SPIE Thermosense is the longest-standing and largest international technical conference focused on scientific, industrial, and medical uses of infrared imaging, infrared temperature measurements, and image analysis. Its proceedings are found in most scientific and engineering libraries, providing an unequaled depth and breadth of technical information and reference data. The Thermosense conference promotes worldwide exchange of information about research, uses and applications of infrared (IR) imaging technology. This includes infrared thermography and thermal infrared sensing primarily in the NIR, SWIR, MWIR, and LWIR bands. SPIE Thermosense encompasses technical papers, workshops and short-courses. Since 1978, these activities have included topics from the fundamentals of infrared imaging and calibration to virtually all infrared research and applications. Special emphasis has been on problem solving and turning new developments into standard practices. This year we are planning to hold special sessions on:
  1. automated inspection using machine learning and AI technologies
  2. multispectral, hyperspectral and multi-imaging techniques.
Academic research and professional practical papers are solicited related to infrared applications (NIR/SWIR /MWIR/LWIR) in the areas listed below, and are also welcome in other areas.

Additive manufacturing Aerospace applications Artificial intelligence and NDE4.0 in IRT Automotive industry and autonomous driving Building and cultural heritage applications Calibration Detection of gas and other leaks Drone and airborne thermography Environmental and agricultural monitoring Fiber optics for infrared Fire analysis and detection Food processing and handling Hyperspectral (HS) and multispectral (MS) imagery Infrastructure Infrared image fusion applications and multi-imaging techniques Loss prevention Manufacturing and processing industries, process control Infrared nondestructive testing (IR NDT) and materials evaluation Medical applications and Covid-19 Power generation and distribution Research and development Remote sensing and security Robotic applications Standards, certifications, and guidelines Selected papers that are accepted to SPIE Thermosense will be recommended for publication in related SPIE journals such as Optical Engineering and Journal of Electronic Imaging.

Thermosense Best Student Paper Award
The conference chairs and program committee would like to recognize outstanding young researchers with a best student paper award. The award is open to any first-author student presenting an oral presentation at SPIE Thermosense. A certificate and $500 monetary award will be granted to the student winner.

To be eligible for the best student paper award, you must:
  • be a student without a doctoral degree (undergraduate, graduate, or PhD student)
  • submit your abstract online, and select “Yes” when asked if you are a full-time student, and select yourself as the speaker
  • be the presenting author on an accepted paper within this conference
  • have conducted the majority of the work to be presented
  • submit your manuscript online by 12 April 2023
  • present your paper as scheduled.
Sponsored by:
Infrared Cameras, Inc.







RELATED CALL FOR INDUSTRY PRESENTATIONS

Thermosense Vendor Presentation and Reception XIX

Attention all SPIE DCS 2023 exhibiting companies!
Monday 1 May 2023
Gaylord Palms Resort & Convention Center
Orlando, Florida

What's new in hardware and software for thermography, thermal imaging, and non-contact temperature measurement? Share your latest! The Thermosense Vendor Presentation and Reception started nineteen years ago and has become a very popular and well-attended success. This special session provides an early opportunity for exhibitors to highlight their latest technology and newest products to the Thermosense, infrared industry, and SPIE Defense + Commercial Sensing technical audience prior to the opening of the DCS Expo. In a relaxed atmosphere, enjoy a casual meeting setting with ample time for questions and answers. This session enables the conference attendees and visitors to better prioritize their activities when visiting the Expo.

Session includes
  • exhibitors sharing state-of-the-art in future generation of infrared detectors, IR imagers radiometric and non-radiometric, IR image processing systems and IR systems integration. Drones and robots
  • other related infrared optics, semitransparent materials, coatings, filter, characterization and calibration sources, infrared fiber optics, coolers, multispectral and hyperspectral cameras
  • topics related hardware and software involved in infrared applications: Vis to VLWIR = NIR - SWIR - MWIR - LWIR - VLWIR – terahertz - LiDAR
  • infrared industry manufacturing and applications on artificial intelligence, big data, data analytics, datasets, advanced algorithms, and smarter IR sensor/systems technology connected to Internet of Things (IoT / IIoT)
  • infrared industry training, standards and hardware accessories.

