Dr. Yiu Ming Cheung

Dr. Yiu-Ming Cheung, Ken, obtained a higher diploma in applied science from Hong Kong Polytechnics in 1982 and received the MSc and PhD degrees in physics from Stevens Institute of Technology, New Jersey, in 1988 and 1994, respectively.

He was Research Associate and Assistant for one year in NEC Research Institute at Princeton, NJ, in year 1990-1992. He was Postdoctoral Teaching Fellow and Project Manager in Physics Department of Hong Kong Baptist University from 1994 to 1996. He had worked in ASM Technology Hong Kong for 26 years since July 1996 and as part-time consultant for a year after retirement. He is currently a freelance consultant. He received 18 US patents and over 50 patents worldwide. He authored and co-authored 25 technical journal papers, over 50 technical articles in conferences proceedings and one chapter of a book on micro-joining processes. His works cover broadly on electronic packaging processes which include (i) wedge aluminum wire-bonding process, (ii) piezoelectric cleaning and bonding processes, (iii) ultra-thin die pick-and place process, (iv) active alignment process and laser micro-joining process for photonic packages, (v) laser soldering and welding processes, (vi) laser drilling and dicing process for solar cell and glass display panel and ultra-fine pitch flexible substrate, (vii) laser assisted fine-pitch flip-chip bonding process, (viii) C2 copper pillar flip-chip bonding process with NCP and NCF, and (ix) wafer de-bonding process for the assembly of Fan-out Wafer Level Packages and (x) Gang bonding process of micro/mini-LED for large RGB display panel. He currently works on the development of C2W copper hybrid bonding for heterogeneous integration.

Dr. Cheung is Senior Member of IEEE and was the Chairman of IEEE CPMT Hong Kong Chapter for year 2003 and 2004 and the Vice-Chair of the Chapter from year 1999 to 2002. He served as General Co-chairman and Treasurer in EMAP2006. He is also a Life Member of SPIE.