Share Email Print

Proceedings Paper

X-ray mask fabrication process
Author(s): Gregory M. Wells; Michael T. Reilly; Frederick T. Moore; Franco Cerrina; Kuniaki Yamazaki
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The Center for X-ray Lithography (CXrL) has developed an x-ray mask fabrication process based on silicon nitride membranes and gold absorber. The LPCVD conditions for the growth of the nitride film produce 2 micrometers thick films with low tensile stress and an optical transmission sufficient for optical alignment. The membranes are formed with an reactive ion etch of the membrane window on the backside nitride, followed by a KOH etch of the silicon wafer. A plating base of 100 angstrom chrome followed by 200 angstrom gold is evaporated on the wafers. The wafer is then mounted on a glass ring using either adhesive or anodic bonding. The absorber pattern is delineated via e-beam lithography into either PMMA or SAL 601. Following resist development and an oxygen plasma cleaning, gold plating is used to produce features of the desired thickness.

Paper Details

Date Published: 3 July 1995
PDF: 5 pages
Proc. SPIE 2512, Photomask and X-Ray Mask Technology II, (3 July 1995); doi: 10.1117/12.212774
Show Author Affiliations
Gregory M. Wells, Univ. of Wisconsin/Madison (United States)
Michael T. Reilly, Univ. of Wisconsin/Madison (United States)
Frederick T. Moore, Univ. of Wisconsin/Madison (United States)
Franco Cerrina, Univ. of Wisconsin/Madison (United States)
Kuniaki Yamazaki, Nippon Motorola, Ltd. (United States)

Published in SPIE Proceedings Vol. 2512:
Photomask and X-Ray Mask Technology II
Hideo Yoshihara, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?