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Proceedings Paper

Thick-polysilicon-based surface micromachined capacitive accelerometer with force-feedback operation
Author(s): Beatrice Wenk; J. Ramos-Martos; M. Fehrenbach; P. Lange; Michael Offenberg; Werner Riethmuller
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Paper Abstract

This paper describes the concept, the design and measurement results of a surface micromachined accelerometer. For the accelerometer presented here a polysilicon high rate deposition process was used to fabricate polysilicon layers with a thickness of 10 micrometers . The sensor is designed as an interdigital finger structure forming a differential capacitor, where the moveable fingers are mounted on a moveable mass and the fixed electrodes are anchored on the substrate. The air gap between the fingers is 1 micrometers . A force-feedback operation mode is realized to increase the sensor performance. A two chip solution with sensing element and signal processing circuit on separate chips was chosen as first approach towards a monolithic integrated accelerometer. The evaluation circuit was realized in BiCMOS technology. Sensors with a closed-loop sensitivity of 8mV/g and a bandwidth of about 10kHz have been fabricated. A resolution of 0.1g and a linearity error of less than 1% could be achieved for a measurement range of +/- 100 g.

Paper Details

Date Published: 15 September 1995
PDF: 11 pages
Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); doi: 10.1117/12.221186
Show Author Affiliations
Beatrice Wenk, Fraunhofer-Institut fuer Siliziumtechnologie (Germany)
J. Ramos-Martos, Ctr. National de Microelectronica (Spain)
M. Fehrenbach, Robert Bosch GmbH (Germany)
P. Lange, Fraunhofer-Institut fuer Siliziumtechnologie (Germany)
Michael Offenberg, Robert Bosch GmbH (Germany)
Werner Riethmuller, Fraunhofer-Institut fuer Siliziumtechnologie (Germany)


Published in SPIE Proceedings Vol. 2642:
Micromachined Devices and Components
Ray M. Roop; Kevin H. Chau, Editor(s)

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