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Optical components are crucial for laser performance and form a foundation for advances in laser science and technology. All around the globe, vast and constantly growing research efforts are dedicated to developing new and more advanced laser components and systems. Along this line, packaging solutions for optical components enable their most efficient and consistent integration in laser systems. Laser component packaging is decisive for stable and reliable laser operations while not only improving laser characteristics but also enabling broader laser usability and applications.

This conference is dedicated to recent achievements and progress made in the field of optical components for lasers and laser systems as well as laser packaging solutions. A wide range of topics covers a variety of laser components and packaging technologies for semiconductor lasers, solid state lasers, fiber lasers, gas lasers, CW and pulsed lasers, ultra-short pulsed lasers, and others.

In progress – view active session
Conference 11982

Components and Packaging for Laser Systems VIII

24 - 25 January 2022 | Room 205 MonAM; Room 202 MonPM-Tue
View Session ∨
  • 1: Advanced Packaging Solutions for Laser Diodes: Joint Session with Conferences 11982 and 11983
  • 2: Laser Sources for LIDAR: Joint Session with 11982 and 11983
  • 3: Mid-IR Laser Components
  • LASE Plenary and Hot Topics
  • 4: Laser Diode Packaging I
  • 5: Laser Diode Packaging II
  • 6: High Power/Energy Laser Components I
  • 7: High Power/Energy Laser Components II
  • Posters-Tuesday

Presentation times are finalized; please adhere to the schedule

Session 1: Advanced Packaging Solutions for Laser Diodes: Joint Session with Conferences 11982 and 11983
24 January 2022 • 10:20 AM - 10:40 AM PST | Room 205 (Level 2 South)
Session Chairs: Paul O. Leisher, Freedom Photonics, LLC (United States), Robert Martinsen, nLIGHT, Inc. (United States)
Author(s): Chun He, Wenwei Li, Ke Yuan, Tuanwei Fu, Jindou Liu, Chung-en Zah, Focuslight Technologies (China)
24 January 2022 • 10:20 AM - 10:40 AM PST | Room 205 (Level 2 South)
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We report the latest development of a high power conductively cooled laser module using a novel design approach. The laser bar is directly bonded to two heatsinks in a sandwich configuration without employing submounts as buffers for stress relief caused by CTE mismatch. Simulations were performed to aid the laser module design. The accuracy of the simulations was verified by experimental tests on the laser modules. Production data were collected and used to determine the key performance parameters, statistical distribution, lifetime, and failure mechanism. The laser module thermal rollover could reach 480W at 500A drive current under CW running mode. Furthermore, it could continuously operate under a harsh-hard pulse driving condition at 300A drive current with 300ms pulse width and 1Hz repetition rate.
Session 2: Laser Sources for LIDAR: Joint Session with 11982 and 11983
24 January 2022 • 10:40 AM - 12:00 PM PST | Room 205 (Level 2 South)
Session Chairs: Alexei L. Glebov, OptiGrate Corp. (United States), Erik Zucker, Erik Zucker Consulting (United States)
Author(s): Evan R. Hale, Moran Chen, Bruce McIntosh, Joe Hansell, Khoa Le, Slava Litvinovitch, Nicholas Sawruk, Fibertek, Inc. (United States)
24 January 2022 • 10:40 AM - 11:00 AM PST | Room 205 (Level 2 South)
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A compact, lightweight, laser transmitter using space-qualified heritage oscillator from the currently on-orbit ICESat-2 transmitter was built and tested. The Nd:YVO4 oscillator’s cavity length was reduced by 30% and achieved an intermediate 1064 nm energy of ~180 µJ. Final 532 nm output performance after external cavity frequency doubling and beam shaping showed pulse energies >80 µJ and pulse widths < 1 ns. The system was engineered and packaged for an overall dimension of 5.4” L x 3.1” W x 4.1” H and a total mass <1.5 kg. The laser housing and optics were hermetically sealed for contamination control to reduce laser damage and improve reliability. Environmental testing was done, and this packaging design is intended for future space-qualified operation.
