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SPIE Advanced Lithography 2015 news


SPIE Advanced Lithography 2015
Good to see you in San Jose!


See best paper award winners
and other photos in the
SPIE Litho photo gallery.

Thursday 26 February

Ending on a high note

Celebrating lithography in the Year of Light

Wednesday 25 February

DSA and DTCO draw crowds

Busy with the business of litho

More to see, more to say at week's second poster reception

Tuesday 26 February

Find it here: exhibition opens

Thirsty work: dimensional scaling panel

Getting an audience at the poster reception

Hallway conversations

Monday 23 February

Compelling case for NIL viability

Edge placement and Moore’s Law

EUV progress: 1,000 wafers in one day

Forty years on and going strong

Integrated photonics and the National Photonics Initiative

3D: from transistors to integration

Internet-of-Things as a source of solutions

Lithography and the International Year of Light

3D 2.0: metrology for the next wave of 3D

Sunday 22 February

'Best week of the year' begins' with settling of EUVL bet


Thursday 26 February


Ending on a high note

SPIE Litho 2015

Hallway conversations seemed to have escalated rather than tapered off by week's end. The high-energy 40th anniversary iteration of SPIE Litho ended on a high note, with the total registered attendance of 2,320 nearly equal to 2014, and technical conference attendance slightly higher than last year.

The event is seen as a very important annual gathering for the lithography community, perhaps even more important these days with high-stake technologies like EUV on the horizon.

The audience includes financial analysts and reporters along with researchers, developers, and technology directors, and their reports have been seen to have an immediate impact on stock prices as well as commitments to suppliers.

See more photos in the SPIE Litho photo gallery, including winners of best-paper awards in several conferences.


Celebrating lithography in the Year of Light

International Year of Light at SPIE Advanced Lithography

Advanced Lithography among technologies being celebrated in the International Year of Light and Light-based Technologies (IYL 2015) observance, including in a set of panels such as these honoring some of the field's luminaries positioned throughout the convention center.

Among those featured -- many of whom were on-site this year -- are Lord Rayleigh (John William Strutt), Ernst Abbe, Frits Zernike, Grant Willson, Burn Lin, Gordon Moore, Andrew Neureuther, Marc Levenson, Abe Offner, Martin van den Brink, Shoichiro Yoshida, John Bruning, and Chris Mack.

See www.spie.org/iyl for more about how to get involved in IYL 2015, and help raise awareness of the importance of light in all our lives.


Wednesday 24 February


DSA and DTCO draw crowds

SPIE Advanced Lithography 2015

Conference rooms continued to draw large audiences on Wednesday, with a three-conference joint session on Directed Self Assembly and an invited paper by Lars Liebmann of IBM in the conference on Design-Process-Technology Co-optimization for Manufacturablity among the big draws.

Liebmann's talk, "The daunting complexity of scaling to 7nm without EUV: pushing DTCO to the extreme" (9427-1), provided a good framework for comparing EUV and non-EUV options for 7nm in terms of cost and area scaling, with 10-36% penalty in area for non-EUV, said conference chair John Sturtevant (Mentor Graphics).


Busy with the business of litho

JSR Micro, SPIE Advanced Lithography 2015 exhibition

The exhibition continued to be a busy meeting place on the second of its two-day run, connecting exhibitors with existing customers as well as new prospects. Above, a conversation in the inviting JSR Micro booth. See more photos in the SPIE Litho photo gallery.


More to see, more to say at week's second poster reception

SPIE Advanced Lithography 2015 poster reception

The second of the week's evening poster receptions drew another 1,000+ participants to talk one-on-one with authors as well as other colleagues. See more photos in the SPIE Litho photo gallery.


Tuesday 24 February


Find it here: exhibition opens

Pozzetta, SPIE Advanced Lithography 2015 exhibition

Booth visitors flowed into the hall as soon as the doors opened Tuesday morning for the two-day exhibition. This year's show features 61 exhibiting companies presenting the latest in lithography R&D, devices, tools, fabrication, and services -- an excellent  place to get a close-up look at the latest developments from the technology segment that enables the production of every computer, smartphone, and tablet.

