• Photonics West
  • Event Highlights
  • BiOS
  • LASE
  • OPTO
  • Brain
  • Translational Research
  • 3D Printing
  • Photonics West Exhibition
  • Photonics West Sponsors
  • BiOS Expo
  • BiOS Expo Sponsors
  • Industry Program
  • Courses
  • Incident Reporting
  • SPIE Event Policies
  • For Authors and Presenters
  • For Chairs and Committees
  • For Photonics West Exhibitors
  • For BiOS Expo Exhibitors
Print Page
Email Page
SPIE Photonics West
4 - 6 Feb 2020
San Francisco, CA, United States

MRSI Systems



BOOTH NUMBER: 4585

View Floor Plan

Address
MRSI Systems
554 Clark Road
Tewksbury, MA
United States
01876
Company Description
Featured Product: Flexible, High-Speed, High-Precision MRSI-HVM/H Die Bonders for lasers, photonics, LiDAR, sensors

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. www.mrsisystems.com.
Announcements
25 November 2019
MRSI receives Laser Focus World Innovators Award for HVM die bonder
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category.

The MRSI-HVM was recognized for a very good innovation that resulted in marked improvement over previous methods employed, approaches taken, or products/systems used. The system delivers high-speed automation without sacrificing flexibility, accuracy or reliability in 24/7 manufacturing of high-volume, high-mix photonics components. It is a field-proven product with dozens of global installations over the past two years.

MRSI-HVM’s key differentiators include:
• true multi-die, multi-process, multi-production in one machine for flexible, high-volume manufacturing
• throughput of >1800UPH with high-accuracy (±1.5 µm @ 3 sigma),
• 12 tips on an integrated turret on each of the dual bonding heads with zero-time tool change, without recalibration,
• gentle force design with true real-time sensing and closed-loop force control for sensitive materials handling.

Customers will realize a high ROI and a competitive advantage because their production line has the flexibility to scale-up rapidly on new design changes or continue with existing designs mitigating the need for additional equipment. Learn more about MRSI’s assembly solutions.

For additional information, please contact:
Dr. Yi Qian
Vice President of Marketing, MRSI Systems
Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com
Time Zone: ET – Eastern Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com
30 August 2019
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is based in Shanghai. His substantial technical experience selling semiconductor equipment along with his vast network in the Chinese market is guaranteed to even further enhance our responsiveness to our customer’s needs.

MRSI is expanding globally in the die bonding market with the support of our Swedish parent company, Mycronic. Hendry is joining the team at a busy and exciting time for MRSI, as our growth continues. “Joining a market leader that continues to adapt to the changing needs of its customers through significant new product launches is a great opportunity,” said Hendry He.

Hendry spent the past 18 years working in the microelectronics/optoelectronics industry including advanced photonics holding senior positions in the areas of sales management, technical service, and process engineering at First Technology, a subsidiary of Sojitz Group, Plasmatreat Trading Shanghai Co., Ltd, ASM Pacific, Shanghai, and Vishay Passive Components, Shanghai Co., Ltd.
“Hendry will be an asset to the MRSI team. He has a deep understanding of automation and broad exposure to multiple market applications,” said Daniel Crowley, Vice President of Sales, MRSI Systems.

For additional information, please contact:
Dr. Yi Qian Vice President of Marketing, MRSI Systems
Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com
Time Zone: ET – Eastern Time

About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com
21 August 2019
MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industrystandard glass die reference samples. Results showed enhancement from ±3 micrometers at 3 sigma, to ±1.5 micrometers at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly known as MRSI-H3 and MRSI-HVM3).

MRSI’s trademark of high-speed and high flexibility remains uncompromised with the improved accuracy. Our customers now have options to design products for higher density and higher speed parts in miniature packages. This is critical for advanced products such as 400G+ photonics devices for data centers and backbone networks, as well as complex DFB/WDM/EML TO-can TOSA/ROSA devices for 5G wireless applications.

“MRSI is always looking ahead to address future customer needs. With proven success in the field and a large worldwide installation base, these MRSI-H/HVM-series products have demonstrated their ability to deliver ultra-precision, high-speed, and high-flexibility concurrently. This is critical for our customers’ high-mix high-volume photonics manufacturing,” said Dr. Yi Qian, Vice President of Marketing of MRSI Systems.

“MRSI has been serving optoelectronic and microelectronic customers for the past thirty-five years and understands their requirement to scale efficiently in today’s fast paced marketplace. We are pleased to announce the latest advancement with our highspeed die bonder product line,” concluded Mr. Michael Chalsen, President of MRSI Systems.

MRSI will be attending CIOE in Shenzhen, from September 4-7, 2019. Experience what the demo center has to offer. Discuss your application requirements and MRSI’s solutions. To schedule a meeting or learn more, contact your MRSI Sales Representative or email sales@mrsisystems.com.

For additional information, please contact: Dr. Yi Qian Vice President of Marketing, MRSI Systems Tel: +1 (978) 667-9449, e-mail: yi.qian@mrsisystems.com Time Zone: ET – Eastern Time


About MRSI Systems MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, highprecision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com

About Mycronic Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarter is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic (MYCR) is listed at Nasdaq Stockholm. www.mycronic.com
Search Open Calls
Enter keywords to find conferences with open calls for papers and submit an abstract.