Baltimore Convention Center
Baltimore, Maryland, United States
5 - 9 May 2014
Conference 9105
Thermosense: Thermal Infrared Applications XXXVI
Monday - Wednesday 5 - 7 May 2014
Important
Dates
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Abstract Due:
11 November 2013

Author Notification:
15 January 2014

Manuscript Due Date:
7 April 2014

Conference
Committee
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Additional Conference
Information
Steering Committee Emeritus Members: Sven-Åke Ljingberg, Univ. of Gäyle (Sweden); John R. Snell, Snell Infrared (USA); Robert Madding, FLIR Systems (USA); Ermanno G. Grinzato, Consiglio Nazionale delle Ricerche (Italy).
Monday 5 May Show All Abstracts
The Infrared Applications: ThermoSense XXXVI Vendor Session
Monday 5 May 2014
12:00 PM - 4:40 PM
Location: Conv. Ctr. Room 316

Moderators: Andrés E. Rozlosnik, Si Termografia Infrarroja (Argentina), and Herb Kaplan, Honeyhill Technical Co. (USA)

The Infrared Applications: ThermoSense XXXVI Vendor Session will be held on Monday afternoon, 5 May 2014 as part of SPIE’s DSS 2014 Conference in Baltimore. The session will feature brief presentations from hardware and software vendors whose product lines impact thermal imaging applications.

Unlike the technical sessions, there are no “commercial content” restrictions in these presentations.

This event allows vendors to showcase new products on display at this year’s exhibit, and provides attendees with an advance glimpse of “what’s new” in thermal imaging applications.

All exhibitors are eligible to present.

The Vendor Session was started ten years ago and has been a popular, well-attended success. It allows the busy technical conference attendees to better prioritize their time when visiting the exhibits. It also provides a relaxed atmosphere for informal conversations between vendors and conference attendees.

The session begins with 15-17 minute presentations and is followed by a reception and mixer with snacks and soft drinks.

Plan your travel to arrive early enough to get this valuable preview of evolving technology.

Any exhibitor offering products or services related to infrared sensing or imaging can participate, but vendor time slots are limited and available on a first-come first-served basis.

To register as a presenter, please provide the following:
  • Name, title, affiliation and contact information for the presenter
  • Title of presentation
  • Brief (one line) summary of presentation content
If you are interested in participating or have any questions, please contact: Vendors Session 2014 Moderators Herb Kaplan, or Andres Rozlosnik hkaplan@earthlink.net or aer@termografia.com

VENDORS IN PRESENTATION ORDER:

Telops (Booth 1112)
A New Rugged Line of High Performance Infrared Cameras
Presenter: Vincent Farley, Business Development Manager

New Infrared Technologies (Booth 877)
The CORE-S: an affordable and compact solution for industrial process monitoring using uncooled MWIR FPAs, and its evolution towards larger imaging arrays (256x256)
Presenter: Rodrigo Linares, Business Development Manager

ULIS (Booth 809)
ULIS uncooled IR detectors and new developments
Presenter: Ludovic Brassé, Key Account Manager

StingRay Optics, LLC (Booth 962)
StingRay Optics Standard Products 2014
Presenter: Sam Wyman, Standard Products Specialist

SCD.USA, LLC (SemiConductor Devices) (Booth 716)
New Infrared Detector Technology from SCD
Presenter: Robert McDaniel, President and CEO SCD.USA

New Imaging Technologies (NIT) (Booth 1048)
Advantages of Native High Dynamic range in SWIR
Presenter: Jean-Louis Laurent, Sales Director

Xenics (Booth 1025)
A low SWaP gimbal, equipped with SWIR and LWIR camera cores for UAS operation
Presenter: Jan Vermeiren, Technical Adviser & Business Development Manager

Magnity Electronics (Booth 1070)
Recent advances in thermal imaging technologies and products at Magnity
Presenter: Chongfei Shen, Magnity Electronics CEO

CI Systems, Inc. (Booth 1001)
A LWIR spectral imager based on cooled detector array and high resolution Circular Variable Filter (CVF)
Presenter: ILya Koshkin, Technology and Business Development at CI Systems

JENOPTIK (Booth 107)
New High Definition Camera from JENOPTIK
Presenter: David Fisher, Sales Manager Infrared Camera Products

Heimann Sensor GmbH (Booth 1005)
New low cost thermal IR focal planes to enable consumer applications
Presenter: Bodo Forg, Project Manager

Sensors Unlimited - UTC Aerospace Systems (Booth 817)
Highest sensitivity, highest resolution SWIR imaging cameras
Presenter: Shannon Larbig, Sales Manager, Component Products

Opgal Optronic Industries Ltd. (Booth 512)
Therm-App™: Merging the thermal imaging world with the Android smartphone
Presenter: Craig Beal, Product Manager

