Share Email Print
cover

Proceedings Paper

Microregion stress measurement of wafer
Author(s): Shouyong Ni; Hongmin Shi; Lei Fu; Yaodong Lu
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

A method based on birefringence principle of micro-region stress measurement is presented in this article. Frequency analysis of Fourier transform is used in data processing. This measurement system has the merits of high sensitivity and automatic data processing.

Paper Details

Date Published: 29 May 2002
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468854
Show Author Affiliations
Shouyong Ni, Beijing Institute of Opto-Electronic Technology (China)
Hongmin Shi, Beijing Institute of Opto-Electronic Technology (China)
Lei Fu, Beijing Institute of Opto-Electronic Technology (China)
Yaodong Lu, Beijing Institute of Opto-Electronic Technology (China)


Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics
Xiaoping Wu; Yuwen Qin; Jing Fang; Jingtang Ke, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray