Share Email Print


Photonics Packaging and Integration VI

*This item is only available on the SPIE Digital Library.

Volume Details

Volume Number: 6126
Date Published: 10 February 2006

Table of Contents
show all abstracts | hide all abstracts
Ultra-high-speed transmission of polymer-based multimode interference devices for board-level high-throughput optical interconnects
Author(s): Yin-Jung Chang; Gee-Kung Chang; Thomas K. Gaylord; Daniel Guidotti; Jianjun Yu
Show Abstract
Holographic optical elements for optical backplane bus targeted at high speed data transfer
Author(s): Jonathan Ellis; Robert Mays Jr.; Dale Griffiths; Hai Bi; Jinho Choi; Wei Jiang; Ray T. Chen
Show Abstract
Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board
Author(s): Geert Van Steenberge; Nina Hendrickx; Peter Geerinck; Erwin Bosman; Steven Van Put; Jurgen Van Erps; Hugo Thienpont; Peter Van Daele
Show Abstract
Bit-interleaved optical bus for high-speed secure multiboard system
Author(s): Hai Bi; Jinho Choi; Wei Jiang; Xuliang Han; Jonathan Ellis; Robert Mays Jr.; Dale Griffiths; Ray T. Chen
Show Abstract
Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing
Author(s): Ruth Houbertz; Herbert Wolter; Peter Dannberg; Jesper Serbin; Steffen Uhlig
Show Abstract
Fiber optics structural mechanics and nanotechnology-based new generation of fiber coatings
Author(s): E. Suhir
Show Abstract
Versatile coupling of a plastic optical fibre bundle to an avalanche photodiode array
Author(s): David O'Driscoll; Alan P. Morrison
Show Abstract
Lithography-grade tungsten-copper substrates for wafer level packaging
Author(s): Bob Cronk; Greg Rudd
Show Abstract
Three-dimensional chip-scale optical interconnects and switches with self-organized wiring based on device-embedded waveguide films and molecular nanotechnologies
Author(s): Tetsuzo Yoshimura; Yoshiyuki Suzuki; Noriyuki Shimoda; Toshiaki Kofudo; Keiichi Okada; Yukihiko Arai; Kunihiko Asama
Show Abstract
Progress toward optical interconnects for intrachip global communication
Author(s): Michael W. Haney; Muzammil Iqbal; Michael J. McFadden; Thomas Dillon; Dennis W. Prather
Show Abstract
A novel free-space optical interconnect employing vertical-cavity surface emitting laser diodes and InGaAs metal-semiconductor-metal photodetectors for Gbit/s RF/microwave systems
Author(s): Gregory R. Savich; Rainee N. Simons
Show Abstract
Application of parallel optical axis converting waveguide to optoelectronic-PWB
Author(s): T. Tanaka; H. Nanai; H. Sakamoto; N. Takanobu; Y. Yamamoto; I. Yamauchi; S. Sakaguchi
Show Abstract
High channel density optical interconnects using photonic crystal fibers
Author(s): Terence J. Shepherd; Charlotte R. Bennett; David M. Taylor; Laurent F. Michaille
Show Abstract
Efficient optical communications using multibit differential signaling
Author(s): Donald M. Chiarulli; Steven P. Levitan; Samuel J. Dickerson; Jason D. Bakos; Joel Martin
Show Abstract
Multimode fibers with integrated optical mode field adapters for 40Gbit/s optical ethernet systems
Author(s): U. H. P. Fischer; Th. Windel
Show Abstract
Highly integrated plastic package transceiver modules for large core fiber systems
Author(s): Flora Ho; Wai Hung; Sing Cheng; Kenrick Fu; Elaine Wong; Kin Yau; Thomas Choi; Gomer Egnisaban; Tony Mangente; Torsten Wipiejewski
Show Abstract
Advanced integration schemes for high-functionality/high-performance photonic integrated circuits
Author(s): James W. Raring; Matthew N. Sysak; Anna Tauke-Pedretti; Matthew Dummer; Erik J. Skogen; Jonathon S. Barton; S. P. DenBaars; Larry A. Coldren
Show Abstract
2D scalable optical controlled phased-array antenna system
Author(s): Maggie Yihong Chen; Brie Howley; Xiaolong Wang; Panoutsopoulos Basile; Ray T. Chen
Show Abstract
Recent advances in photonics packaging materials
Author(s): Carl Zweben
Show Abstract
Edge termination effects on finite aperture polarizers for polarimetric imaging applications at mid-wave IR
Author(s): A. A. Cruz-Cabrera; S. A. Kemme; J. R. Wendt; R. R. Boye; T. R. Carter; S. Samora
Show Abstract
Fabrication of a hybrid electrical-optical printed circuit board (EO-PCB) by lamination of an optical printed circuit board (O-PCB) and an electrical printed circuit board (E-PCB)
Author(s): El-Hang Lee; S. G. Lee; B. H. O; S. G. Park; K. H. Kim
Show Abstract
Low-cost plastic micro-optics for board-level optical interconnections
Author(s): C. Debaes; M. Vervaeke; B. Volckaerts; J. Van Erps; L. Desmet; H. Ottevaere; P. Vynck; V. Gomez; A. Hermanne; H. Thienpont
Show Abstract
Integrated waveguide micro-optic elements for 3D routing in board-level optical interconnects
Author(s): Alexei L. Glebov; Michael G. Lee; Shigenori Aoki; David Kudzuma; James Roman; Michael Peters; Lidu Huang; D. Steve Zhou; Kishio Yokouchi
Show Abstract
Hyperboloid sol gel microlens array fabricated by soft-lithography for optical coupling
Author(s): Miao He; Jing Bu; Xiaocong Yuan; Hanben Niu; Xiang Peng
Show Abstract
Fabrication of SIL array of glass by surface-tension mold technique
Author(s): Tetsuo Kishi; Shuichi Shibata; Tetsuji Yano
Show Abstract

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?