Multimedia presentations: SPIE Advanced Lithography 2017
Plenary talks and keynote presentations drew capacity crowds at the world's premier lithography event.
The following presentations consist of audio and slides.
Inspection and Metrology to Support the Quest for Perfection: Photolithography for the Sub-10nm Nodes
Ben (Bin-Ming) Tsai
KLA-Tencor Corporation (USA)
Materials Innovation: It's No Longer Only About Resolution
JSR Corp. (Japan)
Stochastics and the phenomenon of line-edge roughness
Chris A. Mack
Optical 3D nano-fabrication: top-down and bottom up approaches
Osaka University (Japan)
Enabling sub-10nm node lithography: presenting the NXE:3400B EUV scanner with improved overlay, imaging, and throughput
Mark van de Kerkhof
Flat Optics with Metasurfaces: Beyond Refractive and Diffractive Optics
Harvard School of Engineering and Applied Sciences (USA)
Metrology capabilities and needs for 7nm and 5nm logic nodes
GLOBALFOUNDRIES Inc. (USA)
Applying NIL for device fabrication and challenges in nano-defect management
Toshiba Corp. (Japan)
Technology Development: the "In Between"
Coventor, Inc. (USA)