Gaylord Palms Resort & Convention Center
Orlando, Florida, United States
11 - 15 April 2021
Conference SI204
Infrared Technology and Applications XLVII
Sunday - Thursday 11 - 15 April 2021 Conference Committee
Important Dates
Abstract Due:
21 October 2020

Author Notification:
18 December 2020

Manuscript Due Date:
17 March 2021

Call for
Papers
Rapid advances are taking place today in infrared technologies. These are enabling the development of more capable super-systems, sensor systems, cameras and subsystems that are expected to have improved performance with greater reliability, reduced Size, Weight and Power/Cost (SWaP-C). These improvements also enable new and novel applications of the technology such as self-driving vehicles, robotics and the internet of things, as well as in scanning for elevated skin temperature (EST) to monitor for potential infectious diseases like COVID-19.

The emphasis in this conference is on the infrared components, systems and applications. To demonstrate the degree of system performance improvement due to a better technology, the author may compare the performance of the system designed with and without the improved technology.

In addition, general-purpose existing sub-systems and systems will be included. Selected applications will be covered, especially in military, security systems and self-driving vehicles so as to provide continuity between developers of components and systems.

This conference will bring together researchers, engineers and students, as well as developers and users of infrared technologies, to discuss improvements in military, security, and commercial sensors brought about by the incorporation of advanced technologies and/or new techniques.

Papers solicited for this conference may address infrared technologies such as:
  • Infrared detector materials
  • Cooled and uncooled Focal Plane Arrays (FPAs)
  • Cooled and uncooled single element and linear array detectors
  • Monolithic and hybrid detectors
  • Two- and three-color detectors
  • Quantum Dot FPAs
  • Multiband and hyperspectral FPAs
  • Very large arrays for astronomy and situational awareness
  • FPAs for 3D imaging and ranging
  • Integrated and fused sensors
  • FPAs for simultaneous active and passive imaging
  • Artificial Intelligence (AI) in thermal sensing
  • Augmented Reality infrared systems
  • Deep learning, neural networks in IR system design
  • Scanning and staring imagers
  • Low-cost IR sensors for defense applications
  • Novel concepts for improved IR detection
  • In- and behind-the focal plane signal processing electronics
  • ROICs, including in-pixel digital ROICs (DROICs)
  • Graphene and other new IR imaging techniques
and their use in sensors/systems such as:
  • Elevated Skin Temperature (EST)/Fever Detection Sensors
  • Advanced driver assistance systems (ADAS) and Self Driving Vehicles
  • Thermal imagers and infrared search and track (IRST)‎
  • Distributed Aperture Systems
  • Commercial IR sensors
  • Gas and environmental sensors
  • Microsensors
  • Multispectral and hyperspectral imagers
  • Image fusion such as combined thermal imaging/low-light-level imaging systems
  • Sensors for micro air vehicles and UAVs (including commercial UAVs)
  • Threat warning systems
  • Airborne navigation, piloting, and precision targeting systems
  • Enhanced Flight Vision Systems (EFVS)
  • Degraded Visual Environment (DVE) systems
  • Thermal weapons sights (TWS)
  • Local Situational Awareness (LSA) for Ground Vehicles
  • Smart munitions‎
  • Space-based sensors
  • Missile seekers
  • Trackers with and without radiation hardening.
  • Human activity detection, face detection and recognition
Among sessions being planned for the four day conference are:
  • Cooled FPAs and applications
    • HgCdTe detectors and FPAs
    • Superlattice, barrier detectors and FPAs
    • High-operating temperature (HOT) detectors
    • QWIP and QDIP FPAs (including Colloidal Quantum Dots, CQDs) and applications
  • Reduced pixel pitch FPAs
  • Uncooled IRFPAs and applications
    • Elevated Skin Temperature (EST)/Fever Detection Sensors
  • Emerging uncooled detector technologies
  • On/near FPA smart image and signal processing, including deep learning
  • Advanced sensors, technologies, and techniques
  • Army, Navy, Air Force and paramilitary infrared R&D
  • Combined uncooled IR and low-light level integrated sensors
  • Integrated and fused sensors
  • Thermal imagers
  • Development of 3rd generation thermal imagers
  • NIR and SWIR imagers and applications
  • Facial recognition
  • Range-gated imaging and 3D imaging
  • Role of passive and active IR in driverless vehicles
  • IR seaborne, airborne, and ground-based sensor systems
  • IR technologies in security
  • Gas emission monitoring and detection

A Special Session is being planned on the impact of AI / Deep Learning on IR system performance – basics and examples.



Note 1: Only one paper on a given topic will be accepted from each company/institution.

Note 2: Papers should emphasize the technical nature of the topic. Product names and any type of product promotion must be avoided.

Note 3: Please address questions and comments concerning the conference to any one or all of the conference chairs / co-chairs: andresen@netvision.net.il; gfulop@maxtech-intl.com; lzheng@ida.org; kimata@se.ritsumei.ac.jp; oainfrared@gmail.com

Note 4: To provide the research community with enhanced access to information presented at SPIE conferences, SPIE will record the audio plus screen content of oral presentations and, with author permission only, will publish the recordings on the SPIE Digital Library. Authors may change their permission by signing into their SPIE.org account at any time prior to the meeting.
Conference Committee
Conference Chairs
  • Bjørn F. Andresen, Consultant, Infrared Technologies & Applications (Israel)
  • Gabor F. Fulop, Maxtech International, Inc. (United States), Infrared Imaging News (United States)
  • Lucy Zheng, Institute for Defense Analyses (United States)

Conference Co-Chairs
Program Committee
Program Committee continued...
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