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23 - 27 February 2025
San Jose, California, US
Conference 13427 > Paper 13427-9
Paper 13427-9

The roads toward a sustainable semiconductor industry (Keynote Presentation)

24 February 2025 • 3:50 PM - 4:30 PM PST

Abstract

The semiconductor industry must address the dual impact of digital technology with a comprehensive approach to overcome growth challenges while ensuring sustainability. This approach is crucial for balancing the environmental benefits and demands of rapid technological expansion. To support this, several collaborative programs funded by Horizon Europe are focusing on making semiconductor manufacturing more sustainable. These initiatives aim to align with the European Green Deal by implementing eco-friendly technologies and practices. By integrating innovations and adopting sustainable processes, the industry can reduce its environmental footprint and advance towards long-term sustainability. This holistic strategy will enable the semiconductor sector to meet its growth objectives while addressing increasing environmental constraints effectively.

Presenter

CEA-LETI (France)
Laurent Pain is graduated from the Ecole Nationale Supérieure de Physique de Grenoble in 1992. He received his Ph D after his work on DUV resists study. He joined CEA-LETI in 1996 to work on infra-red technology, and then came back to STmicroelectronics in 1999 working on 193nm and e-beam lithography technologies. From 2008 to 2014, Laurent Pain leaded the lithography laboratory of the silicon technology division of CEA-LETI. He was also managing in parallel the industrial consortium IMAGINE dedicated to the development of multibeam lithography with MAPPER lithography BV. From July 2014 to Sept 2023, within the LETI Silicon Technology Division, he was in charge of the business and the partnerships developments. Since Sept 2023, Laurent PAIN has been appointed as Director of the Sustainability and Eco-innovation program of CEA-Leti where he is in charge to deploy internally and externally collaborative programs and partnerships to support the necessary transition of semiconductor tec
Application tracks: Sustainability , Advanced Packaging
Presenter/Author
CEA-LETI (France)