21 - 25 April 2024
National Harbor, Maryland, US
Rapid advances are taking place today in infrared technologies. These are enabling the development of more capable super-systems, sensor systems, cameras and subsystems that are expected to have improved performance with greater reliability, reduced size, weight and power/cost (SWaP-C). These improvements also enable new and novel applications of the technology such as self-driving vehicles, robotics, and the internet of things.

The emphasis in this conference is on infrared components, systems and applications. To demonstrate the degree of system performance improvement due to a better technology, the author may compare the performance of the system designed with and without the improved technology. In addition, general-purpose existing sub-systems and systems will be included. Selected applications will be covered, especially in military, security systems and self-driving vehicles so as to provide continuity between developers of components and systems.

This conference will bring together researchers, engineers and students, as well as developers and users of infrared technologies, to discuss improvements in military, security, and commercial sensors brought about by the incorporation of advanced technologies and/or new techniques. Papers solicited for this conference may address infrared technologies such as: Papers solicited for this conference may also address IR technology use in sensors/systems, such as: Sessions being planned for the conference are: Only one paper on a given topic will be accepted from each company/institution. Presentations should emphasize the technical nature of the topic. Product names and any type of product promotion are to be avoided. The following special sessions are also planned:

Joint session Infrared in Europe session Panel discussion Bjorn Andresen Memorial Session ;
In progress – view active session
Conference 13046