SPIE Advanced Lithography 2015 exhibition Canon

The Canon booth was among those busy with visitors; among them SPIE Board of Directors member Akiyoshi Suzuki of Gigaphoton, at right.

SPIE Advanced Lithography 2015 exhibition Nanoscribe

Nanocscribe, the 2014 Prism Award winner in Advanced Manufacturing, was among companies on the exhibition floor. See more photos from the exhibition in the SPIE Litho photo gallery.


Thirsty work: dimensional scaling panel

Dimensional scaling panel discussion at SPIE Litho

What is needed to meet the needs of next-generation lithography and alternative patterning? A well-attended panel discussion looked at options including EUVL, electron-beam, direct-write, and nanoimprint lithography, with refreshments at hand to help fuel the discussion.


Getting an audience at the poster reception

SPIE Litho poster session

SPIE Litho poster receptions are one of the surest venues to find an avid audience for new work. See more photos from the first of the week's two poster events in the SPIE Litho photo gallery.


Hallway conversations

SPIE Litho hallway conversations

Coffee breaks provide one of many opportunities for networking and making connections. See more photos in the SPIE Litho photo gallery.


Monday 23 February


Compelling case for NIL viability

Toshiaki Ikoma, Canon CTO
Toshiaki Ikoma, Canon

In an opening keynote session in the conference on Alternative Lithography Technologies, Toshiaki Ikoma, Chief Technology Officer and EVP of Canon, delivered a compelling case for viability of nanoimprint lithography (NIL) for high-volume semiconductor manufacturing, which is ready now for production of flash memory.

Applications will soon be expanded to DRAM and eventually logic chips, with Canon committed to pursuing and leading NIL technology development. NIL-specific process technologies including design, alignment marks, substrate control, etching, particle control, and resist developments are being developed with customers.

Dr. Ikoma noted that needed peripheral technologies include mask, measurement tools, materials, and coater/developer work for chemical and particle contamination control, all of which are being provided. He emphasized the need for mask replication tools, with Canon's commitment to provide this.

Looking at the roadmap, he discussed platform evolution, throughput improvements, overlay accuracy, and defect control advancements that together improve performance and reduce the production cost of the customer.

Read more in a press release from Canon and commentary in a LithoGuru blog post.


Edge placement and Moore's Law

Yan Borodovsky, Intel Fellow
Yan Borodovsky, Intel

In another paper in the alternative technologies keynote session, Yan Borodovsky, Intel Senior Fellow and Director of Advanced Lithography, described the role of edge placement in delaying the end of Moore's Law. He detailed how overlay control error continues to be a major contributor to edge placement errors and thus a focus of alternative lithographies development.

Self-consistent and unbiased assessment of required HiNA scanner imaging and TPT based on realistic resist sensitivity and similar analysis for mask making tooling capable to support ultimate HiNA imaging must be completed to estimate realistic mask cost and cost per align for HiNA EUVL, Borodovsky said.

Nano imprint lithography (NIL) defectivity and logic non-redundancy make NIL impractical for logic manufacturers, while directed self-assembly (DSA) has defectivity and edge placement error issues, he said. This leads to challenging engineering for pitch division and significant resources to bring HiNA EUV lithography to high volume manufacturing. He concluded by stating selective deposition and passivation techniques may improve scaling, while patterning will support Moore's Law for the foreseeable future.


EUV progress: 1,000 wafers in one day

Anthony Yen, Taiwan Semiconductor Manufacturing Company (TSMC) R&D Director, reported EUV progress in an invited paper in the conference on Advanced Etch Technology for Nanopatterning.

"During a recent test run on an NXE:3300B EUV system we exposed 1022 wafers in 24 hours with sustained power of over 90 Watts," Dr. Yen said. "We are pleased with this result, as it shows us the potential of the system."

