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Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Editor(s): Anthony J. Toprac; Kim Dang

*This item is only available on the SPIE Digital Library.

Volume Details

Volume Number: 3507
Date Published: 3 September 1998

Table of Contents
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Methodology for real-time feedback variable selection for manufacturing process control: theoretical and simulation results
Author(s): Oliver D. Patterson; Pramod P. Khargonekar
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Fast-ramp rapid vertical processor for 300-mm Si wafer processing
Author(s): Cole Porter; Allan Laser; Robert Herring; Pradeep Pandey
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Development and testing of an active platen for IC manufacturing
Author(s): James M. Redmond; Pat Barney; Tony G. Smith; Joel R. Darnold
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Multivariate run-to-run control of arm-to-arm variations in chemical mechanical planarization
Author(s): W. Jarrett Campbell; Chris Raeder; Valerie Wenner; Thomas F. Edgar
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Feedforward recipe selection control design software
Author(s): Steve Ruegsegger; Aaron Wagner; James S. Freudenberg; Dennis S. Grimard
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More-effective troubleshooting using data collection on etch equipment: case studies
Author(s): James Durham; Steve Felker; Steven F. Shelton
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Monitoring of a RTA process using multi-PCA
Author(s): Michael L. Miller; Qingsu Wang; Terrence Riley
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Dynamic gas chemistry simulator for vacuum systems
Author(s): James Durham; Steve Felker
Chemical rate model for the surface pyrolysis of tetrakis(dimethylamido)titanium to form titanium nitride films
Author(s): Anthony J. Toprac; John A. Iacoponi; Karl A. Littau
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Mechanism for QBD failure in poly gates
Author(s): Judith B. Barker; Robert Wu; Richard G. Cosway; Julie Stephens; Rich Cote
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Plasma etching of aluminum copper tungsten on titanium nitride and titanium
Author(s): Kim Dang
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Influence of topographical variations on reliable via and contact formation
Author(s): Jerry T. Healey; Scott E. Rubel
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Flat-type metal residue-induced metal line bridge
Author(s): Hung-Chi Hsiao; Po-Tao Chu; Y.M. Hsu; Chia-Hsiang Chen
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SVG 8800 photoresist coater uniformity improvement using Shipley resist 3010
Author(s): Deborah Emielita
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Etch characteristics of Ti in Cl2/N2 and TiN in Cl2/N2/BCl3 plasmas by response surface methodology
Author(s): N. Moorthy Muthukrishnan; Kostas Amberiadis; Aicha Elshabini-Riad
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Influence of floating gate tungsten polycide deposition technique on EEPROM electrical characteristics
Author(s): Karine Ogier-Monnier; Philippe Boivin; Olivier Bonnaud
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Isotropic nitride etching for thin nitride barrier self-aligned contact (TNBSAC) in an inductively coupled plasma chemical etcher
Author(s): Jeong-Ho Kim; Jae-Ok Ryu; Jong-Sam Kim; Jin-Woong Kim; Yeo-Song Seol
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Thermalization process in sputtering systems by atomic absorption spectroscopy
Author(s): Edward Augustyniak; Serguei V. Filimonov; Chih-shun Lu
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Application of backside fiber optic system for in-situ CMP endpoint detection on shallow-trench isolation wafers
Author(s): Dmitry V. Bakin; Daniel E. Glen; Mei H. Sun
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Real-time spectroscopic reflectometer for end-point detection on multichamber deposition processes
Author(s): Pierre Boher; Sebastien Noygues; Jean-Louis P. Stehle
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Developments in focused ion beam metrology
Author(s): Jesse A. Salen; Gregory J. Athas; Drew Barnes; Neil J. Bassom; Don E. Yansen
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Technological sensors on slow electromagnetic waves
Author(s): Yuri N. Pchelnikov; Andrey A. Yelizarov
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Real-time detection of chamber condition by observing the plasma spectrum intensity
Author(s): Ching-Wen Cho; Yuan-Ko Hwang; Po-Tao Chu; Y. S. Peng; Chia-Hsiang Chen
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Magnetoresistance of heterophase materials at high pressures
Author(s): Vladimir V. Shchennikov
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HECTOR: transnanometer Z-axis calibration artifacts for semiconductor process control
Author(s): Alson E. Hatheway
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Polyimide defect reduction
Author(s): Shih-Shiung Chen; Hung-Chih Chen; Chen-Cheng Kuoe
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Novel method to eliminate SOG-etching-back-induced random particle
Author(s): Chih-Hsieh F. Hsu; Chao-Hsin Chang; M. K. Yu; Y. S. Peng
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Analysis of the generation of the misfit dislocations during the boron prediffusion in silicon
Author(s): Florin Gaiseanu; Gudrun Kissinger; D. Kruger; H. Richter
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SOPRA SE3000: a new tool for high-accuracy characterization of multilayer structures on very small spot size
Author(s): Pierre Boher; Marc Bucchia; Jean Pierre Rey; Jean-Louis P. Stehle
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Stepper NA/PC optimization DOE for i-line masking
Author(s): Chung Yih Lee; Wei Wen Ma; Alex Tsun-Lung Cheng; Kia Huat Gan
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Development of consolidated in-situ metallization processes for enhanced productivity
Author(s): Brad M. Axan; Dave Edmonds
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Resolving localized oxide breakthrough during poly etch of nonvolatile floating gate structures
Author(s): Jerry T. Healey; Vibol Sim; Scott E. Rubel
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Microprocessor technology challenges through the next decade
Author(s): George E. Sery
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Copper chip technology
Author(s): Daniel C. Edelstein
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Foundry technology trend
Author(s): Jack Y. C. Sun
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Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below
Author(s): Alain S. Harrus; John Kelly; Ronald A. Powell
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