SPIE LASE is the most important laser technologies conference in the field. Topics include laser manufacturing, laser materials processing, micro-nano packaging, fiber, diode, solid state lasers, laser resonators, ultrafast, semiconductor lasers and LEDs, and 3D fabrication technologies.
Present your research at LASE 2022. The Call for Papers will open in May 2021 and submissions will be due in August. We look forward to gathering safely with everyone 22-27 January 2022 in San Francisco.
Akihiko Kasukawa, Furukawa Electric Co. (Japan)
John Ballato, Clemson Univ. (United States)
Nonlinear Optics and Beam Guiding
Vladimir Ilchenko, GM Cruise LLC (United States)
Paul O. Leisher, Freedom Photonics, LLC (United States)
Henry Helvajian, The Aerospace Corp. (United States)
Guido Hennig, Daetwyler Graphics AG (Switzerland)
Bo Gu, Bos Photonics (United States)
Stefan Kaierle, Laser Zentrum Hannover e.V. (Germany)