Infrared Technology and Applications L

21 - 25 April 2024 | National Harbor 2 (Sun-Wed) and National Harbor 5 (Thurs)
View Session ∨
  • Welcome and Opening Remarks
  • 1: SWIR I
  • 2: SWIR II
  • 3: SWIR III: CQD
  • 4: Infrared in Europe I
  • 5: Infrared in Europe II
  • 6: T2SL I
  • 7: T2SL II
  • Symposium Plenary
  • Symposium Panel on Microelectronics Commercial Crossover
  • 8: Keynote Session
  • 9: MCT
  • Panel Discussion: Infrared in Automotive Applications
  • 10: Uncooled
  • 11: Small Pixel Pitch
  • Poster Session
  • Symposium Plenary on AI/ML + Sustainability
  • 12: Bjørn Andresen Memorial Session
  • 13: Artificial Intelligence and Deep Learning: Joint Session with Conferences 13039 and 13046
  • 14: Sensors Technologies
  • 15: ROIC
  • Panel Discussion: Cryogenic Technologies
  • 16: Cryocoolers I
  • 17: Cryocoolers II
  • Digital Posters
Welcome and Opening Remarks
21 April 2024 • 1:30 PM - 1:40 PM EDT | National Harbor 2
Gabor F. Fulop, Maxtech International, Inc. (United States) and Infrared Imaging News (United States)
Session 1: SWIR I
21 April 2024 • 1:40 PM - 3:30 PM EDT | National Harbor 2
Session Chairs: Michael H. MacDougal, Attollo Engineering, LLC (United States), John C. Liobe, Sensors Unlimited, a Collins Aerospace Co. (United States)
13046-2
Author(s): Krishna Linga, Wei Huang, Sensors Unlimited, a Collins Aerospace Co. (United States); William Gustus, James Chi, Sensors Unlimited (United States); John C. Liobe, Sensors Unlimited, a Collins Aerospace Co. (United States)
21 April 2024 • 1:40 PM - 2:10 PM EDT | National Harbor 2
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SWIR Sensors Unlimited Inc. (SUI), a Raytheon Company, continues to expand its sensor portfolio through the development of time-of-flight (TOF) capable technologies.
13046-3
Author(s): Avraham R. Fraenkel, Rahel Elishkov, Gal Reches, Einat Louzon, Claudio G. Jakobson, Roman Dobromislin, Nimrod Ben Ari, Michael Labilov, Menashe Alcheck, Yair Lury, Haim Mary, Ehud Almog, Michal Nitzani, Yoram Karni, Tuvy Markovitz, SCD SemiConductor Devices (Israel); Benny Milgrom, Israel Ministry of Defence (Israel); Michael Richardson, QI/SCD (United States)
21 April 2024 • 2:10 PM - 2:30 PM EDT | National Harbor 2
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In this talk, we present the SWIFT family of 10 µm pitch InGaAs SWIR digital infrared detectors. Currently the SWIFT family consists of two products, the SWIFT640, which is a compact VGA version of the Cardinal1280 FPA embedded in a compact ceramic package with a dedicated proximity electronics boards. It presents low noise imaging with very low dark current and excellent imaging in low-light level conditions. The second product is the SWIFT EI (Event Imager) - which combines daylight and low-light level imaging with event-based imaging and multi spot laser tracking. We review the electro-optical performance, low-SWaP design considerations of these sensors.
13046-4
Author(s): Jordi Roubichou, Lab. d'Astrophysique de Marseille (France); Jean-Luc Reverchon, Axel Evirgen, Claire Theveneau, III-V Lab. (France); Vincent Gueriaux, Gerard Berginc, Thales LAS France SAS (France); Jean-Luc Gach, Lab d'Astrophysique de Marseille (France); Jean-Luc Beuzit, Lab. d'Astrophysique de Marseille (France)
21 April 2024 • 2:30 PM - 2:50 PM EDT | National Harbor 2
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In recent years, an interest in the detection of the Short Wave Infra-Red (SWIR) band has grown. In these wavelengths, we benefit both from the properties of the visible and thermal infrared, offering new information and a different contrast to the image. In the defense field, this band offers the possibility of passive and active imaging, as well as the detection of laser or thermal radiation from bodies above ambient temperature. The state-of-the-art III-V detectors in the SWIR are InGaAs photodiodes on InP substrate that are limited by a 1.7 um cut-off wavelength. Starting from the InGaAs on InP detector technology that has been mastered for more than ten years by THALES, the III-V Lab we propose to extend the detection range beyond 1.7 um by introducing a superlattice in the active region of an InGaAs photodiode. We will present the results obtained up to 2.6 um, as well as the solutions implemented to limit the carrier localization in the superlattice and the associated QE degradation.
13046-5
Author(s): Muammer Kozan, Baran Utku Tekin, Alican Karakuş, Aylin Kangallı Akkoyunlu, Mehmet Emin Kısa, Arda Şahin, Ebru Sağıroğlu, Alper Şahin, Mert Eren Ağcabay, Elif Aytuna, Yiğit Özer, Başak Bakır, Gözde Demir, Hatice Demir Özdemir Bulut, Çağla Özgit Akgün, Ahmet M. Akbaş, Vedat Karakaş, Yunus Dağ, Ömer Lütfi Nuzumlalı, Seymen M. Aygün, ASELSAN A.S. (Turkey)
21 April 2024 • 2:50 PM - 3:10 PM EDT | National Harbor 2
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ASELSAN has made significant progress on developing its short-wave infrared (SWIR) technology, with improving dark current, quantum efficiency, and operability. In recent work, shunt current and generation-recombination current have been identified as the predominant dark current mechanisms. Extensive work on process optimization employing various passivation schemes combined with theoretical layer design has lowered the SWIR focal plane array pixel dark current values down to < 1 nA/cm2. Furthermore, achieving low dark current without sacrificing high quantum efficiency (exceeding 80%), by building on the previous process and post-process work, has enhanced the sensor’s ability to capture faint signals. 640x512 format and 15 µm pitch SWIR focal plane arrays coupled with ASEL64015CG read-out circuits have consistently reached > 99.9% operability. After maturing the development work, ASELSAN launches its SWIR detector, LEOP-640/15-SW, pioneering the company’s photodetector production. In this paper, the results of the theoretical and experimental R&D work on LEOP photodetector development and production at ASELSAN are presented.
13046-6
Author(s): Grant James, Jinguo Yu, John C. Liobe, Sensors Unlimited, a Collins Aerospace Co. (United States); Krishna Linga, Sensors Unlimited (United States)
21 April 2024 • 3:10 PM - 3:30 PM EDT | National Harbor 2
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Sensors Unlimited Inc. (SUI), a Raytheon Company, has expanded its multi-mode tracking (MMT) product portfolio with the development of two solutions, each of which offer laser range finding (LRF) capability. The SWIR Pocket Scope-MMT (SPS-MMT) sets the gold standard for asynchronous laser pulse detection (ALPD) and low-noise passive imaging, internally dubbed MMT, in a SWIR hand-held solution. SUI’s expanded portfolio now includes a variant of that product with an embedded LRF so that the warfighter can simultaneously, image, track and decode any laser designators, and determine the distance to any targets in the same scene of interest. Additionally, SUI has developed an HD version of that capability set. Performance results of each solution will be described herein.
Break
Coffee Break 3:30 PM - 3:50 PM
Session 2: SWIR II
21 April 2024 • 3:50 PM - 5:10 PM EDT | National Harbor 2
Session Chairs: John C. Liobe, Sensors Unlimited, a Collins Aerospace Co. (United States), Martin H. Ettenberg, Princeton Infrared Technologies, Inc. (United States)
13046-7
Author(s): Michael J. Evans, Sensors Unlimited, a Collins Aerospace Co. (United States); Sungjin Kim, Sensors Unlimited (Uruguay); John C. Liobe, Sensors Unlimited, a Collins Aerospace Co. (United States); Paul Bereznycky, Dmitry Zhilinsky, Wei Xu, Sensors Unlimited (United States); John Wieners, Sensors Unlimited, a Collins Aerospace Co. (United States); Andrew Eckhardt, Jinguo Yu, Michael Delamere, John Tagle, Scott Ramsey, Sensors Unlimited (United States)
21 April 2024 • 3:50 PM - 4:10 PM EDT | National Harbor 2
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Sensors Unlimited, Inc., an RTX company, presents recent advancements in its SWIR APLD products tailored toward high volume production and broad deployment.
13046-8
Author(s): Peter Thorne, Charlie Turner, Leonardo UK Ltd. (United Kingdom)
21 April 2024 • 4:10 PM - 4:30 PM EDT | National Harbor 2
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Leonardo UK high performance short waveband infrared avalanche photo diode (APD) array technology is being developed for high-speed linear mode photon counting applications. This paper reports technical progress and results. A 2D array has been measured. High gain high speed linear mode photon counting has been demonstrated using a 500ns gate time.
13046-9
Author(s): Gabriel Jobert, Nicolas Vannier, Sandra Pelletier, Romain Delubac, Xavier Brenière, Nicolas Péré-Laperne, Laurent Rubaldo, Lynred (France)
21 April 2024 • 4:30 PM - 4:50 PM EDT | National Harbor 2
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A number of studies suggest that the Short Wave InfraRed (SWIR) band (0.9-1.7µm), offers a significant advantage over the visible for long-range daytime scenarios. This advantage of SWIR is due in particular to its excellent optical penetration in the presence of aerosols thanks to reduced light-scattering effects, allowing good scene contrast to be maintained over very long distances. This study reports the results of a field evaluation campaign, involving Lynred’s SNAKE TECLESS (TL) sensor (640x512@15µm, InGaAs) along size narrow field optics. This year-long campaign features a variety of atmospheric conditions, weathers and aerosol types. Those targets are at distances ranging between 10km and 84km. Finally, we compare the image obtained with SWIR sensors having a pixel pitch of 15µm and 10µm, with the same objective lenses, in order to conclude on the interest of reducing the pixel pitch for a gain in range.
13046-10
Author(s): Michael H. MacDougal, Chris Mak, Attollo Engineering, LLC (United States); Jet Meitzner, Attollo Engineering (United States); Tim Strand, Andrew D. Hood, Jon C. Geske, Attollo Engineering, LLC (United States); Alexander Bessonov, Ivonne Medina-Salazar, Marat Lutfullin, Quantum Solutions (United Kingdom)
21 April 2024 • 4:50 PM - 5:10 PM EDT | National Harbor 2
