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23 - 27 February 2025
San Jose, California, US
Conference 13425 > Paper 13425-39
Paper 13425-39

Automated identification of repeated chip layout patterns

27 February 2025 • 10:00 AM - 10:20 AM PST | Convention Center, Grand Ballroom 220C

Abstract

Resolution Enhancement Techniques (RETs) such as OPC and ILT are indispensable for achieving lithographic printability of almost all modern chip products. RETs are immensely computing-intensive, often necessitating thousands to millions of CPU hours for a single diffusion/poly/metal/contact layer. A significant portion of this computational load stems from redundant computations on recurring layout patterns, which can account for 20%-80% of all layout polygons of a chip design. Efforts to mitigate this computing burden entail the identification and avoidance of redundant computations on repeated layout patterns. However, existing techniques have been notably scarce and are usually very restrictive in their usage. We developed an adaptive geometric clustering-based approach, called CARPI, to automatically identify repeated chip layout patterns that facilitate the improvement of RET computing efficiency. Experimental results on industrial designs show that our approach can identify all repeated layout patterns and our clustering technique significantly outperforms alternative methods.

Presenter

Runzhi Wang
Texas A&M University (United States)
Runzhi Wang received a bachelor's degree in Optical Engineering from Changchun University of Science and Technology. Following that, he obtained a master's degree in Electrical and Computer Engineering from Northeastern University in Boston. Currently, he is pursuing a Ph.D. in Electrical and Computer Engineering at Texas A&M University. Runzhi Wang's research focuses on machine learning applications for electronic design automation (EDA).
Presenter/Author
Runzhi Wang
Texas A&M University (United States)
Author
Shu Kong
Texas A&M Univ. (United States)
Author
Lin Wang
Synopsys, Inc. (United States)
Author
Yongdong Wang
Synopsys, Inc. (United States)
Author
Jiang Hu
Texas A&M Univ. (United States)