Dario Goldfarb: Evolution of pellicles is key to EUV lithography

There is more to be learned when high-volume EUV manufacturing begins, says this IBM researcher.

03 May 2016

Dario Goldfarb is a research staff member in the Semiconductor Technology Research Division at the IBM T.J. Watson Research Center (Yorktown Heights, NY). He has worked in the field of advanced lithography for more than 17 years, developing photoresists, antireflective coatings, organic underlayers, topcoats and pellicles for future patterning nodes, as well as providing the understanding of the fundamental properties, limits and applicability of such lithographic materials and processes. Spanning from 248nm and 193nm to EUV lithography, his work has received multiple national and international awards, including the 2002 U.S. Presidential Green Chemistry Challenge Award, the Best Paper Award at the 2009 International Conference of Photopolymer Science and Technology (Chiba, Japan), the Best Paper Award at the 2012 SPIE Metrology, Inspection, and Process Control for Microlithography Conference and the Best Paper Award at the 2015 SPIE Photomask Technology conference. He has authored and co-authored over 70 scientific publications and holds over 30 U.S. patents. He has also served as peer reviewer for numerous scientific journals.

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