SPIE Advanced Lithography

Alternative technologies in lithography will be highlighted 23-27 February.

01 January 2014

Hybrid and other “alternative” technologies for faster, smaller, and cheaper chips required by the semiconductor industry will be highlighted at SPIE Advanced Lithography, 23-27 February in San Jose, CA (USA).

The annual symposium will include seven complementary conferences as well as panel discussions, seminars, and an exhibition devoted to applications, tools, patterning materials, and topics related to EUV lithography, metrology for microlithography, and alternative lithographic techniques.

The SPIE event provides a forum for industry and academic experts in all areas of lithographic patterning technology who are challenged with cost-effectively extending lithography to the next node while also striving to bring newer technologies to production readiness.

Conference sessions on EUV lithography will likely have the most presentations this year; however, the growing number of papers reporting advances in optical (non-EUV) and next-generation lithography (NGL), metrology, and inspection illustrate the interest in directed self-assembly (DSA), smart resists, and combinations of novel lithographic techniques in chip manufacturing of the future.

The all-conference plenary session will open with a talk from 2013 SPIE President William H. Arnold, chief scientist and vice president of ASML’s Technology Development Center. Other plenary speakers are:

  • Joseph Sawicki, vice president and general manager of the Design-to-Silicon division at Mentor Graphics, will discuss advances in electronic design automation (EDA) and working with patterns throughout the design and manufacturing flow.
  • Akihisa Sekiguchi, corporate vice president and deputy general manager at Tokyo Electron Ltd. (TEL), will give a talk on the future and alternative forms of scaling.

Special events include the announcement of the 2014 Frits Zernike Award for advances in optical microlithography, discussions on nanotechnology and managing EUV masks, and a panel discussion on non-EUV solutions.

Among the 13 courses offered onsite are new ones on computational lithography and management of metrology toolset.

SPIE Fellows Harry J. Levinson of GLOBALFOUNDRIES and Mircea V. Dusa of ASML US are symposium chair and co-chair, respectively.

Read more about SPIE Advanced Lithography.

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