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SPIE Professional October 2008

Lithography News Briefs

• Semiconductor fab equipment spending is expected to decline by 20 percent worldwide for 2008, according to the World Fab Forecast report released by SEMI in early September. But a rebound of more than 20 percent in spending is expected in 2009, driven by more than 70 fab projects. SEMI also noted that in 2008, 300mm projects make up about 90% of all fabs equipment spending, while about 69% of all equipment spending is for 65 nm and below technology nodes. Overall annual semiconductor fab capacity in 2008 is expected to be about 16 million wafers (in 200mm equivalents), a growth rate of just 9% compared to 17% capacity growth in 2007. In 2009, capacity is expected to grow about 10 percent. More.

SPIE Advanced Lithography logo• The rapid introduction and complexity of new metrology instruments, combined with the ascendancy of nanotechnology for semiconductor manufacturing, has elevated the importance of instrument calibration, agreement on best practices, and development of selection criteria for reference instruments in lithography and films metrology. Some panelists at an SPIE Advanced Lithography session in February held that true dimensional accuracy was either unachievable or unnecessary, considering that electrical performance, not size, of a finished device is the primary consideration. Others argued that dimensional measurement tools provide the best available option, and that the approach is necessary because it adds value. The group reached the consensus that while dimensional metrology is the best method available now and that accuracy needs to improve, in the future extending OPC to etch or even electrical calibration would have a lot of value. More from Semiconductor International.

• The 2008 SPIE Advanced Lithography Best Student Paper Award for optical microlithography was awarded to Juliet A. Rubinstein of the University of California-Berkeley. Her paper was titled, "Post-Decomposition assessment of double patterning layouts." The award was sponsored by Cymer.

• The 2007 C. Grant Willson Best Paper Award was presented to a team of authors from IBM Almaden Research Center and IBM Semiconductor Research and Development Center earlier this year for a paper on "Fluoro-alcohol materials with tailored interfacial properties for immersion lithography." The award was sponsored by AZ Electronic Materials and Rohm and Haas Electronic Materials.

• Matthew Sendelbach and Javier Ayala of IBM Microelectronics Division and Pedro Herrera of KLA-Tencor received the Diana Nyyssonen Memorial Award for Best Paper of 2007 for the Metrology, Inspection, and Process Control conference at SPIE Advanced Lithography earlier this year. The paper was titled, "Predicting electrical measurements by applying scatterometry to complex spacer structures."

• Veeco Instruments Inc. is sponsoring a $1,000 Best Student Paper Award at the SPIE Advanced Lithography Symposium in February 2009 to recognize the best student work in AFM Metrology. Manuscripts must be submitted to the Metrology, Inspection, and Process Control for Microlithography conference by 26 January 2009. For more information, e-mail john.allgair@sematech.org

• Sematech has named Bryan J. Rice and Stefan Wurm to lead its lithography division. Rice, on loan from Intel since 2006 and Sematech's immersion program manager, has been appointed director. Wurm, who has led Sematech's EUV strategy for more than four years, will become associate director of the lithography division while on assignment from Advanced Micro Devices Inc. More

•  BACUS Newsletter

Have a question or comment about this article? Write to us at SPIEprofessional@spie.org 

DOI: 10.1117/2.4200810.43

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