUV mask (Invited Paper)
Paper 11147-19
Author(s): Vibhu Jindal, Shuwei Liu, Kan Fu, Weimin Li, Wen Xiao, Sankesha Bhoyar, Abbas Rastegar, Madhavi Chandrachood, Applied Materials, Inc. (United States)
Show Abstract
Resolution enhancement technique options to enable 0.33 NA EUV single exposure via patterning for 3-nm generation of logic technology
Paper 11147-20
Author(s): Weimin Gao, ASML Intl. Trading Co., Ltd. (China)
Show Abstract
Interfacial quality of high-reflectivity Mo-Si multilayers for EUV mask blanks
Paper 11147-21
Author(s): Narasimhan Srinivasan, Katrina Rook, Veeco Instruments Inc. (United States); Kenji Yamamoto, Veeco Instruments Inc. (Japan); Vincent Ip, Tania Henry, Meng H. Lee, Veeco Instruments Inc. (United States)
Show Abstract
Examination of flatness key performance indicators for reticles in Next-Generation, High-NA EUV scanners
Paper 11148-29
Author(s): Katherine Ballman, Chris Lee, David L. Aronstein, Corning Inc. (United States)
Show Abstract
EUV mask polarization effects
Paper 11147-22
Author(s): Lilian Neim, Bruce Smith, Rochester Institute of Technology (United States)
Show Abstract
Session 10:
EUV Defects, Inspection and Characterization: Joint Session with conferences 11147 and 11148
Wednesday 18 September 2019
10:30 AM - 12:20 PM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Thomas Scherübl, Carl Zeiss SMS Ltd. (Israel) ;
Vibhu Jindal, Applied Materials, Inc. (United States)
Stochastic printing behavior of ML-defects on EUV mask (Invited Paper)
Paper 11147-23
Author(s): Rik Jonckheere, IMEC (Belgium); Lawrence S. Melvin, Synopsys, Inc. (United States)
Show Abstract
Actinic patterned mask defect inspection for EUV lithography
Paper 11148-30
Author(s): Hiroki Miyai, Tsunehito Kohyama, Tomohiro Suzuki, Kiwamu Takehisa, Hirokazu Seki, Koichi Moriizumi, Haruhiko Kusunose, Lasertec Corp. (Japan)
Show Abstract
Capability of DUV inspection for the LWR improved EUV mask of sub-15 nm hp on wafer
Paper 11148-31
Author(s): Masato Naka, Keisuke Chiba, Ai Kumada, Keiko Morishita, Kosuke Takai, Takashi Kamo, Eishi Shiobara, Shingo Kanamitsu, Toshiba Memory Corp. (Japan)
Show Abstract
Expanding the capabilities of the SHARP EUV mask microscope
Paper 11147-24
Author(s): Markus P. Benk, Ryan Miyakawa, Weilun Chao, Patrick Naulleau, Lawrence Berkeley National Lab. (United States)
Show Abstract
EUV reticle inspection using phase retrieval algorithms: a performance comparison
Paper 11147-25
Author(s): Ricarda Nebling, Iacopo Mochi, Dimitrios Kazazis, Uldis Locans, Atoosa Dejkameh, Yasin Ekinci, Paul Scherrer Institut (Switzerland)
Show Abstract
Lunch Break 12:20 PM - 1:40 PM
Session 11:
EUV Pellicle: Joint Session with conferences 11147 and 11148
Wednesday 18 September 2019
1:40 PM - 3:30 PM
Location: Monterey Conf. Ctr., Steinbeck 2
Session Chairs:
Emily E. Gallagher, IMEC (Belgium) ;
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)
To pellicle or not to pellicle: is that really the question? (Invited Paper)
Paper 11148-32
Author(s): Michael J. Lercel, ASML Fishkill (United States); Christophe Smeets, Mark A. van de Kerkhof, Tjarko van Empel, Vadim Banine, Christian Cloin, Amo Chen, ASML Netherlands B.V. (Netherlands)
Show Abstract
CNT EUV pellicle: balancing options
Paper 11148-33
Author(s): Emily E. Gallagher, Ivan Pollentier, Marina Y. Timmermans, IMEC (Belgium); Marina Mariano Juste, KU Leuven (Belgium); Cedric Huyghebaert, IMEC (Belgium)
Show Abstract
Particle on EUV pellicle printability: how clean is clean enough from an imaging perspective?
Paper 11147-26
Author(s): Michiel Kupers, Gijsbert Rispens, Lokesh Devaraj, Gerardo Bottiglieri, Twan van den Hoogenhoff, Par Broman, ASML Netherlands B.V. (Netherlands); Andreas Erdmann, Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany); Felix Wahlisch, ASML Netherlands B.V. (Netherlands)
Show Abstract
Standalone tools for actinic EUV pellicle qualification
Paper 11147-27
Author(s): Rainer Lebert, Andreas Biermanns-Föth, Christian Pampfer, Christoph Phiesel, Thomas Missalla, Jennifer Arps, Gordon Staab, Christian Piel, RI Research Instruments GmbH (Germany)
Show Abstract
EUV pelllicle durability comparison for better lifetime
Paper 11147-28
Author(s): HyoGyeong Shin, Hye-Keun Oh, Hanyang Univ. (Korea, Republic of)
Show Abstract
Session 12:
Panel Discussion: Mask Ecosystem for Low-k1 EUV Manufacturing: Beyond First Generation EUV Single Patterning
Wednesday 18 September 2019
4:00 PM - 6:00 PM
Location: Monterey Conf. Ctr., Steinbeck 2

2019 is clearly the year when EUV has entered high volume manufacturing (HVM). A viable mask infrastructure for this first generation of EUV is, by definition, in place now. While some elements of the existing infrastructure may be less than optimal, they have not prevented EUV from being adopted in production.

The panel of industry experts will focus on subsequent generations of EUV and will highlight areas where infrastructure improvement would be beneficial. Each panelist will offer a brief expert opinion of their views defining what they consider to be the major challenges to be addressed and when (or if) they will become critical items. Topics may cover any area of mask manufacturing and use including mask blanks, films, processes, materials, inspection, storage, and particle and contamination control. The goal of the panel session is to promote wide ranging discussion between fabs, mask shops, suppliers and researchers to exchange opinions and identify key areas for future development activity.
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