A study on mechanical processing characteristics of Si grating

We conducted a mechanical processing experiment on a grid pattern to use Si material, which has low mechanical processing properties, as a grating spectroscopic device. Cutting was performed using ultra-precision grooving equipment with the shape of the tool, feed speed, and depth of cut as variables. The quantitative indicator is the surface roughness of the pattern surface, and each measurement area was measured repeatedly using a white light interferometer. As a result of these results, we analyzed the tendency of surface roughness according to processing conditions.