Benjamin Bunday: Metrology capabilities and needs for 7nm and 5nm logic nodes
Presented at SPIE Advanced Lithography 2017.
In this keynote presentation, Benjamim Bunday of GLOBALFOUNDRIES Inc., provides an update to previous works in a high-level view of the future for in-line high volume manufacturing (HVM) metrology for the semiconductor industry, concentrating on logic technology.
He begins with a broad view of the needs of patterned defect, critical dimensional (CD/3D), overlay and films metrology, and present the extensive list of applications for which metrology solutions are needed. He then updates the industry's progress towards addressing gating technical limits of the most important of these metrology solutions, highlighting key metrology technology gaps requiring industry attention and investment.
Benjamim Bunday is Senior Member Technical Staff and Project Manager of CD Metrology at SUNY Poly SEMATECH (USA), currently on assignment to GLOBALFOUNDRIES (USA). He has twenty years of semiconductor processing industry experience in the areas of metrology, lithography, and etch.
Bunday received his BS in engineering physics in 1991 from The University of Tulsa, and his MS/ABD in materials science and engineering from Cornell University in 1996. He is a member the programming committee of SPIE's Metrology conference and author or coauthor of over 120 papers.