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SWIR imagers are seeing wide use in commercial and defense applications. The conventional choice for the detector is InGaAs lattice-matched to InP. Recently, colloidal quantum dots using PbS have shown promise as a SWIR responsive material. CQDs have the promise or reducing SWIR sensors cost substantially, but the performance difference requires more characterization. We demonstrate both InGaAs and CQDs in focal plane arrays using the same ROIC, the AE1702, which is a 640x512 format ROIC with a 5 µm pixel pitch. We, show spectra, PTC measurements, and imaging. In addition, we show measurements using 1900 nm CQDs-based FPAs.
Session 3: SWIR III: CQD
21 April 2024 • 5:10 PM - 6:20 PM EDT | National Harbor 2
Session Chairs: Martin H. Ettenberg, Princeton Infrared Technologies, Inc. (United States), John C. Liobe, Sensors Unlimited, a Collins Aerospace Co. (United States)
13046-11
Author(s): Philippe Guyot-Sionnest, The Univ. of Chicago (United States)
21 April 2024 • 5:10 PM - 5:40 PM EDT | National Harbor 2
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Colloidal Quantum Dots (CQD) made of inorganic heavy atoms with low frequency vibrations should facilitate long lived excited electronic states. This should allow CQDs to unlock the previously theorized great potential of quantum dot for infrared technologies. Using different starting semiconductor material, CQDs with interband or intraband transitions have been shown to cover the full infrared spectrum. Single element detectors have been realized from the near-IR to the LWIR. There is also a growing number of demonstrations of focal plane arrays with such materials, in the SWIR with PbS, and MWIR with HgTe. LED demonstrations cover the near-IR and are recently extending into the MWIR. This talk will describe the progress to date of CQD optoelectronic devices in the MWIR, as well the main target and challenges.
13046-12
Author(s): Robert J. Stewart, Ethan J. D. Klem, Allan H. Hilton, SWIR Vision Systems (United States)
21 April 2024 • 5:40 PM - 6:00 PM EDT | National Harbor 2
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Using colloidal quantum dot (CQD) technology, SWIR Vision Systems has developed a 6MP SWIR and e-SWIR FPA. The uncooled 3072-by-2048-pixel sensor uses a 7µm pitch to balance sensor size, signal-to-noise, and on-chip capabilities. The 6MP sensors also leverage an improved fabrication process, resulting in a 2-3X increase in QE over the existing CQD product line. The uncooled 6MP focal planes will be integrated into two distinct camera formats: fixed platform and DSLR. Both types accommodate C and M42 lens mounts, feature 100Hz speeds with 12-bit resolution, and will be offered in standard SWIR and extended SWIR ranges (400-1700 nm and 350-2100 nm, respectively). The fixed platform format features a reduced footprint, CoaXPress or 10GigE interfaces, and GenICam compliance. The DSLR format is a battery-powered DSLR-style camera that includes a touchscreen, image and video capture, and onboard storage. For outdoor use, this camera will be IP65 rated and ruggedized.
13046-13
Author(s): Mark Allen, Emberion Oy (Finland); Surama Malik, Chris Bower, Yinglin Liu, Emberion (United Kingdom); Sami Kallioinen, Markus Nenonen, Emberion Oy (Finland); David T. So, Alan Colli, Emberion (United Kingdom); Janne Tamminen, Jarkko Routama, Emberion Oy (Finland); Samiul Haque, Emberion (United Kingdom); Frank Coenen, Jyri Hämäläinen, Emberion Oy (Finland); Piers Andrew, Emberion (United Kingdom); Tapani Ryhänen, Emberion Oy (Finland)
21 April 2024 • 6:00 PM - 6:20 PM EDT | National Harbor 2
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Image sensors made using colloidal quantum dots (CQDs) as the optical absorber material are breaking through as a viable competing technology within the SWIR and MWIR imaging domains. We introduce the Emberion image sensor platform and report our recent results on image sensor development using Lead Sulfide (PbS) CQDs processed onto our custom-designed ROIC. The optoelectronic characteristics of the CQD photosensitive stack are analyzed and the optimal interface to the ROIC is discussed. We also address challenges related to manufacturability such as the planarity requirements of the ROIC surface to facilitate wet-processing via spin-cast CQD thin-film layers. We demonstrate wavelength response from 400 nm out to beyond 2000 nm with noise equivalent irradiance (NEI) below 1e-3 W/m2 over the entire spectral range. Selected illustrative application demonstrations are showcased including detection of water content at SWIR wavelengths, high-speed imaging of a moving target at 400 fps and camouflage detection.
Session 4: Infrared in Europe I
22 April 2024 • 8:20 AM - 10:10 AM EDT | National Harbor 2
Session Chair: Linda Höglund, IRnova AB (Sweden)
13046-801
Author(s): Linda Höglund, IRnova AB (Sweden)
22 April 2024 • 8:20 AM - 8:30 AM EDT | National Harbor 2
13046-14
Author(s): Stefan Hanna, Holger Bitterlich, Rainer Breiter, Detlef Eich, Alexander Epping, Heinrich Figgemeier, Holger Lutz, Karl-Martin Mahlein, Manuel Ullrich, Alexander Sieck, AIM INFRAROT-MODULE GmbH (Germany)
22 April 2024 • 8:30 AM - 9:00 AM EDT | National Harbor 2
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AIM as one of the global leaders in higher operating temperatures (HOT) mercury cadmium telluride (MCT)-based infrared detectors will present its status on small pitch short wavelength infrared (SWIR), mid wavelength infrared (MWIR), long wavelength infrared (LWIR) and very long wavelength infrared (VLWIR) focal plane detector arrays (FPA) and give a glimpse of the near future. As of now, pixel operabilities exceeding 99.7% and excellent radiometric performance are attained under typical operating conditions at detector operating temperatures of 235K in the SWIR, 170K in the MWIR, 110K in the LWIR, and 70K in the VLWIR.
13046-15
Author(s): Quankui K. Yang, Raphael Müller, Mark Wobrock, Wolfgang Luppold, Volker Daumer, Robert Rehm, Fraunhofer-Institut für Angewandte Festkörperphysik IAF (Germany)
22 April 2024 • 9:00 AM - 9:20 AM EDT | National Harbor 2
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In this contribution, we will present a finite element method modelling study for the optimization of QE in LWIR InAs/GaSb type-II superlattice detectors via the employment of metastructures. Experiments to realize these devices will also be presented. In our approach, the average integrated QE for a structure with an absorber thickness of 2.1 µm is theoretically improved from 35% to 73%, corresponding to an improvement of 108%. For a detector with a thin absorber layer of 0.9 µm, the average integrated QE is improved from 21% to 59%, corresponding to an increasement of 180%.
13046-16
Author(s): Jean-Philippe Perez, Matthias Tornay, Richard Arinero, Philippe Christol, Institut d'Électronique et des Systèmes (France); Gilles Patrairche, Konstantinos Pantzas, Ctr. de Nanosciences et de Nanotechnologies, CNRS (France), Univ. Paris-Saclay (France); Nicolas Péré-Laperne, Lynred (France)
22 April 2024 • 9:20 AM - 9:50 AM EDT | National Harbor 2
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Ga-free InAs / InAsSb T2SL strain-balanced on GaSb is conventionally considered as an anisotropic quantum structure with heavy holes highly confined in InAsSb and electrons rather distributed all over the structure. Nevertheless, state-of-the art quantum efficiency values higher than 50 % for MWIR Ga-free T2SL have recently been obtained. To explain such a non-intuitive trend, cross-sectional transmission electron microscopy (TEM) investigations have been performed. The detailed and in-depth understanding of antimony composition coming from TEM images is used to reach more realistic MWIR Ga-free T2SL band structure calculation. This update in turn leads to reliable predictions of Ga-free superlattice transport and optical properties such as absorption or quantum efficiency.
13046-17
Author(s): Laurent Rubaldo, Nicolas Morisset, Alexandre Brunner, Cécile Grezes, Nicolas Péré-Laperne, Gulnar Dagher, Alexandra Blay, Alexandre Kerlain, Lynred (France); Clement Lobre, Olivier Gravrand, CEA-LETI (France); Pierre Jenouvrier, David Billon-Lanfrey, Lynred (France)
22 April 2024 • 9:50 AM - 10:10 AM EDT | National Harbor 2
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LYNRED is a leading global provider of high-quality II-VI, III-V and bolometers infrared detectors for the aerospace, defense and commercial markets. Our vision is to preserve and protect, and provide the right technology to customers’ needs. To consolidate our position among infrared detector manufacturer leaders and to enable us to respond to growing market demand for next-generation infrared technologies, a new state of the art industrial facility is breaking ground. We will discuss in this paper the true figures of merit that have to be addressed during technology development and optimization to meet field mission requirements. We will then review latest results on II-VI and III-V HOT IDDCA (Integrated Detector Dewar Cryocooler Assembly) with 7.5µm pitch SXGA format focal plane array in terms of low frequency noise defects, stability and reproducibility of residual fixed pattern noise (RFPN) and Modulation Transfer Function (MTF) optimizations while maintaining high quantum efficiency to keep highest possible range.
Break
Coffee Break 10:10 AM - 10:40 AM
Session 5: Infrared in Europe II
22 April 2024 • 10:40 AM - 12:00 PM EDT | National Harbor 2
Session Chair: Linda Höglund, IRnova AB (Sweden)
13046-18
Author(s): Linda Höglund, Marie Delmas, Ruslan Ivanov, David Ramos, Linnea Bendrot, Thierry Kohl, Laura Zurauskaite, Dean Evans, David Rihtnesberg, Sergiy Smuk, Anton Smuk, Smilja Becanovic, Susanne Almqvist, Pia Tinghag, Eric M. Costard, IRnova AB (Sweden)
22 April 2024 • 10:40 AM - 11:10 AM EDT | National Harbor 2
