Matt Colburn: Directed self-assembly progress at IBM promises new chip-design options

While not yet ready for insertion, DSA may soon compete with conventional processing methods.

27 June 2016

Matthew Colburn is the senior manager of IBM's Strategic Patterning Research group responsible for development of next-node patterning solutions for IBM and the IBM Alliance. He received his PhD in Chemical Engineering at the University of Texas at Austin, where he developed imprint lithography technology. In 2001, he joined the Exploratory Interconnect group at IBM's Watson Research Center (Yorktown Heights, NY) where he developed integration techniques leveraging novel imaging techniques including diblock self-assembly. Subsequently, he joined the Advanced Lithography group developing materials and processes for immersion lithography, and multiple patterning. In 2007, he became manager of the IBM Advanced Lithography team at Albany Nanotech and was responsible for the lithography materials, process, and infrastructure solutions.

Colburn has numerous patents and publications in the area of semiconductor process technology and was named an IBM Master Inventor. He is a member of SPIE and has authored or coauthored more than 50 papers at SPIE Advanced Lithography symposia since 1999.

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