
Proceedings Paper
Damage detection using piezoelectric impedance approach with inductive circuitryFormat | Member Price | Non-Member Price |
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Paper Abstract
The impedance-based damage detection has been recognized to be sensitive to small-sized damage due to its highfrequency
measurement capability. Low-cost impedance measurement circuit has been explored to extract the
piezoelectric impedance/admittance curves by using a resistor that is serially connected with the piezoelectric transducer,
which enables a self-contained sensor unit. In this research, an innovative impedance-based damage detection scheme
is proposed, which combines the key features of the low-cost impedance measurement circuit with those of the
piezoelectric circuitry dynamics. In the new scheme, the piezoelectric transducer is integrated with an inductive circuit.
The resonant effect of the inductive circuitry can greatly increase the measurement amplitude. Moreover, when the
inductance is properly tuned, very significant dynamic interaction between the mechanical structure being monitored
and the electrical circuitry will occur. This results in an order-of-magnitude amplification of the admittance change
upon the occurrence of damage, which can yield much increased damage detection sensitivity. Extensive numerical and
experimental investigations are carried out to demonstrate the new sensing system development.
Paper Details
Date Published: 30 March 2009
PDF: 14 pages
Proc. SPIE 7292, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009, 72921B (30 March 2009); doi: 10.1117/12.816137
Published in SPIE Proceedings Vol. 7292:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009
Masayoshi Tomizuka, Editor(s)
PDF: 14 pages
Proc. SPIE 7292, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009, 72921B (30 March 2009); doi: 10.1117/12.816137
Show Author Affiliations
X. Wang, Univ. of Connecticut (United States)
J. Tang, Univ. of Connecticut (United States)
Published in SPIE Proceedings Vol. 7292:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009
Masayoshi Tomizuka, Editor(s)
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