Share Email Print


Data Analysis and Modeling for Process Control

*This item is only available on the SPIE Digital Library. external link icon

Volume Details

Volume Number: 5378
Date Published: 29 April 2004

Table of Contents
show all abstracts | hide all abstracts
All links to SPIE Proceedings will open in the SPIE Digital Library. external link icon
Intel nanotechnology integrated process control systems: an overview
Author(s): Kumud Srinivasan; Youssry Botros
Show Abstract
In-tool process control for advanced patterning based on integrated metrology
Author(s): David S. L. Mui; Hiroki Sasano; Wei Liu; John Yamartino; Andrew Skumanich
Show Abstract
Multivariable versus univariable APC
Author(s): Kamyar Faron; Mark Freeland; Ole Krogh; Sukesh Patel; Gayathri Raghavendra
Show Abstract
Advanced process control applied to metal layer overlay process
Author(s): Christopher J. Gould; Yuanting Cui; Sean Louks
Show Abstract
Modeling for profile-based process-window metrology
Author(s): Christopher P. Ausschnitt; Shaunee Y. Cheng
Show Abstract
Model-based fault detection and metrology error rejection in registration APC system
Author(s): Ziqiang John Mao; Issi Geier
Show Abstract
Advanced module-based approach to effective CD prediction of sub-100nm patterns
Author(s): Jangho Shin; Insung Kim; Chan Hwang; Dong-Woon Park; Sang-Gyun Woo; Han-Ku Cho; Woo-Sung Han; Joo-Tae Moon
Show Abstract
Propagation of APC models across product boundaries
Author(s): Tito Chowdhury; Mark Freeland; Ole Krogh; Geethakrishnan Narasimhan; Gayathri Raghavendra
Show Abstract
Comparing the transient response of a resistive-type sensor with a thin film thermocouple during the post-exposure bake process
Author(s): Kenneth G. Kreider; David P. DeWitt; Joel B. Fowler; James E. Proctor; William A. Kimes; Dean C. Ripple; Benjamin K. Tsai
Show Abstract
Intra-wafer CDU characterization to determine process and focus contributions based on scatterometry metrology
Author(s): Mircea Dusa; Richard Moerman; Bhanwar Singh; Paul Friedberg; Ray Hoobler; Terry Zavecs
Show Abstract
In-line lithography cluster monitoring and control using integrated scatterometry
Author(s): Ivan Pollentier; Shaunee Y. Cheng; Bart Baudemprez; David Laidler; Youri van Dommelen; Rene Carpaij; Jackie Yu; Junichi Uchida; Anita Viswanathan; Doris Chin; Kelly Barry; Nickhil Jakatdar
Show Abstract
Complementary feed-forward and feedback method for improved critical dimension control
Author(s): Igor Jekauc; Christopher J. Gould; Walter Hartner; Tim Urenda
Show Abstract
Automatic defect classification using topography map from SEM photometric stereo
Author(s): Sergio David Serulnik; Jacob Cohen; Boris Sherman; Ariel Ben-Porath
Show Abstract
Automated fault detection and classification of etch systems using modular neural networks
Author(s): Sang Jeen Hong; Gary Stephen May; John Yamartino; Andrew Skumanich
Show Abstract
Integrated electrical and SEM-based defect characterization for rapid yield ramp
Author(s): Jacob Orbon; Lior Levin; Ofer Bokobza; Rinat Shimshi; Manjari Dutta; Brian Zhang; Dennis Ciplickas; Teri Pham; Jim Jensen
Show Abstract
PVD fault detection using disparate integrated data sources
Author(s): Alan F. Krauss
Show Abstract
CD error budget analysis in ArF lithography
Author(s): Takahisa Otsuka; Kazuo Sakamoto
Show Abstract
Improvement of 90nm KrF Cu process window by minimizing via deformation caused by low-frequency resonance of scanner projection lens
Author(s): Shu-Ping Fang; Benjamin Szu-Min Lin; Kuei-Chun Hung
Show Abstract
Use case approach to integrating and implementing lithography run-to-run control
Author(s): Dorit Karlikar; Irit K. Abramovich; Miri Kish; David Crow; Etienne Joubert; Alan Carlson
Show Abstract
Enhancement of photolithographic performance by implementing an advanced process control system
Author(s): David Crow; Etienne Joubert; Alan Carlson; Irit K. Abramovich; Dorit Karlikar; Miri Kish
Show Abstract
Yield loss in lithographic patterning at the 65nm node and beyond
Author(s): Kevin M. Monahan; Brad Eichelberger; Matt Hankinson; John Robinson; Mike Slessor
Show Abstract
Improving manufacturing variability control in advanced CMOS technology by using TCAD methodology
Author(s): Jihong Chen; Jeff Wu; Kaiping Liu; Hong Yang; David Scott
Show Abstract
Mix-and-match overlay method by compensating dynamic scan distortion error
Author(s): Takuya Kono; Manabu Takakuwa; Keita Asanuma; Nobuhiro Komine; Tatsuhiko Higashiki
Show Abstract
Necessary nonzero lithography overlay correctables for improved device performance for 110nm generation and lower geometries
Author(s): Igor Jekauc; Bill Roberts; Paul Young; Paul Jowett; Reuben Ferguson; Sean Louks
Show Abstract
Simulation benchmarking for the whole resist process
Author(s): Sang-Kon Kim; Ji-Eun Lee; Seung-Wook Park; Ji-Yong Yoo; Hye-keun Oh
Show Abstract
Development of customer assistance software for alignment parameter optimization
Author(s): Yuho Kanaya; Shinichi Nakajima
Show Abstract

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research