Terahertz time-domain spectroscopy (THz-TDS) fingerprinting for integrated circuit (IC) identification in tracking and tracing applications

In response to the hardware assurance concerns arising from the global offshore fabrication of IC packaging, this research focuses on creating a unique THz-TDS 'fingerprint' for each IC sample. This approach shifts the emphasis from detecting anomalies in packaging to ensuring the hardware's integrity through fingerprinting. The study utilizes both supervised and unsupervised machine learning models to assess the effectiveness of THz-TDS 'fingerprinting' for IC sample identification. Additionally, it examines the tolerance levels in THz-TDS data collection across various IC packaging types. The research involves collecting THz-TDS data from diverse IC packaging samples at multiple locations, aiming to determine how these variables affect the accuracy of sample identification.