Audience background
  • innovative infrared systems and applications researchers
  • applications engineers and professionals
  • advanced optics engineers
  • photonics and imaging researchers
  • photonics engineering
  • infrared systems engineers
  • calibration and test engineers
  • academics
  • physicists
  • exhibition-only visitors
  • other exhibitor representatives.

Qualifications
Open to all DCS23 exhibitors offering products or services related to infrared sensing or imaging, or photonics. There are no restrictions to the content or topics of submissions: Technical, academics, or commercial within infrared imaging, thermometry hardware, optics, accessories, and software. Session format features 12-16 minute oral presentations from hardware, software, artificial Intelligence involved, whose product lines impact thermal imaging applications and the infrared industry in general. No additional charge to participate. No abstract or manuscript is required. Presentations: Powerpoint on site.

To participate
Reservations are open now, with limited time slots available. If you are interested in participating, or have any questions, contact the moderators: This special vendors session does not require abstract submission through the SPIE Thermosense conference and accepted presentations do not require submissions for proceedings publication. DO NOT submit through the "Submit an Abstract" button on this page. For participation in this vendors session, contact the moderators directly to apply (listed above).

For more information:
Thermosense Vendor Presentation and Reception Guidelines and Topics (PDF)

View the presentations confirmed so far for 2023:
Thermosense Vendor Presentations Confirmed (PDF)
;
In progress – view active session
Conference DCS206

Thermosense: Thermal Infrared Applications XLV

This conference has an open call for papers:
Abstract Due: 19 October 2022
Author Notification: 16 January 2023
Manuscript Due: 12 April 2023
SPIE Thermosense is the longest-standing and largest international technical conference focused on scientific, industrial, and medical uses of infrared imaging, infrared temperature measurements, and image analysis. Its proceedings are found in most scientific and engineering libraries, providing an unequaled depth and breadth of technical information and reference data. The Thermosense conference promotes worldwide exchange of information about research, uses and applications of infrared (IR) imaging technology. This includes infrared thermography and thermal infrared sensing primarily in the NIR, SWIR, MWIR, and LWIR bands. SPIE Thermosense encompasses technical papers, workshops and short-courses. Since 1978, these activities have included topics from the fundamentals of infrared imaging and calibration to virtually all infrared research and applications. Special emphasis has been on problem solving and turning new developments into standard practices. This year we are planning to hold special sessions on:
  1. automated inspection using machine learning and AI technologies
  2. multispectral, hyperspectral and multi-imaging techniques.
Academic research and professional practical papers are solicited related to infrared applications (NIR/SWIR /MWIR/LWIR) in the areas listed below, and are also welcome in other areas.

