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San Jose Convention Center
San Jose, California, United States
25 February - 1 March 2018
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For over 40 years, SPIE Advanced Lithography has played a key role in bringing together the micro- and nanolithography community. The addition of other lithography-related technology over the past several years has sought to address the patterning integration challenges presented by the continuous scaling of the semiconductor industry. A full spectrum of lithography and patterning topics are encompassed by this year’s symposium across seven complementary conferences. Participants come from a broad array of backgrounds to share and learn about state-of-the-art lithographic tools, novel lithography approaches, resists, metrology, materials, etch, design, and process integration. Through a series of provocative panel discussions and seminars, the symposium also probes current issues being faced as we extend current methods, move toward alternative approaches, and identify new ways to complement one technology with another.

Over the years, SPIE Advanced Lithography has provided the unique and primary forum for meeting and interacting with a wide range of industry experts, researchers, and key players working on patterning technology development. Attendance ensures that participants learn and share the latest developments in areas of central importance to many vital technology fields.

All conferences are organized by current practitioners of the art, Conference Chairs, working together with organizing committees that are experts in these fields. Numerous courses have also been organized, which are taught by recognized experts from industry and academia. Additional information is available from the many manufacturers' exhibits that allow tool makers, material suppliers, and software groups to showcase new products while interacting one-on-one with participants.

We welcome your attendance and hope you will join us in San Jose for SPIE Advanced Lithography's 43rd year!

Bruce W. Smith

Bruce W. Smith
Rochester Institute of Technology
2018 Symposium Chair

Will Conley

Will Conley
An ASML company
2018 Symposium Co-Chair

Executive Committee
Ofer Adan, Applied Materials (Israel)
Jason P. Cain, Advanced Micro Devices, Inc. (USA)
Will Conley, Cymer – An ASML company (USA)
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr. (USA)
Nelson Felix, IBM Corp. (USA)
Kenneth A. Goldberg, Lawrence Berkeley National Lab. (USA)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium)
Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems (Germany)
Jongwook Kye, SAMSUNG Electronics Co., Ltd. (Korea.Republic of)
Soichi Owa, Nikon Corp. (Japan)
Eric M. Panning, Intel Corp. (USA)
Martha I. Sanchez, IBM Research – Almaden (USA)
Bruce W. Smith, Rochester Institute of Technology (Unites States)
Vladimir A. Ukraintsev, QorvoTM (USA)
Richard Wise, Lam Research Corp. (USA)
Chi-Min Yuan, NXP Semiconductors (USA)

Advisory Committee
Robert D. Allen, IBM Research - Almaden (USA)
William H. Arnold, ASML US, Inc. (USA)
Timothy A. Brunner, GLOBALFOUNDRIES Inc. (USA)
Ralph R. Dammel, EMD Performance Materials Corp. (USA)
Mircea V. Dusa, ASML US, Inc. (USA)
Donis G. Flagello, Nikon Research Corp. of America (USA)
Harry J. Levinson, GLOBALFOUNDRIES Inc. (USA)
Burn Lin, National Tsing Hua Univ. (Taiwan)
Chris A. Mack, Fractilia, LLC (USA)
Michael T. Postek, National Institute of Standards and Technology (USA)
Christopher J. Progler,
Photronics, Inc. (USA)
C. Grant Willson, The Univ. of Texas at Austin (USA)
Anthony Yen, ASML US, Inc. (USA)

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Important Dates

Late submissions made online considered by the chairs

Author Notification
26 October 2017

Manuscripts Due
31 January 2018

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