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High operating temperature (HOT) type-II superlattice (T2SL) detectors are enabling new solutions for high-resolution imaging, thanks to the capability to fabricate small pixel pitch Focal Plane arrays (FPA) with high performance. To maintain high image quality of HD FPAs, it is crucial to minimize the electrical crosstalk by fully delineating the pixels. In this paper we will demonstrate that the modulation transfer function (MTF) stays close to the ideal value of ~0.6 at Nyquist frequency for T2SL FPAs with pixel pitches ranging from 15 µm down to 7.5 µm. Thanks to optical concentration effects and suppression of surface leakage currents, high QE and low dark current density are maintained also for small pixel pitch, meaning that there is no sacrifice in performance for these HOT MWIR HD T2SL FPAs. Furthermore, the development route towards large footprint (2048 x 512 pixels, 15 µm pitch) HD eSWIR FPAs with CTIA ROICs targeting space applications will be presented.
13046-19
Author(s): Chee Hing Tan, Tarick Blain, Jonathan Taylor-Mew, Ye Cao, The Univ. of Sheffield (United Kingdom); Benjamin White, Xiao Collins, Phlux Technology Ltd (United Kingdom); Jo Shien Ng, John David, The Univ. of Sheffield (United Kingdom)
22 April 2024 • 11:10 AM - 11:40 AM EDT | National Harbor 2
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It is well known that avalanche photodiode can enhance the signal to noise ratio of a detection system, when the excess avalanche noise is low. The excess noise factor, F which characterised the excess noise of an APD can be calculated using the established noise theory from R. McIntyre. When the ratio of hole to electron ionisation coefficients, k = 0, F ~2 is achieved at high gain. This means the avalanche gain, M, can be increased without the penalty of increased excess noise factor. In this work, we will present the progress in APDs incorporating InAs and AlGaAsSb as the avalanche regions. Both show k ~0 and therefore F~2. The former can be used for low photon detection at wavelengths beyond InGaAs, while the latter can be combined with InGaAs to provide low noise APD for wavelengths upto 1700 nm. Our work demonstrated that low photons of < 100 photon within a 50 microsecond pulse can be detected using InAs APDs. We also achieved single photon detection at 1550 nm using AlGaAsSb APD.
13046-20
Author(s): Dominic Kwan, Chris Maxey, Marcus Lee, Ian Baker, Les Hipwood, George Seager, Leonardo UK Ltd. (United Kingdom); Veronica Letka, Andrew Marshall, Lancaster Univeristy (United Kingdom)
22 April 2024 • 11:40 AM - 12:00 PM EDT | National Harbor 2
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This paper presents HOT MWIR detectors based on MCT and T2SL. MOVPE growth of MCT arrays on GaAs substrates enables band engineering of the MCT heterostructure to achieve high sensitivity, operability, and stability at 140 K. T2SL arrays, developed in collaboration with Lancaster University, also demonstrate high sensitivity and stability. High performance is achieved with T2SLs grown on lattice-matched GaSb or low-cost GaAs substrates.
Break
Lunch Break 12:00 PM - 1:20 PM
Session 6: T2SL I
22 April 2024 • 1:20 PM - 2:50 PM EDT | National Harbor 2
Session Chairs: Nansheng Tang, L3Harris Technologies, Inc. (United States), Binh-Minh Nguyen, HRL Labs., LLC (United States)
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Author(s): Nansheng Tang, L3Harris Technologies, Inc. (United States)
22 April 2024 • 1:20 PM - 1:30 PM EDT | National Harbor 2
13046-21
Author(s): Neil F. Baril, Tony Almeida, Dave Benson, Sumith V. Bandara, Randy N. Jacobs, Alex E. Brown, Andy Stoltz, Peter Smith, Ken Brogden, U.S. Army CCDC C5ISR Ctr. Night Vision & Electronic Sensors Directorate (United States)
22 April 2024 • 1:30 PM - 2:00 PM EDT | National Harbor 2
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Infrared sensors are an essential technology in the rapid detection and identification of potential threats. Continuous improvements in performance and yield as well as reductions in cost, size, weight, and power consumption are necessary to keep pace with new and emerging threats that are increasing in number and have greater range, speed, and maneuverability. Yield and performance limiting challenges of cooled infrared detector materials and infrared focal plane array processing will be discussed. Paths to addressing some of these challenges including surface passivation, defect identification and analysis, and pixel definition will be presented.
13046-22
Author(s): David R. Rhiger, Raytheon Vision Systems (United States)
22 April 2024 • 2:00 PM - 2:30 PM EDT | National Harbor 2
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MWIR detectors built with the InAs/InAsSb superlattice are analyzed. We show (1) a method for accurately determining the bandgap from device test data, (2) a means to extract the Urbach tail parameters showing agreement with the InAs phonon, (3) evidence of hole localization, and (4) measurement of the energy step of hole-blocking features.
13046-23
Author(s): Alexander Soibel, David Z. Ting, Anita M. Fisher, Arezou Khoshakhlagh, Brian J. Pepper, Sarath D. Gunapala, Jet Propulsion Lab. (United States)
22 April 2024 • 2:30 PM - 2:50 PM EDT | National Harbor 2
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A variety of mid-, long - and very long– wavelength infrared (MWIR, LWIR and VLWIR) detectors and focal plane arrays utilizing InAs/InAsSb superlattices have been demonstrated in the last decade. At the same time, the transport properties of minority carriers in these structures became an area of active investigation after initial observations of hole localization at low temperatures attributed to the nonuniformity of superlattice layers thickness. In this work we studied the dependence of minority carrier (hole) transport, absorption coefficient and quantum efficiency (QE) of a 5.6 µm cut-off wavelength and of 8.9 µm cut-off wavelength LWIR InAs/InAsSb detectors on temperatures and applied bias. Next, we found the minority carrier (hole) diffusion length and mobility from the measured QE, absorption coefficient and minority carrier lifetime. These results are critical for understanding of the mechanisms of the hole transport in these photodetectors and will help improve device performance.
Break
Coffee Break 2:50 PM - 3:20 PM
Session 7: T2SL II
22 April 2024 • 3:20 PM - 4:50 PM EDT | National Harbor 2
Session Chairs: Binh-Minh Nguyen, HRL Labs., LLC (United States), Nansheng Tang, L3Harris Technologies, Inc. (United States)
13046-24
Author(s): Binh-Minh Nguyen, HRL Labs., LLC (United States)
22 April 2024 • 3:20 PM - 3:50 PM EDT | National Harbor 2
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For over three decades HRL has been known for industry-leading IR detector research and development, and has strived to be agile and adaptable to provide custom solutions for specific mission needs. Over this time HRL has invested heavily in capital equipment and fundamental technology development. This talk will focus on describing our recent research efforts aiming for an overall system/sub-system C-SWaP reduction: curved sensors and small-pitch PFAs for compact optics, wafer scale fabrication for lower sensor cost, small-pitch and high operating temperature sensors for lesser cooler requirements.
13046-25
Author(s): Brent Webster, Joshua M. Duran, Gamini Ariyawansa, Air Force Research Lab. (United States)
22 April 2024 • 3:50 PM - 4:10 PM EDT | National Harbor 2
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The performance of Type II Strained Layer Superlattices (SLSs), incorporating III-V semiconductor materials, in infrared (IR) detectors and focal plane arrays (FPAs) is limited by the presence of surface leakage current. This is currently mitigated using a unipolar barrier architecture using n-type layers (nBn). This study focused on a new fabrication process for simplified homojunction planar diodes. These planar devices were created using various techniques of zinc compound deposition and thermal diffusion to create p-type regions within n-type Type II SLS material. Dark current measurements of said devices have been compared to current epitaxially grown devices incorporating unipolar barrier architectures.
13046-26
Author(s): Göktug Agca, Neslihan Demirer, Melih KALDIRIM, Ebru SAGIROGLU, Esin AKCA, Asli KARAUSTA, Gözde DEMIR, Cagla AKGUN, Yigit OZER, Omer Lutfi NUZUMLALI, ASELSAN A.S. (Turkey)
22 April 2024 • 4:10 PM - 4:30 PM EDT | National Harbor 2
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ASELSAN has been developing new generation high operating temperature (HOT) infrared detectors to reduce the power consumption of T2SL detectors. In this paper, recent results for HOT T2SL detectors for mid-wavelength infrared (MWIR) technology at ASELSAN are presented. Performance is shown for 640x512 format 15 µm pitch IDDCA with average noise equivalent temperature (NETD) and pixel operability values of <25 mK (F/4) and >99.5% at 110 K, respectively. These NETD and operability values remain unaffected by temperature between 77 K and 110 K.
13046-27
Author(s): Shoichiro Fukushima, Masaaki Shimatani, Manabu Iwakawa, Shinpei Ogawa, Mitsubishi Electric Corp. (Japan)
22 April 2024 • 4:30 PM - 4:50 PM EDT | National Harbor 2
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Graphene-based infrared photodetectors are promising devices that exploit the unique optoelectronic properties of graphene, including its broadband light absorption characteristics, rapid response, and high chemical stability. However, graphene exhibits a low absorbance (2.3%), which limits its photoresponsivity. This paper introduces sensitivity-enhanced InAs/GaInSb type-II superlattice (T2SL) infrared photodetectors fabricated using a graphene diode structure. The devices consist of graphene diodes and InAs/GaInSb SLs grown via chemical vapor deposition. The T2SL structure is employed for both photocarrier supply source and carrier density modulation of the graphene diodes to improve the sensitivity of the devices. The dark current in the graphene diode device is reduced to less than 1%, which is lower than that in the GFET device, and the responsivity of the devices is significantly enhanced using the photogating effect. These highly sensitive and low-dark-current devices are expected to promote the development of high-performance graphene-based image sensors.
Symposium Plenary
22 April 2024 • 5:00 PM - 6:30 PM EDT | Potomac A
Session Chairs: Tien Pham, The MITRE Corp. (United States), Douglas R. Droege, L3Harris Technologies, Inc. (United States)

