Call for papers is open!
Abstracts due 17 July
>
25 - 30 January 2025
San Francisco, California, US
Optical components are crucial for laser performance and form a foundation for advances in laser science and technology. All around the globe, vast and constantly growing research efforts are dedicated to developing new and more advanced laser components and systems. Along this line, packaging solutions for optical components enable their most efficient and reliable integration in laser systems and photonics integrated circuits (PIC). This conference is dedicated to recent achievements and progress made in the field of optical components for lasers, laser systems, and PICs as well as the corresponding packaging solutions.

COMPONENTS AND PACKAGING FOR HIGH POWER/ENERGY LASERS
COMPONENTS AND PACKAGING FOR LASER BEAM ENGINEERING
LASER DIODE COMPONENTS AND PACKAGING TECHNOLOGIES
PHOTONICS INTEGRATED CIRCUITS PACKAGING
ADVANCED LASER PACKAGING SOLUTIONS
OPTICS ASSEMBLY AND RELIABILITY ;
In progress – view active session
Conference LA104

Components and Packaging for Laser Systems XI

This conference has an open call for papers:
Abstract Due: 17 July 2024
Author Notification: 7 October 2024
Manuscript Due: 8 January 2025
Optical components are crucial for laser performance and form a foundation for advances in laser science and technology. All around the globe, vast and constantly growing research efforts are dedicated to developing new and more advanced laser components and systems. Along this line, packaging solutions for optical components enable their most efficient and reliable integration in laser systems and photonics integrated circuits (PIC). This conference is dedicated to recent achievements and progress made in the field of optical components for lasers, laser systems, and PICs as well as the corresponding packaging solutions.

COMPONENTS AND PACKAGING FOR HIGH POWER/ENERGY LASERS
  • high-power and high-energy beam delivery components
  • packaging technologies for high-power lasers
  • ultra-short pulsed (USP) laser components and their integration
  • components for coherent and spectral beam combining
  • fiber bundles for beam combining
  • high laser-induced damage threshold (LIDT) materials and components
  • AR coating of components for high-power laser applications
  • advanced cooling components and solutions
  • thermal management of high-power lasers.

COMPONENTS AND PACKAGING FOR LASER BEAM ENGINEERING
  • diffractive optical elements (DOE) and holographic optical elements (HOE)
  • lenses and lens arrays
  • grating components for lasers: volume Bragg gratings, fiber Bragg gratings, blazed gratings, holographic phase gratings, and others
  • 2 micron and mid-IR optical components and packaging
  • frequency generation components: components integrating nonlinear optics and novel optical designs for SHG, THG, OPG, Raman shift, etc.
  • polarization optics, isolators, couplers, splitters, etc.

LASER DIODE COMPONENTS AND PACKAGING TECHNOLOGIES
  • thermal and structural management of high-power laser diodes
  • fiber coupling solutions and optics
  • beam-transforming components for laser diode arrays
  • wavelength locking and stabilization techniques and components
  • materials for component attachment (epoxies, solders, etc.)
  • novel active and passive alignment techniques for LDs.

PHOTONICS INTEGRATED CIRCUITS PACKAGING
  • packaging of integrated photonic modules for advanced applications in sensing, datacom, health, and quantum
  • approaches and methodologies for efficient optical coupling from chip to chip and from chip to fiber
  • scalable manufacturing processes for optical coupling
  • integrated Photonic modules with electrical high bandwidth
  • thermal management of integrated photonic modules
  • hybrid / heterogenous integration of InP on silicon photonics.

ADVANCED LASER PACKAGING SOLUTIONS
  • packaging and component solutions for LIDARs and sensors
  • advanced optical components enabling Quantum Computing
  • interface materials and packaging solutions with low thermal impedance
  • optical components for laser fusion
  • space qualification of laser components
  • materials for advanced packaging solutions
  • green packaging solutions to reducing greenhouse gas footprint.

OPTICS ASSEMBLY AND RELIABILITY
  • packaging, assembly, and mounting solutions of optical components in laser systems
  • reliability of laser systems
  • process automation and optical component alignment techniques
  • novel materials for optical components (high index glasses, polymers, diamond, etc.).
  • direct writing of optics and photonics wire bonding
  • modeling and design of laser packaging.
Conference Chair
OptiGrate – IPG Photonics (United States)
Conference Chair
ThinkMade Engineering & Consulting (Germany)
Conference Chair
PHIX Photonics Assembly (United States)
Program Committee
BWT Laser Europe GmbH (Germany)
Program Committee
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM (Germany)
Program Committee
Institut d'Optique Graduate School (France)
Program Committee
CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
Program Committee
FISBA AG (Switzerland)
Program Committee
TOPTICA eagleyard (Germany)
Program Committee
Freedom Photonics, LLC (United States)
Program Committee
Avo Photonics, Inc. (United States)
Program Committee
C-Speed (United States)
Program Committee
Focuslight Technologies, Inc. (China)
Program Committee
PANOPTICS Corp. (Korea, Republic of)
Program Committee
Luminar Technologies, Inc. (United States)
Program Committee
NKT Photonics A/S (Denmark)
Program Committee
Fibertek, Inc. (United States)
Program Committee
Edmund Optics Inc. (United States)