William Siegle: Obstacles inspire creative solutions as feature sizes shrink

Designers have come up with new tricks and new technologies at each new technology node to keep pace with Moore's Law.

18 July 2013

Bill (William T.) Siegle attended Rensselaer Polytechnic Institute, and received his PhD in Electrical Engineering in 1964. He enjoyed a-25 year career at IBM, where he became the Director of the Advanced Technology Center in East Fishkill, NY. He joined Advanced Micro Devices in Sunnyvale, CA in 1990 as Vice President of Technology, and retired in 2005 as Senior Vice President of Technology and Manufacturing. He has served on the boards of SRC and Sematech, and the public companies Etec, DuPont Photomasks and currently ASML. He has been involved with lithography throughout his career, as both an enabler and a user.

Siegle presented a plenary talk at SPIE Advanced Lithography 2013: Contact Printing to EUV: Lessons Learned from the Art of Lithography

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