ASML confirmed that TSMC has successfully exposed more than 1000 wafers on an NXE:3300B EUV system in a single day, an important step towards insertion of EUV lithography in volume production of semiconductors.

Read more in the ASML press release and commentary in Barron's Tech Trader Daily blog.


Forty years on and going strong

Mircea Dusa, William Oldham, Andrew Neureuther, Bruce Smith

As befits a 40th anniversary, SPIE Advanced Lithography technical sessions opened with a nod to the field's history, with a Special Award for Caree-Long Contribution to the Art and Science of Lithography. Symposium chair Mircea Dusa (ASML) and co-chair Bruce Smith (Rochester Institute of Technology) presented the award to William Oldham and Andrew Neureuther, calling particular attention to papers published by the two in 1979 and 1980 introducing the SAMPLE process simulator. Dusa called the work "a defining moment, when lithography moved from art to become science." Above, from left, Dusa, Oldham, Neureuther, and Smith.

Ralph Dammel, Frtis Zernike Award 2015

Ralph Dammel, CTO of AZ Electronic Materials, was presented with the 2015 SPIE Frits Zernike Award for Microlithography, recognizing his contributions to the development of photoresist, antireflective coatings, and directed self-assembly materials for semiconductor microlithography; above, Dr. Dammel with a poster of Zernike, one of several produced by SPIE to celebrate the photonics community during the International Year of Light and Light-based Technologies in 2015. The Advanced Lithography  posters and others in the series are available all week at the SPIE Bookstore.

Five new Fellows of SPIE

Five new Fellows of SPIE were introduced; from left, Luigi Capodieci (GlobalFoundries), Bernd Geh (Carl Zeiss SMT Inc.), Moshe Preil (GlobalFoundries), Masato Shibuya (Tokyo Polytechnic University), and Obert Wood (GlobalFoundries).

SPIE Advanced Lithography 2015 plenary audience

Above, several audience members wait their turn to ask questions during the opening session.


Integrated photonics and the National Photonics Initiative

Alan Willner
Alan Willner

A new Integrated Photonics Institute for Manufacturing Innovation (IP-IMI) has garnered the highest level of funding for several new institutes established by the Obama Administration, giving evidence for the effectiveness of the National Photonics Initiative (NPI) in the U.S. and cause for celebration throughout the lithography community, said Alan Willner, Sample Chaired Professor of Engineering at the University of Southern California and a member of the NPI steering committee.

Dr. Willner, the first of the day's three plenary speakers, detailed the establishment of the NPI, a coalition of industry associations including Founding Partner SPIE, industry, and academia, and noted several successes the coalition has achieved in addition to the IP-IMI. Thanks to coalition awarness-raising efforts, the term "optics and photonics" now appears in several major bill in Congress aimed at strengthening the economy, which helps open the path for government funding.

This reflects a new level of understanding on the part of policy makers about the important economic role of optics and photonics as an enabling technology, he said. Willner cited charts shown by NPI steering committe chair Tom Baer of Standfor University, showing that the technology enables "trillions of dollars" of revenue annually around the world.

Willner noted that the NPI strategy of creating a common platform from which to raise awareness about the ubiquity and value of the field reflects similar efforts in the European Union and several countries in Asia and Europe.


3D: from transistors to integration

Tsu-Jae King Liu
Tsu-Jae King Liu

Tsu-Jae King Liu from the Univ. of California, Berkeley gave a compelling plenary talk entitled "Sustaining the silicon revolution: from 3D transistors to 3D integration." Taking a different look at the impact of Moore's Law, Dr. Liu charted the growth in the number of devices over the past five decades or so, from the advent of mainframe computers to 2030 where the so-called internet of things (IoT) will dominate.

By 2030, she said, the number of worldwide devices will be in the trillions, with hundreds per person naturally embedded in the environment and ourselves. This therefore makes low-power operation essential.

