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Process and Equipment Control in Microelectronic Manufacturing
Editor(s): Kevin Yallup; Murali K. Narasimhan

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Volume Details

Volume Number: 3742
Date Published: 23 April 1999

Table of Contents
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Equipment and wafer modeling of batch furnaces by neural networks
Author(s): N. Benesch; Claus Schneider; Wolfgang Lehnert; Lothar Pfitzner; Heiner Ryssel
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Atmospheric furnace pressure control
Author(s): Martin Fallon
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Use of poly test wafer volume fraction as an input to control a diffusion poly doping process
Author(s): Stephen McDade
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Characterization, development, and implemenation of multiplaten in-situ rate monitor (ISRM) control for chemical mechanical planarization in ASIC manufacturing
Author(s): Frank H. Szarka; John H. Givens; David Easterday
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Raw wafer material control to eliminate low yield
Author(s): Cheng-Fu Hsu; W. C. Chang; Wei-Kun Yeh; Steve Lin
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Practical issues in the deployment of a run-to-run control system in a semiconductor manufacturing facility
Author(s): Jerry A. Stefani; Mike Anderson
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Statistical control for autocorrelated data
Author(s): Nien-Fan Zhang
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Statistical approach to linewidth control in a logic fab
Author(s): Michael Pitter; Bernhard Doleschel; Ludwig Eibl; Erwin Steinkirchner; Andreas Grassmann
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High-voltage resurf DMOS process development using covariance-based response surfaces
Author(s): Mark Redford; Martin Fallon; Anthony J. Walton; Z. A. Shafi; Jim McGinty; Ian Underwood
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DOE analysis of layout/process interactions in bipolar Schottky technology
Author(s): Alastair McGibbon; Adil Shafi; Nigel Cameron; Chun Ng; Mark Redford
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Characterization of gate electrode etch process for 0.25 um extended to 0.18 um
Author(s): Henry Gerung; Vijay Chhagan; Pradeep R. Yelehanka; Mei-Sheng Zhou; Joe K. Hui
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Automatic furnace downloading to SUPREM format
Author(s): Martin Fallon; Keith Findlater; Jim McGinty; N. Rankin; A. Yarr
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Automated cost of ownership analysis for process development
Author(s): Vidar K. Nilsen; Anthony J. Walton
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Methodology to improve mean time between clean and decrease defectivity on LAM TCP 9600 by using self-excited electron plasma resonance spectroscopy
Author(s): Gerard Petit
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In-situ UV absorption CF2 sensor for reactive ion etch process control
Author(s): Hunsuk Kim; Fred Lewis Terry Jr.
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Critical dimension and oxide damage control during poly/polycide etching on a TCP9400SE using the SEERS plasma diagnostic system
Author(s): Michel Derie
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Optical integrated circuit for quality control
Author(s): Delphine Emzivat; Claude Gagnadre; Eric Martin
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Dry etch uniformity and optimization using graphical and DOE techniques
Author(s): John Ian Doohan; Martin Fallon; I. Thomson; Richard Boyle; J. Norval
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Metal etch process defects
Author(s): Ting-Yih Lu; Yuan-Ko Hwang; Chia-Hung Lai; Sen-Fu Chen; Chia-Hsiang Chen
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Generation mechanism and reduction methods of post-passivation-etch silklike polymers
Author(s): Chung-Daw Young; Sen-Fu Chen; Chia-Hsiang Chen
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Integration of factory simulation with TCAD process and device simulation within a total TCAD approach to DFM
Author(s): Vidar K. Nilsen; Anthony J. Walton
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Characterization of metal profile notching as a result of electron shading in a high-density plasma etcher
Author(s): Fred Smits
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Embedded optical sensors and data processing for thin film deposition
Author(s): David J. Robbins; Alan Marrs; Christopher Pickering; Allister W. Dann; John L. Glasper; John Russell
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