Chih-Yu Jen

Application Development Manager at ASML
Jen, Chih-Yu
SPIE Leadership: Retrieving Data, please wait...
SPIE Membership: 1.0 years
SPIE Involvement: Retrieving Data, please wait...
Area of Expertise: Terahertz Spectroscopy, Photovoltaic, Semiconductor, Characterization
Websites: Personal Website
Social Media: LinkedIn
Contact Details:
Sign In to send a private message or view contact details

Profile Summary

My major research field is about dynamic carrier characterization in silicon using terahertz time-domain spectroscopy (THz-TDS). Until now, two papers are accepted by Journal of Infrared, Millimeter, and Terahertz Waves and Terahertz Science and Technology, IEEE Transactions on. Other than that, two oral presentations have been finished by the 2014 SPIE conference in February. Meanwhile, I am leading one master student for his graduation thesis.

Many of my internship and work experiences involved the skills of data analysis, project management, troubleshooting and process research abilities. In Motech Solar as a senior R&D engineer, our group was responsible for the process development of a new structure LBSF solar cell. We brought the cell efficiency to the baseline level and co-published 3 patents during that time period (proposed 7 ideas). It was a great time to enjoy the team work. During my internship at Amkor Technology, I successfully completed several high power thermal testing projects using Labview software as well as National Instrument hardware. In addition, the cold plate system was designed to test the thermal theta-jc and the wind tunnel system was setup to measure the thermal theta-ja. As part of my master degree program, I also built-up the fabrication procedure for the Dye-Sensitized Solar Cell in ASU Alternative Energy Lab and enhanced the cell efficiency up to 9%. My past experience in Taiwan Semiconductor Manufacturing Company (TSMC) should make me a stronger candidate to positions of your organization. When I was a product engineer in TSMC, I achieved the yield goal of Texas Instruments’ C013/N90 products each quarter through physical/electrical failure analysis. The most impressive project was to reduce the leaking current of OMAP series chips through design of experiments and co-worked with engineers from a diverse number of divisions. integration engineer and was responsible for the tape-out procedure of Intel/MTK N90 products.

Upcoming Presentations

Most Recent | Show All
Retrieving Data, please wait...

Publications

Most Recent | Show All
Retrieving Data, please wait...

Conference Committee Involvement

Most Recent | Show All
Retrieving Data, please wait...

Course Instructor

Most Recent | Show All
Retrieving Data, please wait...
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray