Electroactive Polymers (EAP) are enabling many new opportunities in health, wearable tech, space, robotics, and other industries. Their characteristics include the ability to undergo larger displacements than almost any other class of smart materials, the pliability needed for biomimetic and other mechanically flexible systems, and low density. Of particular interest is their potential to augment, improve upon, and one day, replace biological muscles. Besides their attractive characteristics as actuators, they are enabling new types of generators and sensors. We are providing a forum where researchers can share their knowledge and inventions to improve our community’s understanding of EAP performance, modeling of electro-mechanics and chemistry, techniques of processing and characterization, control electronics, and new applications for EAP. In summary, this conference is seeking to advance our knowledge of, promote the development of, and increase the recognition of EAP technology.

Papers are solicited on but not limited to the following EAP related topics: 2023 EAPAD Keynote Presentation
Description coming soon.

EAP-In-Action Demonstration Session
This industry and academic session, held annually as part of the SPIE’s EAPAD conference, is an opportunity to showcase working Electroactive Polymer materials and applications. State-of-the-art capabilities that make EAP one of the leading “actuators-of-choice” are on display. New materials and application areas are continuing to emerge and this session offers up-close demonstrations of EAP materials in action. The demonstration format enables interaction between the technology developers and potential users as well as a "hands-on" experience with this emerging technology. An award will be given to the three best EAP-in-Action demonstrations.

How to Apply:
Send an email with the following information to Prof. Iain A. Anderson (i.anderson@auckland.ac.nz) by Wednesday 14 September 2022: Further details can be found on the SPIE Awards page.

Course on Electroactive Polymer Actuators, Sensors, and Devices
A course on Electroactive Polymer Actuators, Sensors, and Devices will be scheduled for Sunday 12 March, prior to the start of the symposium. This provides a background on working principles of EAPs, as well as their advantages and challenges. Details and registration information for the course will be online in December.;
In progress – view active session
Conference SSN02

Electroactive Polymer Actuators and Devices (EAPAD) XXV

This conference has an open call for papers:
Abstract Due: 14 September 2022
Author Notification: 21 November 2022
Manuscript Due: 22 February 2023
Electroactive Polymers (EAP) are enabling many new opportunities in health, wearable tech, space, robotics, and other industries. Their characteristics include the ability to undergo larger displacements than almost any other class of smart materials, the pliability needed for biomimetic and other mechanically flexible systems, and low density. Of particular interest is their potential to augment, improve upon, and one day, replace biological muscles. Besides their attractive characteristics as actuators, they are enabling new types of generators and sensors. We are providing a forum where researchers can share their knowledge and inventions to improve our community’s understanding of EAP performance, modeling of electro-mechanics and chemistry, techniques of processing and characterization, control electronics, and new applications for EAP. In summary, this conference is seeking to advance our knowledge of, promote the development of, and increase the recognition of EAP technology.

Papers are solicited on but not limited to the following EAP related topics:
  • advances in actuation, sensing, and proprioception using polymer materials, as well as carbon-based and inorganic materials, plus Transduction via electrical, thermal, optical/electromagnetic or other forms of energy
  • theoretical models, analysis, and simulation, including computational chemistry
  • measurement, testing, and characterization methods
  • manufacturing technologies, including electroding, synthesis, processing, shaping, and fabrication
  • design and engineering of actuators, sensors, and their integration into devices and systems
  • technology from miniature scale (MEMS, micro, and nano) to large devices
  • applications in artificial muscles, robotics, biomimetics, energy harvesting, medical, industry, etc.
  • driving electronics, system integration, and packaging
  • control algorithms for devices and their implementation in software and hardware.
2023 EAPAD Keynote Presentation
Description coming soon.

EAP-In-Action Demonstration Session
This industry and academic session, held annually as part of the SPIE’s EAPAD conference, is an opportunity to showcase working Electroactive Polymer materials and applications. State-of-the-art capabilities that make EAP one of the leading “actuators-of-choice” are on display. New materials and application areas are continuing to emerge and this session offers up-close demonstrations of EAP materials in action. The demonstration format enables interaction between the technology developers and potential users as well as a "hands-on" experience with this emerging technology. An award will be given to the three best EAP-in-Action demonstrations.

