Paper 12957-36
Paper 12957-36
Functional underlayers, surface priming, and multilayer stacks to improve dose and adhesion of EUV photoresists
On demand | Presented live 28 February 2024 
Abstract
A large screening of underlayer materials for extreme ultraviolet lithography is reported in this work. The main motivation for the screening of functional materials lies in the search for dose reduction and defect mitigation. Some promising results shown in here prove that the usage of functionalized underlayers and primers improves the pattern quality without adding to the complexity of litho processing.
Presenter
imec (Belgium)
Dr. Roberto Fallica received his master's degree in Electronics Engineering from Politecnico di Milano (Italy) in 2007 and completed the PhD school in Nanotechnology from University of Milano-Bicocca in 2012. He was postdoctoral researcher at the Paul Scherrer Institute (Switzerland) working at the dedicated X-ray interference lithography beamline for characterization and patterning of nanoscale photoresist structures. Since 2018, he is staff researcher in the Advanced Patterning department of IMEC (Belgium). His duties include the screening of lithography materials and stacks to develop the technology that will enable future semiconductor devices in BEOL (back-end of line) such as DRAM (storage layer) and logic (metalization).