SPIE online courses are on-demand and self-paced, with access for one year. For more information: ONLINE COURSES

This course provides an overview of the chemistry that is responsible for generation of differential solubility in resists and the effects of processing variables on the final relief image. While optical exposure is the major focus of this course, electron beam and x-ray exposure are also addressed. The course provides an overview description of the chemical basis for various resist designs, ranging from the older DNQ/novolak resists to chemically amplified resists for 248nm, 194 nm dry and immersion, and EUV. It provides a discussion of methods for pitch multiplication such as Multiple Patterning, Self Aligned Patterning, DSA, etc. The course also includes a discussion of the influence of material and process variables on the tradeoffs between resolution, line edge roughness and throughput.

This online course includes a video of the instructor with each module, closed captions, and audio transcription.
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