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Proceedings Paper

Packaged MEMS and MOEMS measurement using through-transmissive-media (TTM) profiler
Author(s): Sen Han
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Paper Abstract

Interferometric surface profiling, which combines high speed, accuracy, resolution and flexibility, has proven successful for measuring surface features of unpackaged MEMS (Micro-Electro-Mechanical Systems) and MOEMS (Micro-Opto-Electro-Mechanical Systems) devices. With the further productization of MEMS technology, however, devices also need to be tested in their final packaged state, typically beneath a protective, transparent cover. Objectives capable of imaging through transparent media at low magnifications have been available for several years. Increasingly, however, higher magnifications are required to resolve smaller critical features. At high magnifications, transmissive media can greatly degrade interferometric measurements due to dispersion and aberration effects. In this paper we describe an improved technique for measuring MEMS features through transmissive media, at magnifications as high as 40X. The technique enables improved dispersion compensation, reduced coherence effects, thickness variation insensitivity, and enhanced illumination. Measurement results are presented.

Paper Details

Date Published: 7 February 2006
PDF: 5 pages
Proc. SPIE 6032, ICO20: MEMS, MOEMS, and NEMS, 603203 (7 February 2006); doi: 10.1117/12.667846
Show Author Affiliations
Sen Han, Veeco Metrology (United States)


Published in SPIE Proceedings Vol. 6032:
ICO20: MEMS, MOEMS, and NEMS
Masayoshi Esashi; Zhaoying Zhou, Editor(s)

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