Author(s): Paul O. Leisher, Jenna Campbell, Michelle Labrecque, Kevin McClune, Elliot Burke, Daniel Renner, Leif Johansson, Milan Mashanovitch, Freedom Photonics, LLC (United States)
24 January 2022 • 11:00 AM - 11:20 AM PST | Room 205 (Level 2 South)
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Recent advancements in diffraction-limited output from tapered diode laser amplifiers represent a disruptive technology breakthrough that is poised to revolutionize the LIDAR market. Output powers which were previously only achievable using doped fiber, glass, or crystal laser architectures are now possible directly from the semiconductor chip. For example, diffraction-limited an output power of just a few watts at 1550 nm is sufficient for continuous wave frequency modulated (FMCW) automotive LIDAR. We report here a new world record of >3.0 W output power with nearly diffraction-limited beam quality (M^2 ~1.2) from a 1550 nm tapered diode laser amplifier; this source is suitable for direct use in numerous LIDAR and remote sensing applications.
Author(s): Sidi Aboujja, Daniel Chu, David Bean, SemiNex Corp. (United States)
24 January 2022 • 11:20 AM - 11:40 AM PST | Room 205 (Level 2 South)
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We present a triple junction high power laser diode at 1550nm based on AlInGaAs/InP material systems. The edge-emitting monolithic structure with tunnel junction layers is designed to reduce stress and improve heat dissipation. Each tunnel junction is formed with an n-type InGaAs layer and a p-type InGaAs layer. The device achieves over 100W peak optical power at 100A, three times more than a single junction laser, at 1W/A slope efficiency with 10 nsec pulse width. In long range LiDAR benchmark, by considering eye safety standards, distance, target reflectivity, and atmospheric loss, with 80 times more in photon budget a 1550nm triple junction can outperform 905nm by 60 times in SNR and 24 times in detection probability at a distance more than 200m.
Author(s): Topi Uusitalo, Jukka Viheriälä, Heikki Virtanen, Santeri Hanhinen, Roosa Hytönen, Jari Lyytikäinen, Mircea Guina, Tampere Univ. (Finland)
24 January 2022 • 11:40 AM - 12:00 PM PST | Room 205 (Level 2 South)
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High peak power and brightness eye-safe lasers are desired in automotive LIDAR, for example. We address this need by developing tapered ridge waveguide lasers with highly asymmetric InGaAsP/InP epilayer emitting at around 1.5 µm wavelength. The structure allows state-of-the-art peak power of 7.3 W at 50 A current. Preliminary beam quality results indicate that the epi-design enables higher beam brightness than more traditional structures when driven with high amplitude current pulses. Results indicate that further improvements in power and brightness characteristics are possible with more optimized cavity layout and laser driver design.
Lunch Break 12:00 PM - 2:20 PM
Session 3: Mid-IR Laser Components
24 January 2022 • 2:20 PM - 3:00 PM PST | Room 202 (Level 2 South)
Session Chair: Nicholas W. Sawruk, Fibertek, Inc. (United States)
Author(s): Pierre Vernaz-Gris, Siddharth Sivankutty, Olivier Pinel, Guillaume Labroille, Tangi Le Guennic, Pu Jian, CAILabs (France); Gregory Maisons, Johan Abautret, Fahem Boulila, Matthieu Carras, mirSense (France); Jean-François Morizur, CAILabs (France)
24 January 2022 • 2:20 PM - 2:40 PM PST | Room 202 (Level 2 South)
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The ability to combine incoherent sources with attractive performances enable hardware integration issues to be resolved using stable, good quality off-the-shelf components. Some new generation imaging systems can be found in the mid-infrared (MIR). The most portable laser technology at this range, our Quantum Cascade Laser source can provide light power of around 2 W, industrial grade. With the Multi-plane Light Conversion technique and a modal approach, we present non-coherent beam combiner for QCL with optimal beam quality, demonstrating the state of the art in terms of M2.
Author(s): Doug Crane, Robert Madigan, Lon Bell, DTP Thermoelectrics, LLC (United States)
24 January 2022 • 2:40 PM - 3:00 PM PST | Room 202 (Level 2 South)
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Thermoelectric (TE) coolers are solid-state heat pump systems with no moving parts that directly use electric power to cool. Benefits are small size, light weight, low cost, vibration-free operation, excellent durability, and reliability. Conventional TE (CTE) systems have limited capability to cool quantum infrared detectors because of insufficient cooling capacity and inability to achieve low operating temperatures required by high performance systems. The capabilities of TE systems are significantly improved by using Distributed Transport Properties technology, which has the potential to make practical inexpensive, light weight and reliable cooling systems and enable a new class of deep cooled infrared sensors.
