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Micro-Optics: Fabrication, Packaging, and Integration

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Volume Details

Volume Number: 5454
Date Published: 8 September 2004

Table of Contents
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High-density hybrid interconnect technologies
Author(s): Joachim John; Lars Zimmermann; Piet De Moor; Koen De Munck; Tom Borgers; Chris Van Hoof
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Flip-chip assembly for photonic circuits
Author(s): Kerstin Worhoff; Rene G. Heideman; Melis Jan Gilde; Kristian Blidegn; Matthias Heschel; Hans van den Vlekkert
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Flip-chip assembly and reliability using gold/tin solder bumps
Author(s): Hermann Oppermann; Matthias Hutter; Matthias Klein; Herbert Reichl
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PLATIMO: versatile assembling facilities to bring concepts to prototypes and automated production
Author(s): Christophe Kopp; Laurent Fulbert; Karen Gilbert
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Micro-optical components and systems in polymers for optical networks and sensors
Author(s): Ulrich Teubner
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Sol-gel replication of optical components suited for surface mount assembly
Author(s): Jurgen Sochtig; Sanida Mahmud; Samuel Obi; Jorn Pedersen; Claus Urban; Susanne Westenhofer; Peter Kipfer; Knut Siercks; Laurent Stauffer
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Basic aspects of deep lithography with particles for the fabrication of micro-optical and micromechanical structures
Author(s): Bart Volckaerts; Pedro Vynck; Michael Vervaeke; Luigi Cosentino; Paolo Finocchiaro; Patrick Reichart; Gerd Datzmann; Andreas Hauptner; Gunther Dollinger; Alex Hermanne; Hugo Thienpont
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Low-cost single-mode waveguide fabrication allowing passive fiber coupling using LIGA and UV flood exposure
Author(s): Patric Henzi; Dominik Gerhard Rabus; K. Bade; Ulrike Wallrabe; Juergen Mohr
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Integration of multimode waveguides and micromirror couplers in printed circuit boards using laser ablation
Author(s): Geert Van Steenberge; Peter Geerinck; Steven Van Put; Peter Van Daele
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High-precision surface mount assembly of micro-optical components per laser reflow soldering: positioning accuracy and thermal stability
Author(s): Laurent Stauffer; Felix Walti; Urs Vokinger; Knut Siercks
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Assembly of electro-optical modules in a desktop factory
Author(s): Arnd Menschig
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A cost-effective packaging for the environmental hardening of passive optical devices
Author(s): Jan Watte; Sam Leeman; Luc Swinnen; Danny Van Goidsenhoven; Daniel Daems
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Sealing optical fibers without metallization: design guidelines
Author(s): Raymond L. Dietz
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Development of microlens arrays for high-speed optical communication
Author(s): Chih-Hsiang Ko; Chun-Hsu Lin; Bor-Chen Tsai; His-Hsin Shih; Chien-Tsung Wu; Yu-Lin Chao; Yu-Kon Chou; Chun-Hsun Chu; Yii-Tay Chiou; Rax Chen
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Large-area origination and replication of microstructures with optical functions
Author(s): Andreas Gombert; Karen Forberich; Benedikt Blasi; Jorg Mick; Wolfgang HoBfeld; Volker Kubler; Volkmar Boerner
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Ellipsometric investigations of polished surface of glass/ceramic with ultralow coefficient of the temperature expansion
Author(s): Vladimir Petrovich Maslov; Anna Z. Sarsembaeva; Fiodor Fedorovych Sizov
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Unglue bonding of glass/ceramic parts with ultralow coefficient of thermal expansion
Author(s): Vladimir Petrovich Maslov; Fiodor Fedorovych Sizov
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