Multimedia presentations: SPIE Advanced Lithography 2017

Plenary talks and keynote presentations drew capacity crowds at the world's premier lithography event.

15 March 2017

The following presentations consist of audio and slides.

Inspection and Metrology to Support the Quest for Perfection: Photolithography for the Sub-10nm Nodes

Ben (Bin-Ming) Tsai, KLA-Tencor Corp. (USA)
Ben (Bin-Ming) Tsai
KLA-Tencor Corporation (USA) 

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Materials Innovation: It's No Longer Only About Resolution

Nobu Koshiba, President and CEO of JSR Corp (Japan)
Nobu Koshiba
JSR Corp. (Japan)

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Stochastics and the phenomenon of line-edge roughness

Chris Mack, Lithoguru (USA)
Chris A. Mack (USA) 

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Optical 3D nano-fabrication: top-down and bottom up approaches

Satoshi Kawata, Osaka University (Japan)
Satoshi Kawata
Osaka University (Japan)

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Enabling sub-10nm node lithography: presenting the NXE:3400B EUV scanner with improved overlay, imaging, and throughput

Mark van de Kerkhof, ASML (Netherlands)
Mark van de Kerkhof
ASML (Netherlands) 

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Flat Optics with Metasurfaces: Beyond Refractive and Diffractive Optics

Mohammadreza Khorasaninejad, Harvard School of Engineering and Applied Sciences (USA)
Mohammadreza Khorasaninejad
Harvard School of Engineering and Applied Sciences (USA) 

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Metrology capabilities and needs for 7nm and 5nm logic nodes

Benjamin Bunday, SEMATECH (USA)
Benjamin Bunday

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Applying NIL for device fabrication and challenges in nano-defect management

logo for AL17
Tatsuhiko Higashiki
Toshiba Corp. (Japan)

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Technology Development: the "In Between"

logo for AL17
David Fried
Coventor, Inc. (USA)

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