Coffee Break 3:00 PM - 3:30 PM
LASE Plenary and Hot Topics
24 January 2022 • 3:30 PM - 6:00 PM PST | Room 207/215 (Level 2 South)
3:30 PM - 3:35 PM: Welcome and Opening Remarks
Craig B. Arnold, Princeton Univ. (United States)

3:35 PM - 3:40 PM: Special Announcement from SPIE
Author(s): Tammy Ma, Lawrence Livermore National Lab. (United States)
24 January 2022 • 3:45 PM - 4:25 PM PST | Room 207/215 (Level 2 South)
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This past August, a record-breaking shot with 1.3 megajoules of fusion yield was achieved on the National Ignition Facility (NIF) at Lawrence Livermore National Laboratory. This experimental result, decades in the making, is a significant breakthrough for laser-driven inertial fusion. This talk will review the experimental results, the photonics advancements and many more technologies that made this breakthrough possible, and the implications for future research. Furthermore, these recent game-changing results on the NIF now lay the groundwork to explore laser inertial fusion as a path for clean energy and energy security.
Author(s): Clara J. Saraceno, Ruhr-Univ. Bochum (Germany)
24 January 2022 • 4:20 PM - 4:40 PM PST | Room 207/215 (Level 2 South)
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High-power ultrafast laser technology has seen extremely fast-paced progress in the last decades, giving momentum to many fields. Nowadays, laser systems delivering hundreds of watts to kilowatts of average power with pulse energies ranging from microjoules to hundreds of millijoules become increasingly available, based on fiber, slabs and disk laser geometries. In this talk, we will discuss a recent hot topic enabled by progress in high-power ultrafast laser sources, that is the demonstration of table-top sources of few-cycle THz radiation with extremely high average power – reaching a performance level which was so far restricted to accelerator facilities. We will discuss new possibilities opened by these unique sources both in research and applied fields.
Author(s): Michael Kues, Leibniz Univ. Hannover (Germany)
24 January 2022 • 4:40 PM - 5:20 PM PST | Room 207/215 (Level 2 South)
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Today’s quantum technology relies on the realization of large-scale non-classical systems in practical formats to enable quantum-accelerated computing, secure communications and enhanced sensing. Optical on-chip quantum frequency combs, characterized by many equidistantly spaced frequency modes, allow the storage of large amounts of quantum information. The combination with control techniques, using accessible state-of-the-art telecommunications infrastructure, can constitute a powerful frequency-domain quantum circuit with new functionalities and represents an approach towards realizing practical large-scale controllable quantum systems. In this presentation, we will review approaches for the efficient realization of quantum frequency combs in on-chip waveguide structures and micro-resonators. We will show their applicability for the realization of quantum systems with considerably enhanced complexity, particularly generating and manipulating on-chip multi-photon and high-dimensional quantum states as well as discrete high-dimensional cluster states, laying at the basis of measurement based-quantum computing. Building on this, the realization of frequency-domain Hong-Ou-Mandel interference of independent photons, fundamental to quantum information processing, as well as an outlook on frequency-domain circuits will be discussed.
Author(s): Jennifer A. Dionne, Stanford Univ. (United States)
24 January 2022 • 5:20 PM - 5:40 PM PST | Room 207/215 (Level 2 South)
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We present a new platform for sensitive molecular detection and control spanning 1) multiplexed genetic and proteomic screening, 2) single-cellular bacterial identification and drug susceptibility testing, and 3) chiral molecular synthesis and separation, based on high-quality-factor phase gradient metasurfaces. The high-quality factor of our metasurfaces produces a large amplification of the electromagnetic field, increasing the response to targeted binding of biomarkers. Simultaneously, the optical signal is beam-steered for multiplexed detection. We develop these metasurfaces for a new respiratory panel of SARS-CoV-2, RSV, and influenza; Raman-based identification and antibiotic susceptibility testing of pathogens; and sensitive identification and purification of chiral molecules including amino acids and small-molecule pharmaceuticals and agrochemicals.