View Full Details: spie.org/dcs/symposium-plenary

Chair welcome and introduction
22 April 2024 • 5:00 PM - 5:05 PM EDT

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Author(s): Devanand K. Shenoy, U.S. Dept. of Defense (United States)
22 April 2024 • 5:05 PM - 5:45 PM EDT | Potomac A
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Author(s): Deeph Chana, Defence Innovation Accelerator for the North Atlantic (United Kingdom)
22 April 2024 • 5:50 PM - 6:30 PM EDT | Potomac A
Symposium Panel on Microelectronics Commercial Crossover
23 April 2024 • 8:30 AM - 10:00 AM EDT | Potomac A

View Full Details: spie.org/dcs/symposium-panel

The CHIPS Act Microelectronics Commons network is accelerating the pace of microelectronics technology development in the U.S. This panel discussion will explore opportunities for crossover from commercial technology into DoD systems and applications, discussing what emerging commercial microelectronics technologies could be most impactful on photonics and sensors and how the DoD might best leverage commercial innovations in microelectronics.

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Author(s): John M. Pellegrino, Georgia Tech Research Institute (retired) (United States); Shamik Das, The MITRE Corp. (United States); Erin Gawron-Hyla, U.S. Dept. of Defense (United States); Carl E. McCants, Defense Advanced Research Projects Agency (United States); Kyle D. Squires, Arizona State Univ. (United States); Anil Rao, Intel Corp. (United States)
23 April 2024 • 8:30 AM - 10:00 AM EDT | Potomac A
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The CHIPS Act Microelectronics Commons network is accelerating the pace of microelectronics technology development in the U.S. This panel discussion will explore opportunities for crossover from commercial technology into DoD systems and applications. Experts representing the Microelectronics Commons program, government R&D, commercial industry, DoD industry, and academia will discuss what emerging commercial microelectronics technologies could be most impactful on photonics and sensors and how the DoD might best leverage commercial innovations in microelectronics.
Break
Coffee Break 10:00 AM - 10:30 AM
Session 8: Keynote Session
23 April 2024 • 10:30 AM - 11:10 AM EDT | National Harbor 2
Session Chair: Gabor F. Fulop, Maxtech International, Inc. (United States)
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Author(s): Whitney Mason, Defense Advanced Research Projects Agency (United States)
23 April 2024 • 10:30 AM - 11:10 AM EDT | National Harbor 2
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Currently, one of the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO)’s largest initiatives is the Electronics Resurgence Initiative (ERI 2.0), the drive to advance 3-Dimensional Heterogeneous Integration (3DHI). Infrared focal plane arrays were the original 3DHI device, but lessons can be learned from this new initiative. The talk will center on advancement in new materials, advancements in manufacturing capability and leveraging advanced compute technologies. The talk will include ongoing efforts in infrared and thoughts for the future.
Session 9: MCT
23 April 2024 • 11:10 AM - 11:50 AM EDT | National Harbor 2
Session Chair: Laurent Rubaldo, Lynred (France)
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Author(s): Olivier Gravrand, Clément Lobre, CEA-LETI (France); Cecile Grezes, Lynred (France); Titouan LeGoff, CEA-LETI (France); Diane Sam-Giao, Lynred (France); Florent Rochette, Nicolas Baier, CEA-LETI (France); Laurent Rubaldo, Lynred (France)
23 April 2024 • 11:10 AM - 11:30 AM EDT | National Harbor 2
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For several years, LETI and Lynred (within DEFIR common laboratory) has been working on a new version of its P/N structure. This new generation (NG) process flow is a complete overhaul of the MCT P/N fabrication, focusing on lowering process induced defects in the narrow gap absorbing material. It is therefore specifically designed to optimise second order figures of merit such as stability, BSFR, RTS pixels. Until now, this technology has been intensively focused on MWIR band for high operating operation [ ][ ][ ], with 7.5µm pixel pitches, for tactical applications. This work results in very interesting performance FPA demonstrations for the next generation of MCT MWr detectors at 130K and even at 150K. We now investigate the possibility to adapt this NG flow to longer wavelength such as LW (9.3µm@80K). First arrays exhibit almost no distribution tails, and measured dark currents remain very low down to very low temperatures (below 100e/s at 40K). This paper also intend to discuss the potentiality of this NG structure for the VLWIR (15µm@65K) band intended to address future space applications for earth observations.
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Author(s): Titouan LeGoff, CEA-LETI (France); Christian C. K. Ketchazo, CEA-IRFU (France); Clément Lobre, CEA-LETI (France); Olivier Boulade, Thibault Pichon, CEA-IRFU (France); Olivier Gravrand, CEA-LETI (France); Benoit Horeau, CEA-IRFU (France); Giacomo Badano, CEA-LETI (France)
23 April 2024 • 11:30 AM - 11:50 AM EDT | National Harbor 2
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For several years, LETI has been working on developing IR MCT detectors for low flux applications in scientific imaging. MCT has remarkable material properties that allow for highly performing detection, with high QE and minimal dark current. Currently, both Teledyne US and LETI-Lynred in France are achieving values in the fraction of e/s/pixel range for NIR imaging, utilizing a P/N extrinsic diode structure, for astronomy applications. As part of the NEOCAM project, Teledyne has demonstrated the ability to extend the cut-off wavelength to significantly longer lengths (10.3µm @ 40K) while keeping dark currents in the e/s range. Furthermore, LETI is presently enhancing its P/N technology to satisfy the demanding specifications of low-flux applications. Achieving very low dark current leakage and large diode polarisation plateaus is required to achieve SFD input stage ROIC operation and to reach such low current values. Such a requirement entails the mitigation of tunnel currents that appear in low gap materials. In this report, we present the production of 15µm pitch TV study array in the LW range (8.3µm @ 80K). Dark current values as low as 3e/s/pixel have been measured below 50K.
Break
Lunch/Exhibition Break 11:50 AM - 1:30 PM
Panel Discussion: Infrared in Automotive Applications
23 April 2024 • 1:30 PM - 2:30 PM EDT | National Harbor 2

Thermal imaging technology is poised to become widespread in advanced driver assistance systems (ADAS) for pedestrian detection and as part of the sensor stack, along with visible cameras, lidar, radar and other sensors, for future autonomous vehicles.

Moderator:
Andrew Hood, Attollo Engineering, LLC (United States)

Panelists:
David Cheskis, TriEye Ltd. (Israel)
John Hong, Obsidian Sensors, Inc. (United States)
Ethan Klem, SWIR Vision Systems (United States)
Joseph Thompson, VALEO North America Inc. (United States)
Callan Loo, Lynred USA (United States)
John Eggert, Teledyne FLIR LLC (United States)

Break
Coffee Break 2:30 PM - 2:50 PM
Session 10: Uncooled
23 April 2024 • 2:50 PM - 4:10 PM EDT | National Harbor 2
Session Chair: Tony J. Ragucci, Leonardo DRS (United States)
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Author(s): Tomo Tanaka, Masahiko Sano, Masataka Noguchi, Takashi Miyazaki, NEC Corp. (Japan); Megumi Kanaori, National Institute of Advanced Industrial Science and Technology (Japan); Toshie Miyamoto, Naoki Oda, Ryota Yuge, NEC Corp. (Japan)
23 April 2024 • 2:50 PM - 3:10 PM EDT | National Harbor 2
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In this study, we fabricated bolometer-type uncooled infrared focal plane allays (IRFPAs) of 640 × 480 pixels with high-purity semi-conducting single-walled carbon nanotubes (SWCNTs) as detection materials for the first time. The responsivity and thermal time constant of typical element in long-wave IR region showed about 100000 (V/W) @0.17V and 5 ms, respectively. Assuming the thermal conductance and infrared absorption rate, temperature coefficient of resistance (TCR) was estimated as above -5%/K. The TCR value was similar with that of semi-conducting SWCNT network film prepared on Si substrate and about three times larger than that of conventional vanadium oxide film. Therefore, we found that semi-conducting SWCNTs become a promising bolometer material that can achieve high sensitivity.
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Author(s): Sebastien Tinnes, Quentin Noir, Guillaume Delubac, Jessy Matias, Lynred (France); Riccardo Dona, Biagio CIUFFO, Joint Reseach Centre (Italy)
23 April 2024 • 3:10 PM - 3:30 PM EDT | National Harbor 2
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Road fatalities that represent 1.35 million death each year is the 8th cause of decease in the world, 54% of them are Vulnerable Road Users. In the United States or Europe, 75% of fatalities happen in poor visibility conditions. Active safety is a promising way to reduce road fatalities with features like Automatic Emergency Braking (AEB). Currently, it relies mainly on RGB camera and radar that suffer from limitations in challenging situations that represents the majority of accident situations. These challenging situations include nighttime, headlamp or sun glare, rain and fog. NHTSA latest rulemaking proposition asks for AEB system that works during day and nighttime conditions for pedestrian and car detection. Thermal imaging is a complementary technology to RGB cameras and radars to extend AEB use cases to these challenging situations. The talk will explore thermal imaging capabilities for obstacle detection in nighttime conditions. Performances will be illustrated by DRI calculations and real tests with 12µm and latest 8.5µm pixel pitch microbolometers. A $100 thermal camera configuration that covers the NHTSA rulemaking proposition requirements will be presented.
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Author(s): Antoine Albouy, CEA-LETI, Univ. Grenoble Alpes (France); Geoffroy Dumont, Mélanie Le Cocq, Claire Vialle, Romain M.R. Kubica, Laurent Carle, Valérie Goudon, Thomas Perrillat-Bottonet, Jean-Jacques Yon, Patrick Leduc, CEA-LETI (France)
23 April 2024 • 3:30 PM - 3:50 PM EDT | National Harbor 2
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LWIR uncooled microbolometer technology is at a turning point with the emergence of high volume markets, as the automotive and consumer ones. As uncooled microbolometer market grows, there is a need for cost-reduced detectors with the right performance level for the considered markets. Considering this aim, CEA Leti developed a technological proof of concept of a FDSOI transistor based suspended microbolometer at 12µm pixel pitch realized by 3D integration. We present SEM observations that illustrate the good mechanical stiffness of the suspended pixels. Under vacuum, electro-optic measurements confirmed the thermal insulation of the detector and its sensitivity to the incident infrared flux.
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Author(s): Fushuai Liu, Raytron Technology Co., Ltd. (China); Shan Dong, Yantai Raytron Technology Co., Ltd. (China); Wenli Chen, Raytron Technology Co. Ltd. (China)
23 April 2024 • 3:50 PM - 4:10 PM EDT | National Harbor 2
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Latest Developments of uncooled IRFPA technology at Raytron
Break
Break 4:10 PM - 4:20 PM
Session 11: Small Pixel Pitch
23 April 2024 • 4:20 PM - 6:10 PM EDT | National Harbor 2
Session Chairs: Eric M. Costard, IRnova AB (Sweden), Andrew D. Hood, Attollo Engineering, LLC (United States)
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Author(s): John T. Caulfield, Jon Paul Curzan, Cyan Systems, Inc. (United States); Hasan Sharifi, Sevag Terterian, HRL Labs., LLC (United States); Bob Piatek, Dave Schmitz, Cyan Systems, Inc. (United States)
23 April 2024 • 4:20 PM - 4:50 PM EDT | National Harbor 2
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Cyan Systems has innovated Small Pixel Full High Definition and Ultrahigh Definition IR MWIR Cameras and continues to conduct tests and evaluation of these novel Ultra-high resolution sensors. Important sensor technology improvements in infrared imaging technology continue our goals of driving towards larger formats, smaller pixels for superior imaging in various challenging environments. Cyan has recently completed camera upgrades to the optics and imaging capabilities which allow improved imaging at extended ranges.We will review upgraded camera components which enable improved imaging capabilities.
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Author(s): Avi Magid, Lior Shkedy, Nimrod Ben Ari, Niv Shiloah, Claudio G. Jakobson, Willie Freiman, Eran Armon, Ehud Almog, Sivan Srur Nawi, Nati Ashush, Gal Tzvieli, Menashe Alcheck, SCD SemiConductor Devices (Israel); Josh Lazarus, SCD Semi Conductor Devices (Israel); Ori Magril, SCD SemiConductor Devices (Israel); Or Dicker, Benny Milgrom, Israel Ministry of Defense (Israel); Tuvy Markovitz, SCD SemiConductor Devices (Israel)
23 April 2024 • 4:50 PM - 5:10 PM EDT | National Harbor 2
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In modern, wide distribution, defense and commercial applications, such as hand-held cameras and small payload systems, a High Definition (HD) Mid-wave Infrared (MWIR) detector is desired, with low Size Weight and Power (SWaP) and high degree of reliability. To support these requirements, SCD developed the new state-of-the-art Sparrow-HD Focal Plane Array (FPA), with 5um pixel and 1280x1024 format. The FPA includes an advanced Readout Integrated Circuit (ROIC), bonded to a High Operating Temperature (HOT) XBn-InAsSb IR-sensing material that operates at 150K. This material is sensitive to the 'blue' part of the MWIR spectrum where the atmosphere is most transparent. The 5um pitch FPA maintains a similar level of electro-optical performance to SCD's 10um pitch Sparrow 640×512 FPA, including high quantum efficiency, low dark current, low cross talk, high array uniformity, and high operability. The low SWaP FPA enables the use of a highly reliable split-linear cryogenic cooler, and low-power proximity electronics. Hence, the Sparrow HD module is one of the lowest SWaP sensors available in the industry today
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Author(s): Adam Greenen, Andrew Reed, Marcus Lee, Chris D. Maxey, Sudesh K. Bains, Les G. Hipwood, Leonardo UK Ltd. (United Kingdom)
23 April 2024 • 5:10 PM - 5:30 PM EDT | National Harbor 2
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In 2022, Leonardo UK presented the first results from Condor HD, a 12µm MWIR-LWIR Dual Waveband Infra-Red (DWIR) high-performance infrared detector, grown by Metal Organic Vapour Phase Epitaxy (MOVPE) on GaAs substrates. By using a “back-to-back” diode structure, these pixels are spatially coherent, and changing the bias polarity across the stacked diodes provides sensitivity in the desired waveband (in this configuration MWIR or LWIR). This paper discusses further characterisation and development of the CMT structure, demonstrating improvement to spectral bandwidth, QE and MW defects. Leonardo UK have also performed further dark current measurements and spectral crosstalk measurements on these new wafer designs. Direct MTF characterisation (in both the MWIR and LWIR bands) has enabled confirmation that optical crosstalk between neighbouring pixels in-band is equivalent to that seen on single band MWIR and LWIR devices - results of which are reported herein. Retaining the DWB mesa structure also seen on the 24µm Condor II Detector has been key to this.
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Author(s): Nicolas Péré-Laperne, Alexandre Brunner, Gulnar Dagher, Anaïs Saintoyant, Nicolas Morisset, Laurent Rubaldo, Jérôme Coussement, Lynred (France); Axel Evirgen, Jean-Luc Reverchon, Bouzid Simozrag, Michel Garcia, Bruno P. Gérard, III-V Lab. (France); Cyril Cervera, Olivier Gravrand, CEA-LETI (France)
23 April 2024 • 5:30 PM - 5:50 PM EDT | National Harbor 2
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Lynred is leading the development of infrared detectors for high performances applications. Two trends are identified in the infrared range, the increase of the operating temperature and the pixel pitch reduction. For 15 years, the III-V technologies present an increasing interest to address both challenges. At LYNRED, these technologies allow to address Short Wave InfraRed (SWIR) and Mid-Wave InfraRed (MWIR) for ground applications. Many challenges have to be addressed for the future focal plane arrays (FPAs). Electrical and optical crosstalks as well as image quality and stability, are one of the prime concern for detectors with pixel pitch down to 7.5μm. In order to reach an industrial production level of infrared FPAs, technological developments are required at each steps: the epitaxy, the detector array process, flip chip and back end processing. Another key element is the Read Out Integrated Circuit (ROIC) design in-house to fulfil our customer needs. We review the latest developments at LYNRED on III-V technologies focusing on MWIR band, in terms of operability, residual fixed pattern noise (RFPN) and Modulation Transfer Function (MTF) optimizations.
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Author(s): Ruslan Ivanov, Dennis Visser, Sergiy Smuk, Sara Högnadottir, Linda Höglund, Linnea Bendrot, Thierry Kohl, Laura Zurauskaite, Dean Evans, David Rihtnesberg, Dilara Buldu, Anton Smuk, Susanne Sehlin, Susanne Almqvist, Maria Englund, Pia Tinghag, Eric M. Costard, IRnova AB (Sweden)
23 April 2024 • 5:50 PM - 6:10 PM EDT | National Harbor 2
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Thanks to their high technology readiness level, quantum well infrared photodetectors (QWIP) provide an efficient and swift solution for meeting the increased demand for advanced LWIR imaging systems. IRnova’s present portfolio includes QWIP detectors for LWIR dual-colour, gas detection and polarimetric imaging on 30 and 15 µm pitch, while the development of large-format HD arrays on 10 µm pitch is ongoing. In this work, the latest advancements for LWIR QWIP detectors (peak absorption at 8.5 µm) will be presented: firstly, focusing on the progress on HD-format detectors on 10 µm pitch and secondly, presenting the enhanced polarization contrast in IRnova’s VGA-format polarimetric detector Fenrir (640×512 on 15 µm pitch). In the new Fenrir, the polarization contrast has increased from 25 to 40 %, resulting in improved tracing of the polarimetric signatures as visualized by field tests. Furthermore, by employing the developed in-house array-wide pixel-level spectroscopy, excellent spatial uniformity across detector arrays has been confirmed.
Poster Session
23 April 2024 • 6:00 PM - 7:30 PM EDT | Potomac C
Conference attendees are invited to attend the symposium-wide poster session on Tuesday evening. Come view the SPIE DCS posters, enjoy light refreshments, ask questions, and network with colleagues in your field. Authors of poster papers will be present to answer questions concerning their papers. Attendees are required to wear their conference registration badges to the poster session.

