A new technique using high-index glasses enables photonic device integration on substrates such as semiconductors, glasses, IR crystals, polymers, and graphene.
A hybrid patterning system combining projection and interference lithography enables the fabrication of 14-inch 3D images.
A simple and versatile synthesis platform enables the preparation of engineered hybrid spin-on materials and micro and nanostructured surfaces for fast and inexpensive development of miniaturized devices.
Critical dimension inspection based on a library of simulated through-focus diffraction patterns and a mechanical-free defocusing process could improve high-throughput quality control.
Resolution enhancement based on vectorial and multi-parameter co-optimization reduces the complexity and fabrication cost of pixelated masks and sources for lithography.
High-performance photoresists made from metal oxide nanoparticles offer high-sensitivity lithography at extreme-UV wavelengths by using a new ligand-based patterning mechanism.