How to Apply:
Send an email with the following information to Prof. Iain A. Anderson (i.anderson@auckland.ac.nz) by Wednesday 14 September 2022:
  • Title of the demo
  • Name of the presenter(s) and affiliation(s)
  • Short description of the "EAP-in-Action" demo
  • Graphics and/or photo(s) that represent the demo. Graphics will be included in the Smart Structures + Nondestructive Evaluation program, as well as the Electroactive Polymer Actuators and Devices (EAPAD) conference proceedings.
Further details can be found on the SPIE Awards page.

Course on Electroactive Polymer Actuators, Sensors, and Devices
A course on Electroactive Polymer Actuators, Sensors, and Devices will be scheduled for Sunday 12 March, prior to the start of the symposium. This provides a background on working principles of EAPs, as well as their advantages and challenges. Details and registration information for the course will be online in December.
Conference Chair
Ecole Polytechnique Fédérale de Lausanne (Switzerland)
Conference Co-Chair
The Univ. of Auckland (New Zealand)
Conference Co-Chair
The Univ. of British Columbia (Canada)
Program Committee
Lebanese American Univ. (Lebanon)
Program Committee
Jet Propulsion Lab. (United States)
Program Committee
The Univ. of Texas at Dallas (United States)
Program Committee
Holger Böse
Fraunhofer-Institut für Silicatforschung ISC (Germany)
Program Committee
Eric Cattan
Univ. Polytechnique Hauts-de-France (France)
Program Committee
Sungkyunkwan Univ. (Korea, Republic of)
Program Committee
Scuola Superiore Sant'Anna (Italy)
Program Committee
Linköping Univ. (Sweden)
Program Committee
Kaunas Univ. of Technology (Lithuania)
Program Committee
Johannes Kepler Univ. Linz (Austria)
Program Committee
Christoph Keplinger
Univ. of Colorado Boulder (United States)
Program Committee
Univ. of Nevada, Las Vegas (United States)
Program Committee
Max-Planck-Institut für Intelligente Systeme (Germany)
Program Committee
CTsystems AG (Switzerland)
Program Committee
Maarja Kruusmaa
Tallinn Univ. of Technology (Estonia)
Program Committee
Harbin Institute of Technology (China)
Program Committee
Zhejiang Univ. (China)
Program Committee
Jürgen Maas
Technische Univ. Berlin (Germany)
Program Committee
KAIST (Korea, Republic of)
Program Committee
Univ. Politécnica de Cartagena (Spain)
Program Committee
Univ. of California, Los Angeles (United States)
Program Committee
Western Univ. (Canada)
Program Committee
Univ. of Bristol (United Kingdom)
Program Committee
Stefan S. Seelecke
Univ. des Saarland (Germany)
Program Committee
The Univ. of Electro-Communications (Japan)
Program Committee
Chulalongkorn Univ. (Thailand)
Program Committee
Technical Univ. of Denmark (Denmark)
Program Committee
Univ. of Wollongong (Australia)
Program Committee
NASA Langley Research Ctr. (United States)
Program Committee
Toyohashi Univ. of Technology (Japan)
Program Committee
Univ. degli Studi di Bologna (Italy)
Program Committee
Univ. de Cergy-Pontoise (France)
Program Committee
TU Dresden (Germany)
Program Committee
The Chinese Univ. of Hong Kong, Shenzhen (China)
Additional Information

View call for papers






What you will need to submit
  • Title
  • Author(s) information
  • Speaker biography
  • 250-word abstract for technical review
  • 100-word summary for the program
  • Keywords used in search for your paper (optional)

Note: Only original material should be submitted. Commercial papers, papers with no new research/development content, and papers with proprietary restrictions will not be accepted for presentation.