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Process and Equipment Control in Microelectronic Manufacturing II
Editor(s): Martin Fallon

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Volume Details

Volume Number: 4405
Date Published: 20 April 2001

Table of Contents
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Use of control rules and stability index to maintain an effective SPC system in a high-volume fab
Author(s): Laurie McTurk
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Optimization of a high-voltage process using TCAD
Author(s): Jim McGinty; Chris Porteous; Dave McAlpine; Martin Fallon
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Low-yield issue in IDDQ failure caused by the scrubber clean at SOG-CUR process stage
Author(s): Cheng-Fu Hsu; W. C. Chang; Chin-Hsiang Lin; C. C. Hiang
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Modeling a geographically distributed MEMS fabrication network
Author(s): William L. Benard; Michael A. Huff
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Method of controlling wafer surface polarity to reduce spacer particle contamination
Author(s): K. C. Wu; H. H. Liu; Yuan-Ko Hwang; Shih-Shiung Chen
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Use of cooled CCD cameras to control multicharged ion beam processes
Author(s): Laurence Vallier; Vincent Le Roux; Gilles Borsoni; Michael L. Korwin-Pawlowski
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Characterization of ultrathin gate dielectrics using combined grazing x-ray reflectance and spectroscopic ellipsometry
Author(s): Pierre Boher; Jean-Philippe Piel; Patrick Evard; Christophe Defranoux; Jean-Louis P. Stehle
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Spatially programmable thermal processing module for 300-mm wafer processing
Author(s): Arthur E.B. Tay; Khiang Wee Lim; Ai Poh Loh; Woei Wan Tan; Weng Khuen Ho; Anya Huang; Fu Jun
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Structural and acoustic characterization of highly oriented piezoelectric AIN films
Author(s): Cinzia Caliendo; P. Imperatori; Enrico Verona
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Method of forming tiny silicon nitride spacer for flash EPROM
Author(s): H. H. Liu; K. C. Wu; Yuan-Ko Hwang; Shih-Shiung Chen
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End-point detection during the realization of deep P+ zones by Al thermomigration
Author(s): Jean-Marie R. Dilhac; Benjamin Morillon; Christian Ganibal; Christine Anceau
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In-line total overlay measurement to operate tools beyond their capability
Author(s): John D. Rose
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Final CD control through slope/sidewall angle correlation with stepper defocus and electrical parametric
Author(s): Robert L. Campbell; Bo Su; Terry L. Seregely; Steve Wallace; Frances H. Schantz
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Stepper lens field critical dimension uniformity and optical proximity correction
Author(s): Brian Martin
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Etch selectivity of a wet chemical formulation for premetal cleaning
Author(s): Jeremy W. Epton; Deborah L. Jarrett; Ian J. Doohan
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20-um deep trench isolation process characterization for linear bipolar ICs
Author(s): Terry Dyer; Ian J. Doohan; Martin Fallon; Dave McAlpine; Adam Aitkenhead; Jim McGinty; M. Taylor; Philip Gravelle; A. Schouten; M. Bryce
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Recharacterization of a tungsten etch back process with special emphasis on PFC emission reduction and throughput optimization
Author(s): Gerhard Spitzlsperger; Andreas Rupp; Heike Lorenz
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Volatile defect formation and polysilicon residue elimination
Author(s): Cheng-Fu Hsu
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Some measurements on the effects of developer depletion
Author(s): Brian Martin; Tom Tighe
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High-pressure treatment and analysis of semiconductor-metal heterophase structures
Author(s): Vladimir V. Shchennikov; Andrew Yu. Derevskov; Vladimir I. Osotov; Sergey V. Ovsyannikov
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