PHOTONIS Digital Imaging (Booth 1213)
Low Light Digital Imaging as a Platform for Fusion Technologies
Presenter: Löig E. Bourrée, Vice President of Night Vision Technologies
Tuesday 6 May Show All Abstracts
Session 1:
Manufacturing and Processing Industries
Tuesday 6 May 2014
8:00 AM - 9:40 AM
Location: Conv. Ctr. Room 320
Infrared imaging of the polymer 3D-printing process
Paper 9105-1
Author(s):
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NIST emittance metrology in support of advanced manufacturing process control and modeling
Paper 9105-2
Author(s):
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Method for improving visualization of infrared images
Paper 9105-30
Author(s):
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Monitoring of industrial welding processes using high-speed uncooled MWIR imaging sensors
Paper 9105-4
Author(s):
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Infrared imaging of the polymer 3D-printing process
Paper 9105-5
Author(s):
Show Abstract
Session Panel:
Panel Discussion: Manufacturing and Processing Industries
Tuesday 6 May 2014
9:40 AM - 10:00 AM
Location: Conv. Ctr. Room 320
Session 2:
Medical
Tuesday 6 May 2014
10:50 AM - 11:50 AM
Location: Conv. Ctr. Room 320
Thermal camera used for the assessment of metabolism and functions of the rat brain
Paper 9105-7
Author(s):
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Intraoperative application of thermal camera for the assessment of during surgical resection or biopsy of human’s brain tumors
Paper 9105-8
Author(s):
Show Abstract
A combined approach for using thermography for the detection of diabetes mellitus
Paper 9105-31
Author(s):
Show Abstract
Session Panel:
Panel Discussion: Medical
Tuesday 6 May 2014
11:50 AM - 12:10 PM
Location: Conv. Ctr. Room 320
Session 3:
Materials Evaluation
Tuesday 6 May 2014
1:30 PM - 2:50 PM
Location: Conv. Ctr. Room 320
Center crack detection during continuous casting of aluminum by laser ultrasonic measurements
Paper 9105-9
Author(s):
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Infrared imaging analysis of ballistic impacts of composite armor materials
Paper 9105-10
Author(s):
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Thermal inspection of composite honeycomb structures
Paper 9105-11
Author(s):
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Fiber orientation assessment on surface and beneath surface of carbon fiber reinforced composites using active infrared thermography
Paper 9105-12
Author(s):
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Session Panel:
Panel Discussion: Materials Evaluation
Tuesday 6 May 2014
2:50 PM - 3:10 PM
Location: Conv. Ctr. Room 320
Session 4:
Building Applications
Tuesday 6 May 2014
3:40 PM - 4:20 PM
Location: Conv. Ctr. Room 320
Comparison of image processing techniques for the on-site evaluation of damaged frescoes
Paper 9105-13
Author(s):
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HeatWave: the next generation of thermography devices
Paper 9105-14
Author(s):
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Session Panel:
Panel Discussion: Building Applications
Tuesday 6 May 2014
4:20 PM - 4:40 PM
Location: Conv. Ctr. Room 320
Session Panel:
Panel Discussion: ThermoSense
Tuesday 6 May 2014
4:40 PM - 5:00 PM
Location: Conv. Ctr. Room 320
Wednesday 7 May Show All Abstracts
Session 5:
Sensing Technology + Applications Plenary Session
Wednesday 7 May 2014
8:30 AM - 10:00 AM
Location: Conv. Ctr. Ballroom
Session 6:
Security
Wednesday 7 May 2014
10:50 AM - 11:10 AM
Location: Conv. Ctr. Room 320
Session 7:
Research and Development
Wednesday 7 May 2014
11:10 AM - 11:50 AM
Location: Conv. Ctr. Room 320
The effect of a pre-lens aperture on the temperature range and image uniformity of microbolometer infrared cameras
Paper 9105-18
Author(s):
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Session 8:
NDT I
Wednesday 7 May 2014
11:50 AM - 12:50 PM
Location: Conv. Ctr. Room 320
IR thermographic characterization of low energy impact damage in carbon/carbon composite by applying optical and ultrasonic stimulation
Paper 9105-19
Author(s):
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Estimating non-metallic coating thickness using artificial neural network modeled time-resolved thermography: capacity and constraints
Paper 9105-20
Author(s):
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A hybrid frequency-spatial domain infrared image enhancement approach evaluated by fuzzy entropy
Paper 9105-21
Author(s):
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Session 9:
NDT II
Wednesday 7 May 2014
1:50 PM - 2:50 PM
Location: Conv. Ctr. Room 320
Pulse compression approach to digitized frequency modulated infrared imaging for non-destructive testing of carbon fibre reinforced polymers
Paper 9105-22
Author(s):
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On the application of a frequency identification technique on thermal data to identify defects in a material
(Canceled)
Paper 9105-23
Author(s):
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Computational reduction of specimen noise to enable improved thermography characterization of flaws in graphite polymer composites
Paper 9105-24
Author(s):
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Session Panel:
Panel Discussion: NDT I and II
Wednesday 7 May 2014
2:50 PM - 3:10 PM
Location: Conv. Ctr. Room 320
Session 10:
NDT III
Wednesday 7 May 2014
3:40 PM - 5:20 PM
Location: Conv. Ctr. Room 320
Survey of thermography in electronics inspection
Paper 9105-25
Author(s):
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Modelling and predicting hidden solder joint shape using active thermography and parametric numerical analysis
Paper 9105-26
Author(s):
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Non-stationary thermal wave imaging for nondestructive testing and evaluation
Paper 9105-27
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Show Abstract
Applications of infrared thermography for nondestructive testing of fatigue cracks in steel bridges
Paper 9105-28
Author(s):
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Numerical approach to binary complementary Golay coded infrared thermal wave imaging
Paper 9105-29
Author(s):
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Session Panel:
Panel Discussion: NDT III
Wednesday 7 May 2014
5:20 PM - 5:40 PM
Location: Conv. Ctr. Room 320
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