Poster Setup: Tuesday 12:00 PM - 5:30 PM
Poster authors, view poster presentation guidelines and set-up instructions at http://spie.org/DCSPosterGuidelines.
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Author(s): Shinpei Ogawa, Masaaki Shimatani, Shoichiro Fukushima, Manabu Iwakawa, Mitsubishi Electric Corp. (Japan)
On demand | Presented live 23 April 2024
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While black phosphorous (BP) is a promising two-dimensional material for next-generation infrared (IR) photodetectors, its enhancement of quantum efficiency remains challenging. Herein, we proposed a hybrid BP-plasmonic nanograting with a high aspect ratio to achieve advanced functional IR photodetectors. Plasmonic nanogratings with high aspect ratios exhibit wide-angle near-unity absorption in the IR-wavelength region, based on the grating depth. By forming BP on top of the plasmonic nanogratings and modifying the edge structure of BP, a strong absorption was achieved by the resulting hybrid structure. The results successfully demonstrate the viability of BP-based high-performance IR photodetectors.
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Author(s): Ching-Fuh Lin, Du-Ting Cheng, Po-Hsien Chiang, National Taiwan Univ. (Taiwan)
On demand | Presented live 23 April 2024
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In our recent investigation, we discovered Si-metal Schottky junction being able to detect mid-infrared spectrum under certain conditions. This work investigates the influence of the hot-carrier diffusion distance on such photodetectors to enhance responsivity in the mid-infrared (MIR) range. Due to the rapid decay characteristics, hot carriers disappear very fast. Thus we control the diffusion distance of hot carriers by varying the thickness of the metal thin film. A proper thickness of the metal boosts the responsivity for nearly 30-fold enhancement. Additionally, a mathematical model is employed to validate experimental results of hot carrier diffusing toward and leaping over the barrier. Furthermore, this research implements back-side illumination, bringing the excited carriers closer to the metal/semiconductor interface. The shortened diffusion distance of hot carriers leads to an increased responsivity in the photodetector within the MIR range. Consequently, it enables the detection of infrared (IR) signals with wavelengths of up to 4.26μm.
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Author(s): Misaki Hanaoka, Shinpei Ogawa, Manabu Iwakawa, Shoichiro Fukushima, Shimatani Masaaki, Mitsubishi Electric Corp. (Japan)
On demand | Presented live 23 April 2024
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Lenses for use in the infrared (IR) wavelength region are key elements of IR image sensors, and determine the cost and performance of such sensors. As an alternative to a conventional lens, we designed and fabricated a Si-based metalens in order to realize a compact, high-performance IR focal plane array (IRFPA) system. The metalens was developed using an automated inverse design technique based on a rigorous coupled wavelength analysis. It consisted of a periodic array of pillars fabricated by deep reactive ion etching of a silicon wafer. This metalens was designed for the 80 × 60 IRFPA used in the Mitsubishi Electric Corporation MIR8060B1, which comprises an array of pn-junction diodes formed on a silicon-on-insulator layer. It is expected that this metalens-based IR sensor will expand the range of applications of such sensors.
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Author(s): Christopher L. Hoy, Meadowlark Optics (United States)
23 April 2024 • 6:00 PM - 7:30 PM EDT | Potomac C
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Liquid crystals provide a means of non-mechanically modulating and steering optical wavefronts. However, optical absorption in both liquid crystal and transparent electrode materials, coupled with slow response times dictated by large cells gaps, make work in the MWIR and LWIR bands challenging. Here we present the latest results in low-loss, high-speed infrared spatial light modulators and non-mechanical beam steering systems developed by Meadowlark Optics and Boulder Nonlinear Systems.
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Author(s): Tomo Tanaka, NEC Corp. (Japan), National Institute of Advanced Industrial Science and Technology (Japan); Shin-ichiro Gozu, National Institute of Advanced Industrial Science and Technology (Japan); Masahiko Sano, NEC Corp. (Japan); Megumi Kanaori, National Institute of Advanced Industrial Science and Technology (Japan); Taizo Shibuya, Yuichi Igarashi, NEC Corp. (Japan), National Institute of Advanced Industrial Science and Technology (Japan); Naoki Oda, NEC Corp. (Japan); Ryota Yuge, NEC Corp. (Japan), National Institute of Advanced Industrial Science and Technology (Japan)
On demand | Presented live 23 April 2024
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We fabricated extended SWIR photodetectors with cutoff wavelength of 2.2 um by using InGaAs/GaAsSb type-II quantum wells as an absorption layer. The 100-pair InGaAs/GaAsSb quantum wells and InGaAs as a cap layer were grown on an n-type InP substrate by molecular-beam epitaxy. The p-n junction was formed by selective zinc diffusion using rapid thermal annealing. For dark current reduction, photodetector with a barrier layer between the absorbing layer and the cap layer was also fabricated. In each device, in addition to absorption in the InGaAs cap layer, absorption which is possibly originating from the quantum well layer was observed in a wavelength range from 1.5 um to 2.2 um. By comparing dark current of each device, dark current reduction by the barrier layer was also confirmed.
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Author(s): Masaaki Shimatani, Shoichiro Fukushima, Manabu Iwakawa, Shinpei Ogawa, Mitsubishi Electric Corp. (Japan)
On demand | Presented live 23 April 2024
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Graphene/semiconductor heterojunction photodiodes that use photogating are expected to perform better than conventional infrared (IR) photodetectors. However, interface instability limits has prevented the realization of the theoretically predicted performance and high reliability for these devices. This study focuses on optimizing the material and thickness of an interfacial layer in a graphene/InSb heterojunction to achieve a high-performance mid-IR photodetector. The results indicate that HfO2 is a more suitable material than Al2O3 for the interfacial layer, and 1-2 nm is the thickness that best promotes effective photocurrent transport. This interfacial layer can facilitate the fabrication of superior IR image sensors based on graphene/InSb heterojunctions.
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Author(s): Yao-Hang Dong, Zih-Chun Su, Po-Hsien Chiang, Ching-Fuh Lin, National Taiwan Univ. (Taiwan)
On demand | Presented live 23 April 2024
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Prior infrared sensing research primarily concentrated on narrow bandgap semiconductors and 2D materials, posing integration challenges with silicon electronics due to lattice mismatch. This study introduces an alternative approach for infrared detection. It employs thin metal/semiconductor Schottky devices to detect mid-infrared light by collecting thermal signals from hot carriers with energy below the Schottky barrier. Experimental results demonstrate successful detection of mid-infrared light at 3.22 µm, 4.28 µm, and 4.83 µm wavelengths, exceeding the Schottky barrier's cutoff wavelength. These Schottky devices exhibit a maximum responsivity of 0.680 mA/W, confirming their efficiency and potential for mid-infrared optical applications.
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Author(s): Young-Ho Kim, i3system, Inc. (Korea, Republic of); Young Tak Roh, Jung O Son, i3system (Korea, Republic of); Sang Soon Yong, Korea Aerospace Research Institute (Korea, Republic of); Han Jung, i3system, Inc. (Korea, Republic of)
On demand | Presented live 23 April 2024
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T2SL(Type II Super Lattice) has become one of the most important material for Infrared detector, which is widely used for small HOT detector and large format LWIR detector. The HOT detector is especally important for small satellite application because HOT detector requires very small volume for infrared imaging at resonable price and lifetime. In this work, the radiation test results of MWIR T2SL nbn detctor will be shown. The TID (Total Ionizing Dose) test result, DD(Displace Damage) test result will be presented. SEE(Single Event Effect) result of the ROIC circuit will also be shown.
Symposium Plenary on AI/ML + Sustainability
24 April 2024 • 8:30 AM - 10:00 AM EDT | Potomac A
Session Chairs: Latasha Solomon, DEVCOM Army Research Lab. (United States), Ann Marie Raynal, Sandia National Labs. (United States)

