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Micromachining and Microfabrication Process Technology IX
Editor(s): Mary Ann Maher; Jerome F. Jakubczak

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Volume Details

Volume Number: 5342
Date Published: 30 December 2003

Table of Contents
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Effect of deposition parameters on the stress gradient of CVD and PECVD poly-SiGe for MEMS applications
Author(s): Tom Van der Donck; Joris Proost; Cristina Rusu; Kris Baert; Chris Van Hoof; Jean-Pierre Celis; Ann Witvrouw
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Phase transition vs. thickness in stress-induced curvature on Cr/Au MEMS mirror layers
Author(s): Andjela Ilic; Keith W. Goossen
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Wafer-level vacuum packaging technology based on selective electroplating
Author(s): Patrice A. Topart; Sebastien Leclair; Christine Alain; Hubert Jerominek
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Simulations and experiments on the fabrication of silicon tip
Author(s): Mingliang Wang; Daoheng Sun; Yanhua Wang
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RF MEMS technologies fabricated using low-temperature processing
Author(s): Christopher W. Dyck; Christopher D. Nordquist; Garth M. Kraus
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Fabrication of an electrochemical tip-probe system embedded in SiNx cantilevers for simultaneous SECM and AFM analysis
Author(s): Rainer J. Fasching; Yao Tao; Fritz B. Prinz
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Novel process for realization of multiple-axis actuators suitable for the realization of an optical switch
Author(s): Marco Del Sarto; Simone Sassolini; Mauro Marchi; Lorenzo Baldo
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High-performance thick copper inductors in an RF technology
Author(s): Kunal Vaed; William Graham; Michelle Steen; Jae-Eun Park; Robert Groves; Richard Volant; Ronald Nunes; James Vichiconti; Kenneth Stein; David Ahlgren
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Fabrication of integrated inductors on silicon for fully integrated DC-DC microconverters
Author(s): Ghislain Troussier; Jean-Pierre Laur; Jean-Louis Sanchez; David Bourrier; Veronique Conedera; Monique Dilhan; Norbert Fabre; Yves Lembeye; Herve Morel; Bruno Cogitore
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Advanced pressure control in time division multiplexed (TDM) plasma etch processes
Author(s): Shouliang Lai; Russ Westerman; Dave Johnson; John J. Nolan
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Deep reactive ion etch conditioning recipe
Author(s): Matthew Wasilik; Ning Chen
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Characterization of the microloading effect in deep reactive ion etching of silicon
Author(s): Soren Jensen; Ole Hansen
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Realization of vertical P+ wall through-wafer
Author(s): J. L. Sanchez; E. Scheid; P. Austin; M. Breil; H. Carriere; Pascal Dubreuil; E. Imbernon; F. Rossel; B. Rousset
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Deep wet etching on fused silica material for fiber optic sensors
Author(s): Xiaopei Chen; Bing Yu; YiZheng Zhu; Anbo Wang
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Three-dimensional microfabrication using two-photon absorption by femtosecond laser
Author(s): Shin Wook Yi; Seong Ku Lee; Hong Jin Kong; Dong-Yol Yang; Sang-hu Park; Tae-woo Lim; Ran Hee Kim; Kwang-Sup Lee
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Direct-write waveguides and structural modification by femtosecond laser pulses
Author(s): Pin Yang; George Robert Burns; David R. Tallant; Junpeng Guo; Ting Shan Luk
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Analysis of a process for replication of electroforming molds with integral microscreens
Author(s): Rangarajan Pitchumani; Qibo Jiang; Alfredo M. Morales; Linda A Domeier
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Three-dimensional photolithography based on image reversal
Author(s): Peng Yao; Garrett Schneider; Binglin Miao; Janusz Murakowski; Dennis Prather
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Fabrication of large-area x-rays masks for UDXRL on beryllium using thin film UV lithography and x-ray backside exposure
Author(s): Josef Kouba; Zhong-Geng Ling; Lin Wang; Yohannes M. Desta; Jost Goettert
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BCB wafer bonding for microfluidics
Author(s): Taejoo Hwang; Dan Popa; Jeongsik Sin; Harry E. Stephanou; Eric M. Leonard
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Bi/In thermal resist for both Si anisotropic wet etching and Si/SiO2 plasma etching
Author(s): Glenn H. Chapman; Yuqiang Tu; Jun Peng
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Improved vapor-phase deposition technique for antistiction monolayers
Author(s): Robert W. Ashurst; Carlo Carraro; Jeff D. Chinn; Victor Fuentes; Boris Kobrin; Roya Maboudian; Romuald Nowak; Richard Yi
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Polymeric protective coatings for MEMS wet-etch processes
Author(s): Kimberly A. Ruben; Tony D. Flaim; Chenghong Li
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Comparison of micro chrome patterns in gray-scale lithography
Author(s): Kei Hanai; Yoshinori Matsumoto
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Process design environment for microfabrication technologies
Author(s): Andreas Wagener; Jens Popp; Kai Hahn
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Electronic properties of multiphase systems with varying configuration of inclusions
Author(s): Vladimir V. Shchennikov; Sergey V. Ovsyannikov; Grigoriy V. Vorontsov; Vsevolod V. Shchennikov Jr.
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Wall shear stress and pressure sensor development for active control of flow
Author(s): Dimitrios M. Tsamados; Delphine Meunier; Mourad Laghrouche; Jumana Boussey; Sedat F. Tardu
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Original technology applied for manufacturing a cantilever-type piezoresistive micro-accelerometer
Author(s): Niculae N. Dumbravescu; Alin Enescu
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Creation of conductive polymer composites based on silicon with relay effect
Author(s): Jimsher N. Aneli; Giorgi O. Rusiashvili
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Silicon carbide micro- and nanoelectromechanical systems
Author(s): Mehran Mehregany; Christian A. Zorman
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