With that opening, Liu outlined the path to 3D transistors, first explaining the basics of MOSFETS, and then the CMOS power crisis -- the fact that voltage scaling has not kept pace with transistor scaling. Even with multi-core systems, there is a CMOS energy efficiency limit to overcome, hence the efforts in 3D transistors.

However, for zero passive power consumption, an electro-mechanical switch that put a true air gap at the drain in the off state would be necessary, so Liu showed how this is possible with actuators providing the switching. She then showed how 3D integration with CMOS was possible because advanced BEOL processes have multiple metal layers and air gaps, and so can be adapted for the fabrication of compact relays.

Citing a number of examples of 3D integration, Liu summarized that 3D transistors and 3D integration provide for improvements in IC energy efficiency and functionality to sustain the silicon revolution, allowing the IT of the future to be pervasive, embedded, human-centered, and solving societal-scale problems.


Internet-of-Things as a source of solutions

Xiaowei Shen
Xiaowei Shen

Liu's talk was an excellent segue into the plenary talk Xiaowei Shen of IBM Research, China, which was entitled, "The Internet-of-Things: cloud platform and industry solutions.

"There are three forces reshaping technology, business, and society," said Dr. Shen. "Data is transforming industries, the cloud is transforming IT, and we are engaging in new ways," (as in social media). This brings a new environment of big data, he said, joining mobile computing with the cloud, social engagement, and ultimately the internet of things.

Shen then forecast a view of the year 2020 where there will be 212 billion installed "things," 30 billion autonomously connected things, and about 3 million petabytes of embedded systems data, amounting to $8.9 trillion of business data.

He predicted that this will result in a convergence of the IT and physical worlds, in such areas as pipe management, travel and transportation, home healthcare, and eventually culminating in smart cities. He also explained how the IoT would enable new business models in such areas as insurance, education, and financial services.

To show how the IoT could solve real world problems, Shen described a 10-year IBM initiative announced in the middle of 2014 to support China's energy and environment goals to increase renewable energy utilization, improve energy consumption efficiency, and reduce air pollution. He further described efforts in creating connected vehicles and managing chronic diseases.

True realization of these solutions would come, he said, where engagement data and systems of record can converge in a foundational infrastructure that creates true systems of insight to enable a smarter planet.


Lithography and the International Year of Light

The United Nations has designated 2015 as the International Year of Light and Light-based Technologies (IYL 2015), providing a once-in-a-lifetime opportunity for the g lobal optics and photonics community to raise awareness about the importance of the technologies they discover, develop, and deploy.

Now, Chris Mack told others at the SPIE Fellows luncheon, it is time for those in the community to consider how they can become involved.

While the initiative has some marketing features, it is also about outreach, Mack pointed out. The SPIE IYL web page and the international IYL 2015 website have ideas for getting involved, and kits and other materials are available.

(While at SPIE Litho, check at the SPIE bookstore for the free book "Celebrating Light: 50 Ways Light-Based Technologies Enrich Our World" [at right] and take a copy home to share with friends, family, or customers. Free posters celebrating the field's luminaries are also available.)

Mack noted some important anniversaries being celebrated by the IYL 2015 observance, including publications or discoveries by Alhazen around 1015, Fresnel in 1815, Maxwell in 1865, and Einstein in 1915.

He noted additional anniversaries for the lithography community, including Moore's Law in 1965, and the GCA stepper going into HVM in 1980.


3D 2.0: metrology for the next wave of 3D

Dan Hutcheson, VLSI Research Chris Mack, LithoGuru.com Alok Vaid, GlobalFoundries
Marie Tripp, Intel Ofer Adan, Applied Materials Mike Bakeman, KLA-Tencor
Matt Sendelbach, Nova Measuring Instruments Panelists, left to right,
top row to bottom:
Hutcheson, Mack, Vaid,
Tripp, Adan, Bakeman
and Sendelbach

The semiconductor industry is challenged by 3D device nanotechnology, and an expert panel discussed everything from the ROI that underpins the need for accurate metrology, to the different motivators and expectations for accuracy of those in the lab and those on the business side, to the unique and variable instrinsic properties of materials at the nanoscale.

