William H. Arnold

Fellow Member | Retired
Arnold, William H.
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SPIE Membership: 23.8 years total | 23.8 years voting
SPIE Awards: Fellow status
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Profile Summary

William H. Arnold
Chief Scientist, and Vice President of Technology Development Center, ASML.

Education
MS in Physics, University of Chicago
BA in Physics, Hampshire College

Technical Activities/Interests
• Optical and EUV lithography; semiconductor devices and chip manufacturing; nanoscale processing for future electronic and photonics devices

Service to the Technical Community
• Micro and Nanoengineering (MNE) Organizing Committee, 1998-2010
• International Society of Semiconductor Manufacturers (ISSM) Organizing Committee, 2006-2010
• 193 nm Symposium Organizing Committee, 1995-1998
• 157 nm Symposium Organizing Committee, 1999-2002
• Next Generation Lithography Working Group, 1997-2001
• VLSI Symposium Program Committee, 1998-2000
• SIA Lithography Technical Working Group Co-Chairman 1996-97
• Technical Advisory Board (TAB); Sematech, to define US lithography roadmap, 1988-97; Sematech Lithography Focus TAB Chairman 1992-93
• Member IEEE (since 1992); Member OSA (since 1996)
• Author of >100 technical papers, book chapters, and short courses on microlithography and metrology for semiconductor devices
• Many book and paper reviews
• Numerous invited talks and panels (IEDM, VLSI, VLSI-TSA, ESSDRC)

Services to SPIE
• Member of SPIE (since 1983)
• Member of SPIE Board of Directors, 2004-2007
• Senior Editor, Microlithography, Journal of Micro/Nanolithography, MEMs, and MOEMs (JM3), 2002-2010
• Advisory Committee Advanced Lithography Symposium - 1988-2010
• Chairman, Publications Committee, 2004-2008
• Publications Committee 2001-2009
• Symposium Committee 1996-1998, 2004-2007
• Frits Zernike Microlithography Award Committee 2002-2004
• Microlithography Symposium – Chairman 1994-95, Vice Chairman 1992-93
• Integrated Circuit Metrology, Inspection, and Process Control – Chairman 1990-1991, Vice Chairman 1988-1989, Conference Committee 1986-1993
• Editor, Integrated Circuit Metrology, Inspection, and Process Control IV, Proc

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