David Fried: Technology Development: the "In Between”

Presented at SPIE Advanced Lithography 2017.

15 March 2017

Semiconductor research continues to uncover fascinating innovations, and semiconductor manufacturing continues to outlive the predictions. However, technology development, the "in between" timeframe, is changing drastically right now due to process complexity, physical and financial constraints, and a general lack of options for the future. Transiting through this part of the technology lifetime quickly and efficiently is essential to success in an increasingly competitive electronics industry.

Technology development is challenged to take device technology from singular demonstrations to integrated multi-billion transistor products. Rarely is one research concept enough to drive an entire new product, so several aspects of advanced research must be combined into development projects. The resulting technology also has to satisfy cost and market pressures rarely examined in research.

In this keynote presentation, David M. Fried of Coventor, Inc., focuses on a few novel technology development capabilities and methodologies that can enable rapid acceleration of semiconductor concepts to manufacturable products.

Fried is Chief Technology Officer at Coventor, where he is responsible for the company's strategic direction and implementation of its SEMulator3D virtual fabrication 3D process modeling solution. He leads the execution of technology strategy for technology platforms, partnerships, and external relationships. His expertise touches upon such areas as Silicon-on-Insulator (SOI), FinFETs, memory scaling, strained silicon, and process variability. Fried is a well-respected technologist in the semiconductor industry, with 53 patents to his credit and a notable 14-year career with IBM, where he was involved in successive process generations from 65-nanometer and lower.

He has MS and PhD degrees in electrical engineering from Cornell University.

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