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Proceedings Paper

Hermetic diode laser transmitter module
Author(s): Jyrki Ollila; Kari Kautio; Jouko Vahakangas; Tapio Hannula; Harri K. Kopola; Jorma Oikarinen; Matti Sivonen
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Paper Abstract

In very demanding optoelectronic sensor applications it is necessary to encapsulate semiconductor components hermetically in metal housings to ensure reliable operation of the sensor. In this paper we report on the development work to package a laser diode transmitter module for a time- off-light distance sensor application. The module consists of a lens, laser diode, electronic circuit and optomechanics. Specifications include high acceleration, -40....+75 degree(s)C temperature range, very low gas leakage and mass-production capability. We have applied solder glasses for sealing optical lenses and electrical leads hermetically into a metal case. The lens-metal case sealing has been made by using a special soldering glass preform preserving the optical quality of the lens. The metal housings are finally sealed in an inert atmosphere by welding. The assembly concept to retain excellent optical power and tight optical axis alignment specifications is described. The reliability of the laser modules manufactured has been extensively tested using different aging and environmental test procedures. Sealed packages achieve MIL- 883 standard requirements for gas leakage.

Paper Details

Date Published: 14 April 1999
PDF: 4 pages
Proc. SPIE 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, (14 April 1999); doi: 10.1117/12.345422
Show Author Affiliations
Jyrki Ollila, VTT Electronics (Finland)
Kari Kautio, VTT Electronics (Finland)
Jouko Vahakangas, VTT Electronics (Finland)
Tapio Hannula, VTT Electronics (Finland)
Harri K. Kopola, VTT Electronics (Finland)
Jorma Oikarinen, Noptel Oy (Finland)
Matti Sivonen, Noptel Oy (Finland)

Published in SPIE Proceedings Vol. 3626:
Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV
Mahmoud Fallahi; S. C. Wang; Mahmoud Fallahi; Kurt J. Linden; S. C. Wang, Editor(s)

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