Author(s): Andrés Fabián Lasagni, TU Dresden (Germany), Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS (Germany)
24 January 2022 • 5:40 PM - 6:00 PM PST | Room 207/215 (Level 2 South)
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Laser-microtextured surfaces have gained an increasing interest due to their enormous spectrum of applications and industrial scalability. In this frame, several research studies have demonstrated how laser-based fabrication methods can be used to produce functional surfaces. Furthermore, it has been demonstrated is many cases, that the combination of structures with feature sizes in different ranges (e.g., microelements decorated with nanostructures) can not only further enhanced specific functions but also to provide surfaces with several functionalities. In this context, this talk shows how Direct Laser Interference Patterning (DLIP), Direct Laser Writing (DLW) and Laser Induced Periodic Surface Structures (LIPSS) can be combined, reaching advanced functionalities on technological relevant materials.
Session 4: Laser Diode Packaging I
25 January 2022 • 9:00 AM - 10:00 AM PST | Room 202 (Level 2 South)
Session Chairs: Jens Biesenbach, BWT Laser Europe GmbH (Germany), Jenna Campbell, Freedom Photonics, LLC (United States)
Author(s): Francisco Villarreal, Bien Chann, Fernando Monjardin, Christopher Halle, Michael Denninger, Myrna Reyes, Shinya Domoto, Bryan Lochman, TeraDiode, Inc. (United States)
25 January 2022 • 9:00 AM - 9:20 AM PST | Room 202 (Level 2 South)
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High Power Diode Laser Bars serve as the foundation for many high-power laser systems used in manufacturing and research. Efficient heat removal is essential for reducing cost per watt by increasing available output power or extending the effective lifetime of these devices. In this paper we will introduce a novel method for electrically isolated water impingement cooling of high-power diode laser bars operating in the 975nm region. We will present results from 58 emitter diode laser bars operating in the 975nm region with CW output power levels exceeding 500W and a thermal resistivity of less than 0.12 K/W.
CANCELED: PIC packaging challenges
25 January 2022 • 9:20 AM - 9:40 AM PST | Room 202 (Level 2 South)
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Integrating Photonic Integrated Circuits (PIC) with laser sources and optical fiber arrays poses significant assembly challenges in the Photonics industry. Assembly tolerance stackups often demand active alignment procedures. Design for manufacturing of these integrated PIC systems involves careful tolerance analysis to minimize the number of active alignment steps. Issues of chip smile and pitch sensitivity as well as techniques to correct for alignment shifts will be addressed.
Author(s): Dirk Hauschild, LIMO GmbH (Germany)
25 January 2022 • 9:40 AM - 10:00 AM PST | Room 202 (Level 2 South)
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Industrial laser processes are innovative for specific tasks but not scalable to become the major material processing technology in industry. To overcome this limitation, the productivity and related laser power have to be scaled by combining several laser sources using compact beam combining and beam shaping optical systems that keep the resulting brightness on a high level using a compact opto-mechanical design to be compatible with existing machine concepts. The use of micro-optical systems for beam combining multi kilowatt laser sources is a new solution to bring the laser technology into new applications and industries.
Coffee Break 10:00 AM - 10:30 AM
Session 5: Laser Diode Packaging II
25 January 2022 • 10:30 AM - 12:10 PM PST | Room 202 (Level 2 South)
Session Chairs: Joseph L. Dallas, Avo Photonics, Inc. (United States), Chung-en Zah, Focuslight Technologies, Inc. (United States)
Author(s): Sven Mahnkopf, Avo Photonics, Inc. (United States); Andrea Giudice, Alessandro Ruggeri, Micro Photon Devices S.r.l. (Italy); David Demmer, Avo Photonics, Inc. (United States)
25 January 2022 • 10:30 AM - 10:50 AM PST | Room 202 (Level 2 South)
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New time-correlated single photon counting (TCSPC) applications, like non-line-of-sight imaging, require a new generation of single photon avalanche diodes (SPAD) characterized by an instrument response function (IRF) having not only a narrow peak (< 100 ps FWHM) but also a very fast tail (~75 ps decay time). With such devices it is thus possible to detect two optical pulses as close as 200 ps in time, even if the second one is 2 orders of magnitude weaker than the first one. Such secondary peaks in the TCSPC histogram, can also be caused by reflections from internal optical surfaces of the optoelectronic assembly in which SPADs are mounted and thus are consequently undesirable. Options to mitigate these reflections or reduce the time of flight inside the assembly while not compromising photon detection efficiencies over a wide wavelength range are discussed.
