Anthony Yen leads ASML's Technology Development Center. From 2006 to 2017, he was with TSMC where he led the development of EUV lithography, including its mask technology, for high-volume manufacturing. The joint TSMC-ASML team realized, first time in the field, an EUV power of 90W in the fall of 2014 and an average throughput of 500 wafers per day for four consecutive weeks in the summer of 2015. From 1991 to 1997, as Member of Technical Staff at Texas Instruments, he worked on techniques to extend the practical resolution of sub-half-micron lithography and was an early investigator of optical proximity effects and their correction. From 1997 to 2003, he was with TSMC where he first led the development of lithography processes for TSMC's 0.25, 0.18, 0.15, and 0.13 micron generations of logic integrated circuits, making TSMC the first company to use 193-nm lithography in high-volume manufacturing, and then co-led infrastructure development for next-generation-lithography technologies at SEMATECH. Tony received his BSEE degree from Purdue University and his SM, EE, PhD, and MBA degrees from MIT. He has over 100 US patents and nearly 100 publications on the patterning of semiconductor devices and circuits. He is a fellow of SPIE and IEEE, and a recipient of the Outstanding Electrical and Computer Engineer award from Purdue University.

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