3D photonic integrated interposer enabling connectivity between multi-core fibers and photonic integrated circuits

The focus of this work is a novel 3D photonic integrated interposer for the connection of multicore fibers with two core layers consisting of 4 cores each with conventional photonic integrated circuits for optical transceiver applications. The interposer, developed on Fraunhofer HHI's PolyBoard hybrid integration, contains 1x1 3D multimode interference (MMI) couplers. The development of the design, fabrication and characterization of the interposer will be presented.