Author(s): Dirk Hauschild, LIMO GmbH (Germany)
25 January 2022 • 10:50 AM - 11:10 AM PST | Room 202 (Level 2 South)
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To make use of all advantages of diode laser sources in industry, telecom and consumer applications the characteristics of the emitters have to be transformed into the beam shape or mode distribution that give the best compatibility with the individual applications in compact, integrated devices and packages. The use of multi-functional optics with several optical elements in one building block gives maximum functionality per device. The use of anamorphic mode-matching optical components produced on wafer level made of glass or silicon is a new solution that can match optical and economic challenges with only micro-optical element.
Author(s): Martin Forrer, Eckhard Langenbach, Andreas Kunz, Aline Dotta, Hans Forrer, Rita Schlaginhaufen, Bernd Granzin, FISBA AG (Switzerland)
25 January 2022 • 11:10 AM - 11:30 AM PST | Room 202 (Level 2 South)
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Laser-line generators, known as Powell lenses are used in laser materials processing and optical metrology, among other applications. Powell lenses fan a collimated light beam in one direction in such a way that a linear rectangular distribution ("top hat") results in the far field. While such elements can be well analyzed and optimized with ray-optical calculations for long lines, the wave nature of the light has to be considered for short lines. Calculation methods based on both approaches are presented and it is investigated for which line lengths which method is suitable Relevant results for lenses produced by glass precision molding are presented.
Author(s): Aleksandr I. Ryasnyanskiy, Vadim Smirnov, Ruslan Vasilyeu, Alexei Glebov, OptiGrate Corp. (United States)
25 January 2022 • 11:30 AM - 11:50 AM PST | Room 202 (Level 2 South)
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We present the results of the new application of the Transverse chirp Bragg Grating (TCBG) for development of the linewidth tunable diode laser at 976 nm. The main advantage of this method is that a simple rotation of TCBG allows continuous tuning of emission linewidth with a maximum span determined by the chirp rate of the grating. Thus, the tunability range from several hundreds of picometer to several nanometers can be achieved.
Author(s): Carles Oriach-Font, Eduard Carbonell Sanromà, Gemma Safont-Camprubí, Sandra Tricas-Mendoza, Clàudia Garcia-Cubero, MONOCROM S.L. (Spain)
25 January 2022 • 11:50 AM - 12:10 PM PST | Room 202 (Level 2 South)
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Variation of lasing wavelength with temperature is a key factor to determine packaging thermal resistance in laser diodes. Using proprietary mounting technology that clamps laser bars instead of using soldering material we can precisely control the stress applied on the laser bars. We experimentally demonstrate that uniaxial stress in the normal direction of the p-n junction (which results in tensile stress in the lattice) increases the temperature characteristic of laser diodes. We report a temperature characteristic raise between 10% and 50% under different stress conditions.
Lunch/Exhibition Break 12:10 PM - 2:00 PM
Session 6: High Power/Energy Laser Components I
25 January 2022 • 2:00 PM - 3:00 PM PST | Room 202 (Level 2 South)
Session Chair: Martin Forrer, FISBA AG (Switzerland)
Author(s): Bertrand Denolle, Claire Autebert, Avinash Kumar, Aymeric Lucas, Guillaume Labroille, Jean-François Morizur, Tangi Le Guennic, Pu Jian, CAILabs (France); François Gustave, Lombard Laurent, Pierre Bourdon, Anasthase Limery, ONERA (France)
25 January 2022 • 2:00 PM - 2:20 PM PST | Room 202 (Level 2 South)
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Incoherent beam combination consists of superposing several laser beams on a target. This technique is relatively simple to implement and uses "off-the-shelf" optical components, without active control of the phase or polarization of the input sources. With the Multi-plane Light Conversion (MPLC) technique, tailored and multi-reflective phase element, enabling to obtain an optimal beam quality in terms of divergence for a given number of input beams, we present non-coherent beam combiner of 4 Fibered high power input beams at 1µm with a total M² close to 2,5 and a combining efficiency around 92%.
Author(s): David C. Brown, Nicholas S. Tomasello, James Cioffi, Christopher L. Hancock, Denis F. Nakazawa, Advanced Photonic Sciences, LLC (United States)
25 January 2022 • 2:20 PM - 2:40 PM PST | Room 202 (Level 2 South)
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We have developed a novel small SmartLaserTM plug and play laser module that can be employed to house and power most CW semiconductor diode lasers and small TO type diode-pumped solid-state lasers offered by Advanced Photonic Sciences (APS). We will describe the results of our innovative laser engineering efforts that has resulted in the first smart laser micro-module, that is fully connected to the internet through a dongle that incorporates an RF link, A-D converters, and enables live-streamed output. We believe that this new product is the first to offer full internet connectivity, and the ability to remotely monitor laser behavior.
Author(s): Nasir Merchant, Richard DeLuca, Michael Gentile, Sandeep Kohli, Katy Zadrovicz, Michael Albrecht, Zygo Corporation, AMETEK, Inc. (United States)
25 January 2022 • 2:40 PM - 3:00 PM PST | Room 202 (Level 2 South)
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The ability to coat highly transparent anti-reflection (AR) coatings on plano and curved surfaces is critical to ultraviolet (UV) and deep-ultraviolet (DUV) lithography and high-powered laser applications. Some applications require coatings with low optical losses and high laser induced damage threshold. Under the influence of irradiated laser light, AR coatings typically damage at the substrate and coating interface. In the case high-reflector (HR) coatings, defects at the layer boundaries within the coating play a major role in laser damage. The substrate preparation methods, in addition to coating defects, play a significant role in laser resistance of AR coatings. Oxides of hafnium and aluminum (HfO2, Al2O3) are frequently used high-index material for 248 nm coatings, while silicon dioxide and magnesium fluoride are used as low index materials. Al2O3 is not an optimal choice with low index materials due to the index contrast, but is useful for DUV broadband coatings due to lower absorption down to 200 nm. Results from electron beam (e-beam) evaporated Al2O3/ MgF2 multi-layered anti-reflection coatings are presented. Coatings were deposited onto large, fused silica substrates with plano and various complex curved geometries. Layer thickness uniformities were less than 1.0%. Single side reflection of 0.1% to 1.0% from 0 to 49 degrees angles of incidence (AOI) were achieved. Laser damage threshold was 4 to 7 J/cm² at 248 nm and 20 ns pulse width. These results were consistent across several large substrate sizes and complex optical geometries.
Coffee Break 3:00 PM - 3:30 PM
Session 7: High Power/Energy Laser Components II
25 January 2022 • 3:30 PM - 4:10 PM PST | Room 202 (Level 2 South)
Author(s): Anna Filipchuk, Kostiantyn Nechay, Riina Ulkuniemi, Soile Talmila, Petteri Uusimaa, Antti Saarela, Modulight, Inc. (Finland)
25 January 2022 • 3:30 PM - 3:50 PM PST | Room 202 (Level 2 South)
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Vertical-cavity surface-emitting lasers (VCSELs) have become an integral part of 3D sensing market and future quantum computing. The possibility of arranging VCSELs into high power and density 2D arrays leads to a need for an improved thermal management, which can be implemented by means of packaging optimization. In this work enhanced heat flow is achieved by mounting chips on AIN submounts and performing subsequent optical epoxy encapsulation. The evaluation of thermal resistance of the devices with and without epoxy, not reported earlier, is performed to quantitively demonstrate the obtained improvements in the heat flow, efficiency, and output power.
Author(s): Dacheng Hua, Hongtao Chong, Focuslight Technologies, Inc. (China); Lei Cai, Focuslight Technologies (China); Li Chen, Guopeng Chen, Focuslight Technologies, Inc. (China); Min Wang, Jindou Liu, Weiyi Gu, Kai Zhou, Lei Gao, Chungen Zah, Focuslight Technologies (China); Chun He, Focuslight Technologies, Inc. (China)
25 January 2022 • 3:50 PM - 4:10 PM PST | Room 202 (Level 2 South)
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High power diode laser systems with homogenized intensity distribution have been widely used in laser annealing, cladding and surface heating. New applications such as semiconductor wafer annealing prefer adjustable laser beam size for process optimization, especially during process development stage. Here we report a development of a diode laser system with an adjustable beam size and highly uniform line beam intensity. Beam size in two dimensions perpendicular to its propagation direction can be adjusted independently with higher than 97% intensity uniformity in length dimension. The beam width is adjustable from 60 to 90um (FWHM) and the beam length is adjustable from 11mm to 12mm (FWHM). The output power can reach 1500W at 808nm wavelength with a power density reaches ~170KW/cm2. Detailed misalignment sensitivities of the Micro-Lens Arrays (MLAs), with respect to the lateral position, the rotating angle, and the distance between the two MLAs are studied. Beam back reflection isolation is also considered in the design to accommodate for high reflectivity materials processing. This new laser system can adapt to the requirement of different beam size quickly and precisely by simply adjusting the lens group position, without interrupting production process and increasing manufacturing cost.
