Presentation + Paper
4 March 2022 Development of a deep drilling process in metals by means of ultrashort laser pulses
Dennis Haasler, Arnold Gillner
Author Affiliations +
Abstract
Laser drilling is one of the oldest applications in the field of laser material processing and is widely used in industry. The creation of large (~Ø500μm) and deep holes (~5mm) has only been possible by utilizing a melt-based ablation process so far, but material defects as melt layers or (delamination) cracks occur. For micro holes (~Ø100μm), ultrashort pulse (usp) lasers offer the possibility to create precise hole geometries without material defects. Despite of the superior hole quality compared to melt-based processes, no such large and deep holes have been created with usp-lasers so far because of the low average power, small ablation rates and other usp-drilling based phenomena. In this paper the development of a deep hole drilling process with a commercially available ultrafast laser beam source will be presented. The goal is to create large and deep holes by ultrashort pulse laser radiation which could only be created by a melt dominated process so far. In a first step, the principal approach to reach such high depths while maintaining a high material ablation rate is explained. Then, the boundary conditions that come along with this approach are discussed. With a prototype optical system, the feasibility of this concept is shown and some exemplary results are presented. The discussed deep drilling process allows to create precise and cylindrical holes with a diameter <200 μm up to an aspect ratio of 20 in metals without any metallurgical defects in a few minutes.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dennis Haasler and Arnold Gillner "Development of a deep drilling process in metals by means of ultrashort laser pulses", Proc. SPIE 11994, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems XI, 119940I (4 March 2022); https://doi.org/10.1117/12.2625590
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KEYWORDS
Laser drilling

Laser ablation

Metals

Pulsed laser operation

Ultrafast phenomena

Laser processing

Laser scattering

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