2-µm ultrafast fiber CPA for industrial-grade silicon processing

This laser emits a central wavelength of 2 µm and boasts impressive capabilities: pulse energies exceeding 100 µJ and an average power output surpassing 15 W at less than 400fs pulse duration. Designed for longevity, it is tailored for industrial applications, seamlessly integrating into laser machines used for materials processing. The laser’s parameters are particularly well-suited for working with semiconductors like silicon. It enables essential tasks such as microwelding or precision cutting of filaments.