Additive manufacturing
  • in-situ monitoring
  • post build inspection
  • molten metals measurement.
Aerospace applications
  • aircraft NDT
  • process monitoring
  • corrosion/FOD/fatigue
  • aging aircraft
  • spacecraft and satellites.
Artificial intelligence and NDE4.0 in IRT
  • machine learning
  • deep learning
  • cognitive computing
  • Internet of Things
  • big data.
Automotive industry and autonomous driving
  • IR imaging for autonomous vehicles
  • predictive maintenance: electrical
  • predictive maintenance: mechanical
  • automotive NDT
  • process monitoring: automation
  • driver vision enhancement.
Building and cultural heritage applications
  • energy conservation and energy efficiency
  • construction quality control
  • roof moisture surveying
  • weatherization
  • artwork analysis
  • assessment of conservation interventions.
Calibration
  • standards
  • sources
  • instruments traceability
  • atmospheric transmission.
Detection of gas and other leaks
  • pipelines, oil fields, offshore platforms, refineries
  • gas pumping stations, gasoline stations
  • UXO: unexploded ordinance.
Drone and airborne thermography
  • environmental monitoring
  • building assessment
  • solar cell and power plant inspection
  • inspection and monitoring of aircraft structures.
Environmental and agricultural monitoring
  • agriculture and water conservation
  • fish and wildlife migration
  • geology and volcanic activity
  • pollution and storm water monitoring
  • seawater sensing.
Fiber optics for infrared
  • detection of hazardous chemicals
  • remote sensing in high-temperature and corrosive environments
  • medical applications.
Fire analysis and detection
  • wildfire
  • home and building fire
  • pool fires
  • fire research
  • flame emission.
Food processing and handling
  • quality control monitoring
  • temperatures of animals at slaughter
  • foreign object detection and characterization.
Hyperspectral (HS) and multispectral (MS) imagery
  • Gas detection and combustion analysis
  • Detection and characterization of minerals
  • identification of materials
  • detecting processes and objects.
Infrastructure
  • transportation: roads, bridges, airports, harbors, reservoirs, and dams
  • energy: nuclear, wind, solar, fossil fuels, power plants
Infrared image fusion applications and multi-imaging techniques
  • multimodal inspection techniques
  • biological and medical
  • field security
  • process monitoring.
Loss prevention
  • roof inspections
  • electrical equipment
  • switchboards.
Manufacturing and processing industries, process control
  • composite fabrication and uses
  • glass and ceramics
  • metals processing
  • petrochemical
  • plastics
  • pulp and paper
  • semiconductors and microelectronics
  • quality control and predictive maintenance applications.
Infrared nondestructive testing (IR NDT) and materials evaluation
  • composite structures (aerospace, marine, wind turbine blades, etc.)
  • metallic structures (aerospace, turbine blades, and other)
  • inspection data fusion
  • fatigue analysis and thermal stress analysis (TSA)
  • sonic IR
  • IR NDT combined with other techniques (ultrasound, x-ray, terahertz, etc.)
  • thermal properties of materials
  • underground anomalies
  • electronic components.
Medical applications and Covid-19
  • fever detection for pandemic containment
  • health screening and diagnostics
  • veterinary applications.
Power generation and distribution
  • nuclear, wind, and solar power plants
  • field measurement issues
  • power plant heat-rate efficiency
  • electrical and mechanical P/PM.
Research and development
  • multispectral/hyperspectral imaging
  • enhanced spatial resolution
  • enhanced time resolution
  • microscopy
  • thermal modeling, CFD and FEA.
Remote sensing and security
  • search and rescue (fire, snow, etc.)
  • law enforcement
  • maritime guidance.
Robotic applications
  • automated fiber layup
  • welding
  • large-area contour following.
Standards, certifications, and guidelines
  • NDT
  • buildings
  • condition monitoring.
Selected papers that are accepted to SPIE Thermosense will be recommended for publication in related SPIE journals such as Optical Engineering and Journal of Electronic Imaging.

Thermosense Best Student Paper Award
The conference chairs and program committee would like to recognize outstanding young researchers with a best student paper award. The award is open to any first-author student presenting an oral presentation at SPIE Thermosense. A certificate and $500 monetary award will be granted to the student winner.

To be eligible for the best student paper award, you must:
  • be a student without a doctoral degree (undergraduate, graduate, or PhD student)
  • submit your abstract online, and select “Yes” when asked if you are a full-time student, and select yourself as the speaker
  • be the presenting author on an accepted paper within this conference
  • have conducted the majority of the work to be presented
  • submit your manuscript online by 12 April 2023
  • present your paper as scheduled.
Sponsored by:
Infrared Cameras, Inc.







RELATED CALL FOR INDUSTRY PRESENTATIONS

Thermosense Vendor Presentation and Reception XIX

Attention all SPIE DCS 2023 exhibiting companies!
Monday 1 May 2023
Gaylord Palms Resort & Convention Center
Orlando, Florida

What's new in hardware and software for thermography, thermal imaging, and non-contact temperature measurement? Share your latest! The Thermosense Vendor Presentation and Reception started nineteen years ago and has become a very popular and well-attended success. This special session provides an early opportunity for exhibitors to highlight their latest technology and newest products to the Thermosense, infrared industry, and SPIE Defense + Commercial Sensing technical audience prior to the opening of the DCS Expo. In a relaxed atmosphere, enjoy a casual meeting setting with ample time for questions and answers. This session enables the conference attendees and visitors to better prioritize their activities when visiting the Expo.