Welcome and opening remarks
24 April 2024 • 8:30 AM - 8:40 AM EDT

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Author(s): David J. Pierce, U.S. Army Intelligence and Security Command (United States)
24 April 2024 • 8:40 AM - 9:20 AM EDT | Potomac A
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Author(s): Anuradha M. Agarwal, Massachusetts Institute of Technology (United States)
24 April 2024 • 9:20 AM - 10:00 AM EDT | Potomac A
Break
Coffee Break 10:00 AM - 10:30 AM
Session 12: Bjørn Andresen Memorial Session
24 April 2024 • 10:30 AM - 11:30 AM EDT | National Harbor 2
Session Chairs: Gabor F. Fulop, Maxtech International, Inc. (United States), Dario Cabib, CI Systems (Israel) Ltd. (Israel)
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Author(s): Gabor F. Fulop, Maxtech International, Inc. (United States)
24 April 2024 • 10:30 AM - 10:50 AM EDT | National Harbor 2
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Author(s): Dario Cabib, Moshe Elkabets, CI Systems (Israel) Ltd. (Israel)
24 April 2024 • 10:50 AM - 11:10 AM EDT | National Harbor 2
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This is a modular configurable optical system, providing the sensor stimulus to obtain the required quantitative spectral response data of detectors and cameras. The system includes interchangeable sources, Circular Variable Filter scanning monochromator (CVF) and collimating and focusing optics to project monochromatic radiation (in focused or collimated configuration, according to need) towards the sensor. The interchangeable variety of patterns on the focal plane of the collimating optics allow the measurement of the spatial frequency dependence of the sensor MTF as function of wavelength. All wavelength ranges from visible to far infrared are covered with interchangeable CVF's and sources. The system can be configured for detectors' and small aperture camera spectral testing, and combined with a large (up to 16" diameter) collimation system to test large aperture cameras' spectral response and spectral MTF. In this paper we present the system's optical design and examples of measurement results.
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Author(s): Arik Nir, Sagi Zur Arie, Frenel Imaging, Ltd. (Israel)
24 April 2024 • 11:10 AM - 11:30 AM EDT | National Harbor 2
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The polarimetric thermal imaging framework offers comprehensive capabilities that can significantly enhance operations within the Defense and Security sectors. The combination of polarimetry and thermal imaging brings several advantages that can dramatically impact various aspects of the security and defense sectors. Polarimetry provides a new set of capabilities due to the nature of the data received from the sensors, coupled with the ability to process such received data. We all know the thermal world when temperature and emissivity are processed to a temperature map and converted to a thermal image. This, though, has its limitations in many applications when the underlined reliance on temperature is challenged when the addressed object is represented in a small number of pixels and or its background is “noisy” or represents a cluttery scene. The polarimetric thermal imaging framework offers comprehensive capabilities that can significantly enhance operations within the Defense and Security sectors. The combination of polarimetry and thermal imaging brings several advantages that can dramatically impact various aspects of the security and defense sectors.
Break
Lunch/Exhibition Break 11:30 AM - 1:20 PM
Session 13: Artificial Intelligence and Deep Learning: Joint Session with Conferences 13039 and 13046
24 April 2024 • 1:20 PM - 3:20 PM EDT | National Harbor 2
Session Chairs: Michael T. Eismann, Air Force Research Lab. (United States), Kenny Chen, Lockheed Martin Missiles and Fire Control (United States)
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Author(s): Abhijit Bhattacharjee, Birju Patel, Alexander Taylor, The MathWorks, Inc. (United States); Joseph A. Rivera, Lockheed Martin Corp. (United States)
24 April 2024 • 1:20 PM - 1:40 PM EDT | National Harbor 2
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We present a streamlined pipeline that generates a YOLO object detection application using MATLAB and NVIDIA hardware. The application utilizes MATLAB’s GPU Coder toolbox and NVIDIA TensorRT to accelerate inferencing on NVIDIA processors, specifically the latest Jetson Orin embedded processor. We evaluated the object detector on the open U.S. Army Automated Target Recognition (ATR) Development Image Dataset (ADID) for multi-class vehicle detection and classification. Overall, this workflow decreases development time over traditional approaches and provides a quick route to low-code deployment on the latest NVIDIA Jetson Orin. This work offers value to researchers and practitioners aiming to harness the power of NVIDIA processors for rapid, efficient object detection solutions.
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Author(s): Shotaro Miwa, Shun Otsubo, Jia Qu, Yasuaki Susumu, Mitsubishi Electric Corp. (Japan)
24 April 2024 • 1:40 PM - 2:00 PM EDT | National Harbor 2
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Traditionally, computer vision systems, like object detection, primarily relied on supervised learning and predetermined object categories. However, this approach's limitations in terms of generality and the need for additional labeled data are more pronounced for infrared images due to the difficulty of obtaining training datasets. In contrast, the rise of contrastive vision-language models, such as CLIP, has transformed the field. These models, pre-trained on vast image-text pairs, offer more versatile visual representations aligned with rich language semantics. CLIP's feature transferability has become a foundation for various visible image tasks. This paper introduces zero-shot object detection for infrared images using pre-trained vision and language models, extending CLIP's benefits to this domain. Experimental results show the promise of this approach, and the paper initiates a preliminary exploration of domain shift issues between infrared and visible images.
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Author(s): Art Stout, Kedar Madineni, Teledyne FLIR LLC (United States)
24 April 2024 • 2:00 PM - 2:20 PM EDT | National Harbor 2
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The availability of high power mobile processors designed for embedded products featuring multiple compute cores including CPUs, GPUs, DSPs and ISPs enables system developers the ability to integrated software capabilities never possible on embedded processors. Mobile processors from Qualcomm and NVIDIA now feature 50 TOPS compute power while operating on as low as 5 watts. Teledyne FLIR will describe the creation of libraries compiled to run Qualcomm Open CL and NVIDIA CUDA based hardware.
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Author(s): Sophia P. Bragdon, Vuong H. Truong, Andrew C. Trautz, Matthew D. Bray, Jay L. Clausen, U.S. Army Engineer Research and Development Ctr. (United States)
24 April 2024 • 2:20 PM - 2:40 PM EDT | National Harbor 2
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Automatic target recognition (ATR) algorithms that rely on machine learning approaches are limited by the quality of the training dataset and the out-of-domain performance. The performance of a two-step ATR algorithm that on fusing thermal imagery with environmental data is investigated using thermal imagery containing buried and surface object collected in New Hampshire, Mississippi, Arizona, and Panama. A autoencoder neural network is used to encode the salient environmental conditions for a given climatic condition into an environmental feature vector. The environmental feature vector allows for the inclusion of environmental data with varying dimensions to robustly treat missing data. Using this architecture, we evaluate the performance of the two-step ATR on a test dataset collected in an unseen climatic condition, e.g., tropical wet climate when the training dataset contains imagery collected in a similar condition, e.g., subtropical, and dissimilar climates. Lastly, it is shown that performance for out-of-domain climates can be further improved by incorporating physics-based synthetic data into the training dataset.
13039-29
Author(s): Jacob Ross, Rajith Weerasinghe, Justin Lastrapes, Ryan J. Shaver, Etegent Technologies, Ltd. (United States); Paul Sotirelis, Air Force Research Lab. (United States)
24 April 2024 • 2:40 PM - 3:00 PM EDT | National Harbor 2
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Traditional data collects of high priority targets require immense planning and resources. When novel operating conditions (OCs) or imaging parameters need to be explored, typically synthetic simulations are leveraged. While synthetic data can be used to assess automatic target recognitions (ATR) algorithms; some simulation environments may inaccurately represent sensor phenomenology. To levitate this issue, a scale model approach is utilized to provide accurate data in a laboratory setting. This work demonstrates the effectiveness of a resource cognizant approach for collecting IR imagery suitable to assessing ATR algorithms. A target of is interest is 3D printed at 1/60th scale with a commercial printer and readily available materials. The printed models are imaged with a commercially available IR camera in a simple laboratory setup. The collected imagery is used to test ATR algorithms when trained on a standard IR ATR dataset; the publicly available ARL Comanche FLIR dataset. The performance of the selected ATR algorithms when given sampled of scale model data is compared to the performance of the same algorithms when using the provided measured data
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Author(s): Jeremy W. Mares, Mark Martino, Alex R. Irwin, Christopher K. Renshaw, CREOL, The College of Optics and Photonics, Univ. of Central Florida (United States)
24 April 2024 • 3:00 PM - 3:20 PM EDT | National Harbor 2
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The ability to accurately ascertain an observer’s position directly from imaged scenery is an important technological capacity, especially in light of the susceptibility of global positioning system (GPS) signals to interference. Horizon matching is a technique that shows promise as a method of self-localization in regions with sufficiently rich topography. By utilizing preexisting digital elevation data, simulated imagery of horizon contours and other landscape features is first generated. Real imagery is then processed to extract these features, and they are compared and analytically fitted to simulation in order to back-calculate the imager position. Here, we demonstrate this functionality with a vehicle-integrated, gimbal mounted multi-band imaging platform that facilitates platform geopositioning with visible, NIR, SWIR, MWIR and LWIR imagers. We compare the benefits and limitations of these bands, evaluating their localization accuracies given competing range performance, image resolution, and target-to-background contrast.
Break
Coffee Break 3:20 PM - 3:50 PM
Session 14: Sensors Technologies
24 April 2024 • 3:50 PM - 4:50 PM EDT | National Harbor 2
Session Chair: Masafumi Kimata
13046-46
Author(s): Henry Yuan, Kelly Bartholomew, Devon Myers, Carl Meyer, Angela Russell, Joyce Laquindanum, Ravi K. Guntupalli, Teledyne Judson Technologies (United States); Borzoyeh Shojaei, Christopher Chen, Shumin Wang, Bill Conroy, Aristo Yulius, Michael Carmody, Teledyne Imaging Sensors (United States)
24 April 2024 • 3:50 PM - 4:10 PM EDT | National Harbor 2
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Leveraging the state-of-the-art HgCdTe molecular beam epitaxy (MBE) material technology at Teledyne Imaging Sensors (TIS), VLWIR HgCdTe PC detectors of the cutoff wavelength (10-15% of peak) ~17μm at LN2 temperature have been developed recently at Teledyne Judson Technologies (TJT) using TIS MBE material and are now in volume production. In comparison with the conventional PC detectors made from bulk materials, these VLWIR MBE PC detectors show better performance uniformity in cutoff wavelength, detectivity D*, spectral responsivity, etc., as well as lower 1/f noise and channeling effect (smoother spectra). In addition, MBE wafers are especially suitable for volume production, array products and large size detectors, due to its much larger wafer size (typically 2”x2” at present) compared to the bulk wafer size of typically ~15mm dia.
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Author(s): Vicky Zhang, Jongwoo Kim, Henry Yuan, John Clark, Mike R. Meixell, Carl Meyer, Witold Czelen, Eli Sullivan, Gary Apgar, Jeremy Palmer, Joyce Laquindanum, Ravi Guntupalli, Teledyne Judson Technologies (United States)
24 April 2024 • 4:10 PM - 4:30 PM EDT | National Harbor 2
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InAs is a very attractive material for high performance transistors, optical applications, and chemical sensing. However, it has been very challenging to achieve high stability surface passivation layer over InAs due to the very high leaky InAs and passivation interface. Various passivation method attempts in the past were not successful at TJT as they all caused significant degradation of InAs detector performance. As a result, no surface passivation has been used for TJT standard InAs photodetectors until now. In this paper, we report for the first time a successful development of a new surface passivation process that is suitable for TJT InAs mesa photodetectors. This passivation did not cause InAs detector performance degradation and showed good stability and process compatibility with the detector assembly/packaging processes. Etching methods have been evaluated and applied to form InAs MESA photodiodes. Afterwards, multiple paths for surface treatment and passivation, have been compared and applied to the as developed photodiodes. By optimization of passivation process, the significantly improved device performance stability has been achieved and presented in this paper.
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Author(s): Arash Dehzangi, Northwestern Univ. (United States), Defense Advanced Research Projects Agency (United States), ECS Federal, LLC (United States); Hooman Mohseni, Northwestern Univ. (United States)
24 April 2024 • 4:30 PM - 4:50 PM EDT | National Harbor 2
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There has been a tremendous amount of research on two dimensional materials (2DMs) in recent years, suggesting their unique properties for optoelectronic devices. While a good momentum on implementing 2DMs for photodetection for visible and infrared (IR) photon detection exists, progress on demonstration of imaging systems based on these material have been slow. Most of reported studies have been based on single-pixel devices, which is unable to compete with the quantity and quality of information provided by massively parallelized mega-pixel imagers based on complementary metal-oxide semiconductor (CMOS) readout electronics. In this paper, we explore opportunities for achieving reliable and high-resolution FPA cameras using 2DMs. We will cover most relevant new materials in the field and cover photodetection methods. Our goal is to address the opportunities and challenges of using 2DMs for future imaging systems and their integration with CMOS electronics in a condensed form.
Session 15: ROIC
25 April 2024 • 8:50 AM - 9:50 AM EDT | National Harbor 5
Session Chair: Arjun Kar-Roy, Tower Semiconductor USA Inc. (United States)
Note room change for Thursday.
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Author(s): David Howard, Arjun KarRoy, Michael Scott, Tower Semiconductor Ltd. (United States)
25 April 2024 • 8:50 AM - 9:10 AM EDT | National Harbor 5
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A 65nm node RF & Analog CMOS process is described with advanced features for use in next generation ROICs. This process is in a unique position to enable both digital pixel ROICs and conventional ROIC architectures. The production process exists in a high-volume commercial fabrication facility and is being offered to aerospace and defense customers. Features to enable large array formats, such as stitching, up to nine layers of metal, low voltage operation are included, as well as multiple analog FETs, in particular low leakage, spanning low voltage up to 5V. Several analog features such resistors and MIM capacitors, and reconfigurable elements such as memory, e-fuse, will also be described. The platform process and device features, and special PDK features such as cryo models, will be related to select circuit block functions and requirements for large format applications such as cooled and uncooled ROICs.
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Author(s): Thomas Poonnen, Kendall Esparza, Sean McCotter, Brian Ratledge, William Z. Korth, Nishant Dhawan, Kenton T. Veeder, Senseeker Engineering Inc. (United States)
25 April 2024 • 9:10 AM - 9:30 AM EDT | National Harbor 5
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Indium gallium arsenide and colloidal quantum dot SWIR sensors can produce stronger contrast imagery than their visible counterparts due to the reduced scattering in the SWIR band. A 640 x 512 format, 10 μm pixel pitch low-noise high-sensitivity DROIC, with a capacitive transimpedance amplifier pixel front end, for SWIR imaging is presented. This DROIC has variable gain pixels with well capacities of approximately 22 ke- in high gain, 160 ke- in mid gain and 1.1 Me- in low gain. The readout boasts a low read noise of only 15 e- rms at room temperature in high gain with correlated double sampling. This DROIC can run at 700 fps full frame and 8.9 kfps for 32 x 32 window.
13046-53
Author(s): Thomas Poonnen, William Z. Korth, Senseeker Engineering Inc. (United States)
25 April 2024 • 9:30 AM - 9:50 AM EDT | National Harbor 5
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In conventional IRST systems, hot targets are periodically searched in a wide field of view cold background and any threats identified are then tracked using very narrow field of view windows. This sequential and discontinuous search-now track-later, track-now search-later operation is effective only for relatively fixed background scenes with very few threats. In the proposed ROIC pixel array for advanced IRST, individual pixels communicate potential threats locally in a swarm intelligent manner to accomplish simultaneous and continuous search and track globally across the entire field of view. This search-now track-now operation of the swarm intelligent ROIC pixel array for advanced IRST is demonstrated using simulations and processed imagery.
Break
Coffee Break 9:50 AM - 10:20 AM
Panel Discussion: Cryogenic Technologies
25 April 2024 • 10:20 AM - 11:30 AM EDT | National Harbor 5