25 January 2022 • 6:00 PM - 8:00 PM PST | Moscone West, Lobby (Level 3)
Conference attendees are invited to attend the LASE poster session on Tuesday evening. Come view the posters, enjoy light refreshments, ask questions, and network with colleagues in your field.

Poster Setup: Tuesday 10:00 AM – 5:00 PM
View poster presentation guidelines and set-up instructions at
Author(s): Jenna Campbell, Paul O. Leisher, Kevin McClune, Michelle Labrecque, Elliot Burke, Fedor Talantov, Milan Mashanovitch, Freedom Photonics, LLC (United States); Tadej Semenic, Seongchul Jun, Avijit Bhunia, Teledyne Scientific & Imaging, LLC (United States); Daniel Renner, Freedom Photonics, LLC (United States)
On demand | Presented live 25 January 2022
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High power solid-state and fiber laser systems rely on efficient semiconductor diode laser pumps as a key enabling technology. High temperature operation provides system SWAP advantages by reducing the thermal management burden. We have demonstrated high temperature GaAs diode lasers at 980 nm and have integrated them into high power fiber-coupled packages. Our prototype diode pump modules deliver 500 W ex-fiber power under continuous wave operation and are suitable for use in harsh environments. Freedom Photonics is currently defining the path for integration of these high-performance diode pump modules into high energy laser systems.
Author(s): Fabian Kranert, Moritz Hinkelmann, Laser Zentrum Hannover e.V. (Germany); Roland Lachmayer, Leibniz Univ. Hannover (Germany); Jörg Neumann, Dietmar Kracht, Laser Zentrum Hannover e.V. (Germany)
25 January 2022 • 6:00 PM - 8:00 PM PST | Moscone West, Lobby (Level 3)
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3D-printed optomechanics based on Fused Filament Fabrication (FFF) are often commercially available components being reprinted without realizing an innovation step or to address a higher system integration. We present a compact solid-state laser system for low-power applications where the possibilities of FFF are applied to create a function-integrated optomechanic, using polymers tailored to their application. The most optomechanical components of the system are combined in one module manufactured in a single print. The commercial optical components are firmly imprinted in the optomechanics and secured against misalignment. To determine the functionality, reliability and also limitations of the printed optomechanics, the Nd:YVO4-based laser system is examined in terms of output power, efficiency, and beam properties.
Author(s): Dong-Wan Kang, Junsoo Lee, Mansik Jeon, Jeehyun Kim, Kyungpook National Univ. (Korea, Republic of)
25 January 2022 • 6:00 PM - 8:00 PM PST | Moscone West, Lobby (Level 3)
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In this study, we present a software calibration method in SD-OCT to align the misaligned dispersed signal at the microscale level without the physical movement of optical components. The dispersed signals were aligned at the area scan camera-embedded spectrometer by digitally adjusting the region of interest (ROI) of the camera. The suggested SD-OCT system can be widely utilized in various optical imaging fields including preclinical and clinical studies.
Conference Chair
OptiGrate Corp. (United States)
Conference Chair
Freedom Photonics, LLC (United States)
Program Committee
Jens Biesenbach
BWT Laser Europe GmbH (Germany)
Program Committee
Gunnar Böttger
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM (Germany)
Program Committee
ALPhANOV (France)
Program Committee
Jenna Campbell
Freedom Photonics, LLC (United States)
Program Committee
Avo Photonics, Inc. (United States)
Program Committee
FISBA AG (Switzerland)
Program Committee
nLIGHT, Inc. (United States)
Program Committee
AdlOptica Optical Systems GmbH (Germany)
Program Committee
Focuslight Technologies, Inc. (China)
Program Committee
Christian V. Poulsen
NKT Photonics A/S (Denmark)
Program Committee
Fibertek, Inc. (United States)
Program Committee
NASA Goddard Space Flight Ctr. (United States)
Program Committee
Institute for Molecular Science (Japan)
Program Committee
TeraXion Inc. (Canada)
Program Committee
ficonTEC Service GmbH (Germany)
Program Committee
IPG Photonics Corp. (United States)
Program Committee
Focuslight Technologies, Inc. (China)
Additional Information


  • Submissions are accepted through 06-December
  • Notification of acceptance by 20-December

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