Session includes
  • exhibitors sharing state-of-the-art in future generation of infrared detectors, IR imagers radiometric and non-radiometric, IR image processing systems and IR systems integration. Drones and robots
  • other related infrared optics, semitransparent materials, coatings, filter, characterization and calibration sources, infrared fiber optics, coolers, multispectral and hyperspectral cameras
  • topics related hardware and software involved in infrared applications: Vis to VLWIR = NIR - SWIR - MWIR - LWIR - VLWIR – terahertz - LiDAR
  • infrared industry manufacturing and applications on artificial intelligence, big data, data analytics, datasets, advanced algorithms, and smarter IR sensor/systems technology connected to Internet of Things (IoT / IIoT)
  • infrared industry training, standards and hardware accessories.

Audience background
  • innovative infrared systems and applications researchers
  • applications engineers and professionals
  • advanced optics engineers
  • photonics and imaging researchers
  • photonics engineering
  • infrared systems engineers
  • calibration and test engineers
  • academics
  • physicists
  • exhibition-only visitors
  • other exhibitor representatives.

Qualifications
Open to all DCS23 exhibitors offering products or services related to infrared sensing or imaging, or photonics. There are no restrictions to the content or topics of submissions: Technical, academics, or commercial within infrared imaging, thermometry hardware, optics, accessories, and software. Session format features 12-16 minute oral presentations from hardware, software, artificial Intelligence involved, whose product lines impact thermal imaging applications and the infrared industry in general. No additional charge to participate. No abstract or manuscript is required. Presentations: Powerpoint on site.

To participate
Reservations are open now, with limited time slots available. If you are interested in participating, or have any questions, contact the moderators: This special vendors session does not require abstract submission through the SPIE Thermosense conference and accepted presentations do not require submissions for proceedings publication. DO NOT submit through the "Submit an Abstract" button on this page. For participation in this vendors session, contact the moderators directly to apply (listed above).

For more information:
Thermosense Vendor Presentation and Reception Guidelines and Topics (PDF)

View the presentations confirmed so far for 2023:
Thermosense Vendor Presentations Confirmed (PDF)
Conference Chair
Cranfield Univ. (United Kingdom)
Conference Co-Chair
TORNGATS (Canada)
Conference Co-Chair
Univ. del País Vasco (Spain)
Program Committee
Consiglio Nazionale delle Ricerche (Italy)
Program Committee
Oak Ridge National Lab. (United States)
Program Committee
La Jolla Cove Consulting (United States)
Program Committee
Drysdale and Associates, Inc. (United States)
Program Committee
Colbert Infrared Services, Inc. (United States)
Program Committee
FM Global (United States)
Program Committee
Istituto per le Tecnologie della Costruzione (Italy)
Program Committee
Texas A&M Univ. (United States)
Program Committee
Arctic Construction Cluster Finland (Finland)
Program Committee
Siemens Power Generation, Inc. (United States)
Program Committee
IRCAM GmbH (Germany)
Program Committee
Univ. Laval (Canada)
Program Committee
Tokyo Institute of Technology (Japan)
Program Committee
Teledyne FLIR LLC (United States)
Program Committee
Montan Univ. Leoben (Austria)
Program Committee
Temperatures.com, Inc. (United States)
Program Committee
Vicon Infrared (United States)
Program Committee
SI Termografía Infrarroja (Argentina)
Program Committee
The Boeing Co. (United States)
Program Committee
Kobe Univ. (Japan)
Program Committee
Thermal Wave Imaging, Inc. (United States)
Program Committee
VTT Technical Research Ctr. of Finland Ltd. (Finland)
Program Committee
NASA (United States)
Program Committee
Stockton Infrared Thermographic Services, Inc. (United States)
Program Committee
Infrared Cameras, Inc. (United States)
Program Committee
National Research Tomsk Polytechnic Univ. (Russian Federation)
Program Committee
General Atomics Aeronautical Systems, Inc. (United States)
Program Committee
NASA Langley Research Ctr. (United States)
Additional Information

View call for papers



What you will need to submit
  • Title
  • Author(s) information
  • Speaker biography
  • 250-word abstract for technical review
  • 100-word summary for display in the program
  • Keywords used in search for your paper (optional)
Note: Only original material should be submitted. Commercial papers, papers with no new research/development content, and papers with proprietary restrictions will not be accepted for presentation.