Note room change for Thursday.

View Full Details: spie.org/dcs/cryogenic-panel

Join this panel comprising top-level users and customers of cryogenic technology. The objective is to provide users with a platform to express their wish-lists, forecasts, and future needs.

Moderator:
Eric Costard, CTO, IRnova AB (Sweden)

Panelists:
Rob Wilson, Head of Research and Development, Leonardo Electronics (United Kingdom)
Chris Alicandro, Senior Director of Sales, Teledyne FLIR-Components (United States)
Ed Huang, Sr. Director Cooled Products and Programs, Attollo Engineering, LLC (United States)
David Billon-Lanfrey, Strategy Director, Lynred (France)
Holger Lutz, Head of System Design, AIM Infrarot Module (Germany)
An-Jong Kang, Director of Cooled Detector Division, i3system, Inc. (Korea, Republic of)
Oğuz Altun, Director, ASELSAN A.S. (Turkey)
Carl S. Kirkconnell, President, West Coast Solutions (United States)

Break
Lunch/Exhibition Break 11:30 AM - 1:00 PM
Session 16: Cryocoolers I
25 April 2024 • 1:00 PM - 3:00 PM EDT | National Harbor 5
Session Chairs: Alexander Veprik, Cryo Tech Ltd. (Israel), Christophe Vasse, Thales LAS France SAS (France)
Note room change for Thursday.
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Author(s): Klemen Dovrtel, Aljaz Osterman, Le-Tehnika d.o.o. (Slovenia)
25 April 2024 • 1:00 PM - 1:20 PM EDT | National Harbor 5
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The paper presents two approaches to reduce vibrations in miniature integral Striling cryocoolers. Approaches were applied to cryocoolers developed and produced by LE-TEHNIKA. First, research done on a linear cryocooler is presented where vibrations were reduced with a passive damper, comprising of a vibrating mass and a spring. Importance of damper eigenfrequency and mass with regard to damper efficiency is discussed. Next, research done on a rotary cryocooler is presented where vibrations were reduced by using two balancing masses on a shaft. Vibrations were measured at different speeds. Measurements are presented as absolute values and in spectral domain, in both cases clear improvements can be seen.
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Author(s): Franc Megušar, Marko Cuderman, Le-Tehnika d.o.o. (Slovenia)
25 April 2024 • 1:20 PM - 1:40 PM EDT | National Harbor 5
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The paper presents two approaches to address the possibility of cooling the IR detectors working at temperatures higher than 100K. First part of research done on achieving required temperature only by finding the working gas with liquefaction point in the same range and tune the JT cooler HE and nozzle accordingly will be presented. Part of the focus will be also on cool down times comparison of such system toward a classical one using argon or air on DDA with similar thermal mass. The second approach which will be presented is the use of unique Actively controlled JT cooler to work at different IR detector cryostating temperatures above100K and also all the challenges which are associated with presented approach.
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Author(s): Christophe Vasse, Sylvain Lassalle, Simon-Didier Venzal, Emilien Durupt, Thales LAS France SAS (France)
25 April 2024 • 1:40 PM - 2:00 PM EDT | National Harbor 5
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Increasing the cooler reliability becomes a challenge when the times come to validate evolutions. Indeed, lifetime tests are necessary before releasing an evolution but it is necessary to wait the end of the tests. The paper will focus on the latest works made at Thales on rotary coolers in the frame of lifetime acceleration tests.
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Author(s): Martin Hübner, Oliver Tscherwitschke, Roland Hanslick, HENSOLDT Optronics GmbH (Germany); Ori Sela, Avishai Filis, Lavenda Sigal, RICOR Cryogenic & Vacuum Systems (Israel)
25 April 2024 • 2:00 PM - 2:20 PM EDT | National Harbor 5
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In 2018 we presented the idea of a shock-pulse detection sensor for detecting damage inside the mechanics of rotary Stirling coolers in infrared detectors with the intention to implement preventive maintenance, based on significantly better end of lifetime (EOL) prediction as compared to MTTF statistics. In the meantime we developed an Integrated Sensors Board (ISB) in combination with commercial ultrasound (>20kHz) sensitive MEMS, supposed to be used in cooled IR imagers, especially for 24/7 applications. We report on the electronic signal and data processing design and layout, where effective data reduction and analysis is applied down to the calculation of relevant state of wear figures for the definition of an effective lifetime model, especially for the bearings on the coolers compressor . As part of RICOR’s goals to add the ability of failure prediction to its coolers, for improving customer’s Life Cycle Cost (LCC) , tests were performed with the ISB and they show a clear indication of relevant state of wear figures.
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Author(s): Andreas Fiedler, Vince Loung, Michael Costolo, Edward Huang, Michael H. MacDougal, Attollo Engineering, LLC (United States)
25 April 2024 • 2:20 PM - 2:40 PM EDT | National Harbor 5
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Cryocoolers are needed in modern high-performance infrared cameras to establish and maintain the cryogenic temperature of infrared focal plane arrays. Attollo has a number of cryocooler development efforts ranging from low SWaP linear microcoolers for HOT MWIR sensors to high lift, high reliability coolers for 80K operation. In the case of cryocoolers designed for HOT MWIR applications, Attollo is also developing low-cost designs to address the attritable platform market. Attollo will present an overview of these design programs and data on the performance of initial units.
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Author(s): Carl S. Kirkconnell, Jason M. Baxter, Robert C. Hon, Cassie K. Smith, Leon Huynh, West Coast Solutions (United States); James Gregoire, Creare (United States); Richard W. Kaszeta, Creare, LLC (United States); Jeffrey R. Olson, Eric Roth, Lockheed Martin Space Systems Co. (United States)
25 April 2024 • 2:40 PM - 3:00 PM EDT | National Harbor 5
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Increasing interest in flying infrared sensor payloads on small satellites is driving the need for small scale, low input power (say, < 40W) cryocooler systems. Lockheed Martin has developed a miniature pulse tube cryocooler well-suited to meet the aggressive performance and packaging requirements for a small satellite infrared payload. Up until now, the space industry has lacked suitably matched small, radiation tolerant cryocooler control electronics to drive such cryocoolers. West Coast Solutions, in collaboration with Creare, has recently completed the design, build, test, and environmental qualification of a new product dubbed the Compact Cryocooler Control Electronics (C3E), which has been architected from the bottom up with a focus of minimizing packaging volume. The result is a new generation of small satellite cryocooler electronics weighing less than 360 grams. In addition to the environmental testing, integrated thermal vacuum testing was performed with the C3E and the Micro1-2 Lockheed Martin Microcryocooler. A design overview of C3E and the qualification and integrated cryocooler test results are presented.
Break
Coffee Break 3:00 PM - 3:30 PM
Session 17: Cryocoolers II
25 April 2024 • 3:30 PM - 5:20 PM EDT | National Harbor 5
Session Chairs: Andreas Fiedler, Attollo Engineering, LLC (United States), Alexander Veprik, Cryo Tech Ltd. (Israel)
Note room change for Thursday.
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Author(s): Alexander Veprik, Cryo Tech Ltd. (Israel); Vladimir I. Babitsky, Loughborough Univ. (United Kingdom); Rami Refaeli, Samuel Kurucz, Leonid Bunin, Cryo Tech Ltd. (Israel)
25 April 2024 • 3:30 PM - 4:00 PM EDT | National Harbor 5
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The vibration resulting from an imbalanced motion of piston and displacer assemblies within Stirling linear cryocoolers poses significant challenges in the context of long-range, high-resolution, and low Size, Weight, and Power (SWaP) handheld and gyro-stabilized infrared imagers. Addressing this challenge, CryoTech has introduced an innovative and cost-effective micro-miniature split Stirling cryocooler featuring a single-piston compressor and a pneumatic expander, the vibration export of which has been effectively reduced at the source by substantially decreasing the weight of the moving assemblies. For vibration-sensitive applications, the authors provide an optional Tuned Dynamic Counterbalancer featuring a linear failure-free magnetic spring. This patent-pending solution enables not only a failure-free operation of a substantially lighter device but also leads to a substantial reduction in the damping ratio, thereby additionally enhancing the vibration attenuation ratio at the driving frequency. The authors provide a comprehensive overview of the outcomes derived from a thorough feasibility study, encompassing both theoretical analysis and full-scale experimentation.
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Author(s): Jason M. Baxter, Carl S. Kirkconnell, Robert C. Hon, Nico G. Italia, Cassie K. Smith, Wyatt J. Jackson, West Coast Solutions (United States); James F. Gregoire, Creare LLC (United States); Richard W. Kaszeta, Creare LLC (United States), Creare LLC (United States); Matthew C. Okabue, Michael B. Petach, Northrop Grumman Corp. (United States)
25 April 2024 • 4:00 PM - 4:20 PM EDT | National Harbor 5
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In a companion paper in this session, the performance characteristics and Flight Qualification results for the Compact Cryocooler Control Electronics (C3E) are described. This paper describes a variant of the C3E optimized for higher power applications requiring additional mission assurance features. While applicable to essentially any Stirling or pulse tube cryocooler in the 50W and lower power class, this version of the C3E is being developed for and in collaboration with Northrop Grumman to provide flight electronics for the MicroCooler Pulse Tube Cryocooler (MicroCooler). This version has therefore been dubbed the “C3E-PT.” The C3E-PT extends on the success of the C3E by increasing the power handling capability to above 50 WAC for bus voltages as low as 22 VDC to take better advantage of the available cooling power from the MicroCooler. In addition, features have been added to protect the cryocooler in the event of a C3E-PT or bus transient, say due to a single event upset (SEU). New capabilities include provision for a knock sensor and clock synchronization between multiple C3E-PTs. Details of these new features and progress in the development effort are discussed.
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Author(s): Roel Arts, Daniel Willems, Jeroen C. Mullié, Garmt de Jonge, Stephan Olmanst, Jimmy Wade, Thales Cryogenics B.V. (Netherlands)
25 April 2024 • 4:20 PM - 4:40 PM EDT | National Harbor 5
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Thales Cryogenics will present a new product in its portfolio which leverages the reliability of the pulse-tube cooler, which has shown to be better than 99% reliability after 10 years of operation. This new product development was aimed specifically at IDCA applications. Design choices and test results will be presented.
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Author(s): James Zhan, KT Photonics Inc. (Canada)
25 April 2024 • 4:40 PM - 5:00 PM EDT | National Harbor 5
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Due to its relatively short history, high operating temperature (HOT) cooled IDDCA’s MTTF value testing results are difficult to obtain and hard to predict or estimate. However, many cryocooler manufacturers in the market already have and can provide cyrocooler’s MTTF testing data at 77K or 80K operating temperatures. We conducted tests of IDDCA at various high operating temperature settings and measured coolers running speeds. We then applied calculation methods to calculate and predict its MTTF based on 77K test results and measured cooler rotational speeds at different operating temperatures and cooler settings. We conduct integration of cryocoolers with detectors and dewars and have found such predictions can be used as good reference for cooler MTTF predictions at a particular high operating temperature.
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Author(s): Marcel Nussberger, Carsten Rosenhagen, Markus Mai, Andreas Withopf, Johannes Rapp, Ingo N. Rühlich, AIM INFRAROT-MODULE GmbH (Germany)
25 April 2024 • 5:00 PM - 5:20 PM EDT | National Harbor 5
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Since more than 15 years, AIM is developing and fabricating dual opposed piston linear coolers with moving magnet motors. Key advantage of such coolers are high MTTF and thus low total cost of ownership, low exported vibration and modular and geometrical flexibility. SX035 compressor and 6mm standard coldfinger are in serial production for several production programs. AIM will report on recent product improvements with regard to harsh environments (high ambient temperatures, random vibrations and constant accelerations) and performance enhancements. These changes include compressor, regenerator and cooler drive electronics.
Digital Posters
The posters listed below are available exclusively for online viewing during the week of SPIE Defense + Commercial Sensing 2024.
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Author(s): Khaled Obaideen, Mohammad A. AlShabi, Talal Bonny, Univ. of Sharjah (United Arab Emirates)
On demand | Presenting live 25 April 2024
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The incorporation of graphene, known for its outstanding electrical, mechanical, and thermal characteristics, with infrared (IR) technology, has emerged as a promising research domain with potential applications spanning environmental monitoring, healthcare diagnostics, and security enhancements. Through a bibliometric analysis of a vast array of recent publications, this study examines the growth, trends, and pivotal contributors in the field of graphene-IR research. Our findings demonstrate a significant increase in research activities, highlighting the field's growing importance in the development of sensors, modulators, and detectors leveraging graphene. This research is identified as inherently interdisciplinary, merging insights from materials science, photonics, and nanotechnology. A notable transition is observed from theoretical research towards practical applications, with an emphasis on the healthcare and defense industries, reflecting a broader interest in graphene-IR devices' performance enhancement. The analysis also points to an expanding research landscape that includes the exploration of other two-dimensional materials and the innovation of new device structures.
Conference Chair
Maxtech International, Inc. (United States), Infrared Imaging News (United States)
Conference Chair
Attollo Engineering, LLC (United States)
Conference Chair
Jet Propulsion Lab. (United States)
Conference Co-Chair
Consultant (Japan)
Program Committee
Mikro-Tasarim Elektronik San. ve Tic. A.S. (Turkey), Middle East Technical Univ. (Turkey)
Program Committee
ASELSAN A.S. (Turkey)
Program Committee
Thales (France)
Program Committee
BAE Systems (United States)
Program Committee
AIM INFRAROT-MODULE GmbH (Germany)
Program Committee
Cyan Systems, Inc. (United States)
Program Committee
Raytheon Technologies Corp. (United States)
Program Committee
IRnova AB (Sweden)
Program Committee
Air Force Research Lab. (United States)
Program Committee
Princeton Infrared Technologies, Inc. (United States)
Program Committee
Leonardo UK Ltd. (United Kingdom)
Program Committee
U.S. Army CCDC C5ISR Ctr. Night Vision & Electronic Sensors Directorate (United States)
Program Committee
Jet Propulsion Lab. (United States)
Program Committee
Consultant (United States)
Program Committee
Tower Semiconductor USA Inc. (United States)
Program Committee
Anduril Industries, Inc. (United States)
Program Committee
i3system, Inc. (Korea, Republic of)
Program Committee
SCD SemiConductor Devices (Israel)
Program Committee
Electro-optic Sensor Design (Australia)
Program Committee
Sensors Unlimited, a Collins Aerospace Co. (United States)
Program Committee
Defense Advanced Research Projects Agency (United States)
Program Committee
Cascade Electro-Optics, LLC (United States)
Program Committee
HENSOLDT Optronics GmbH (Germany)
Program Committee
HRL Labs., LLC (United States)
Program Committee
Mitsubishi Electric Corp. (Japan)
Program Committee
Leonardo DRS (United States)
Program Committee
Northwestern Univ. (United States)
Program Committee
U.S. Army CCDC C5ISR Ctr. Night Vision & Electronic Sensors Directorate (United States)
Program Committee
Air Force Research Lab. (United States)
Program Committee
Wojskowa Akademia Techniczna im. Jaroslawa Dabrowskiego (Poland)
Program Committee
Lynred (France)
Program Committee
DRS Network & Imaging Systems, LLC (United States)
Program Committee
DEVCOM Army Research Lab. (United States)
Program Committee
L3Harris Technologies, Inc. (United States)
Program Committee
Thales LAS France SAS (France)
Program Committee
Cryo Tech Ltd. (Israel)
Program Committee
Teledyne FLIR LLC (United States)