Tsu-Jae King Liu plenary talk: Sustaining the Silicon Revolution: From 3D Transistors to 3D Integration

A plenary presentation from SPIE Advanced Lithography 2015

10 March 2015

Steady advancement in integrated circuit manufacturing and design over the past five decades has resulted in the proliferation of information technology, with dramatic impact on virtually every aspect of life in modern society.

Today, three-dimensional (3D) transistor structures are being adopted in the most advanced processes to facilitate continued transistor miniaturization for increased functional density and lower cost per function. 3D integration represents a complementary approach for increasing functional density, and will become predominant as practical limits for transistor scaling are reached.

This plenary talk discusses fundamental challenges for transistor scaling and for cost-effective 3D integration to sustain the growth of the semiconductor industry beyond the next decade.

Dr. Tsu-Jae King Liu received her BS, MS, and PhD degrees in electrical engineering from Stanford University. From 1992 to 1996 she was a Member of Research Staff at the Xerox Palo Alto Research Center. In August 1996, she joined the faculty of the University of California, Berkeley, where she is currently the TSMC Distinguished Professor in Microelectronics, and Chair of the Department of Electrical Engineering and Computer Sciences.

Dr. Liu's research awards include the DARPA Significant Technical Achievement Award (2000) for development of the FinFET, the IEEE Kiyo Tomiyasu Award (2010) for contributions to nanoscale MOS transistors, memory devices, and MEMs devices, the Intel Outstanding Researcher in Nanotechnology Award (2012), and the Semiconductor Industry Association Outstanding Researcher Award (2014). She has authored or co-authored close to 500 publications and holds over 90 U.S. patents, and is a Fellow of the IEEE. Her research activities are presently in advanced materials, process technology and devices for energy-efficient electronics.

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