Panelists were Dan Hutcheson of VLSI Research, LithoGuru Chris Mack, Alok Vaid of GlobalFoundries, Marie Tripp of Intel, Ofer Adan of Applied Materials, Mike Bakeman of KLA-Tencor, and Matt Sendelbach of Nova Measuring Instruments. The panel was moderated by Bryan Barnes and Joseph Kline of NIST and Ben Bunday of Sematech, and sponsored by Rigaku and KLA-Tencor.


Sunday 22 February


'Best week of the year' begins' with settling of EUVL bet

In fact, SPIE Advanced Lithography "is the best week of the year in lithography," noted Gentleman Scientist Chris Mack at a planning dinner on Sunday evening at the start of the week. Mack, editor of the Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3) and a long-time short course instructor and conference participant, should know -- he pointed out that he's been coming to the meeting for 31 years!

EUVL (extreme-ultraviolet lithography) development and scalability have been hot topics at SPIE Litho for the past several years, with one result being a bet between Mack and Vivek Bakshi of EUV Litho, Inc., about the viability of the technology, with Mack's 2005 Lotus Elise alleged to have been on the line at one point. Just a few days ago, Mack and Bakshi settled the bet. Who won? Read more in Mack's blog post (spoiler alert: he still has the Lotus, and students in lithography looking for scholarships to help finance attendance at SPIE Litho are the real winners!).


Visit this page often during the week for the latest news on what's happening at the premier conferenece for the lithography industry!


All photos © SPIE, the international society for optics and photonics, except where noted.


News coverage

SPIE Advanced Lithography 2015 – Day 4 (LithoGuru, 27 February 2015)

EUV makes progress and other observations from SPIE (Semi Wiki, 26 February 2015)

SPIE Advanced Lithography 2015 – Day 3 (LithoGuru, 26 February 2015)

Directed self assembly hot topic at SPIE (Semiconductor Manufacturing & Design, 25 February 2015)

SPIE Advanced Lithography 2015 – Day 2 (LithoGuru, 25 February 2015)

Proponents of EUV, immersion lithography face off at SPIE (Semiconductor Manufacturing & Design, 25 February 2015)

ASML gets a lift from TSM, though questions on EUV remain (Barron's Tech Trader Daily, 24 February 2015)

UV achieves 1000 wpd with 90W source (Electronics Weekly, 24 February 2015)

TSMC announces lithography milestone as EUV moves closer to production (Extreme Tech, 24 February 2015)

EUV bet settled as source powers climb (optics.org, 24 February 2015)

SPIE Advanced Lithography 2015 – Day 1 (LithoGuru, 24 February 2015)

SUNY Poly CNSE researchers and corporate partners to present 40 papers at globally recognized lithography conference (SUNY Poly CNSE, 24 February 2015)

3D E-beam enables 3D NAND flash (EE Times Europe, 24 February 2015)

Tighter CD requires tighter laser bandwidth (Semiconductor Engineering, 24 February 2015)

SPIE plenary takes in photonics, 3DICs, connected devices (Semiconductor Manufacturing & Design, 23 February 2015)

SPIE Advanced Lithography 2015 – Day 0 (LithoGuru, 22 February 2015)

Mack and Bakshi settle bet on the future of EUVL (LithoGuru, 21 February 2015)

SPIE Advanced Lithography preview (Semi Wiki, 20 February 2015)

Breakthrough results on directed self-assembly reported (PhysOrg, 19 February 2015)

SPIE press release

EUV, Internet of Things, 3D integration among hot topics at SPIE Advanced Lithography (28 January 2015)

Related links

SPIE Advanced Lithography website

SPIE Advanced Lithography

22-26 February 2015
San Jose, California, Marriott and Convention Center

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