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Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing II
Editor(s): John K. Lowell; Ray T. Chen; Jagdish P. Mathur

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Volume Details

Volume Number: 2638
Date Published: 18 September 1995

Table of Contents
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Investigation of metal contamination by photocurrent measurements: validation and application to ion implantation processes
Author(s): Maria Luisa Polignano; C. Bresolin; F. Cazzaniga; Anna Sabbadini; G. Queirolo
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Evaluation of contaminant-induced charge from oxide chemical-mechanical polish
Author(s): Peter Burke; John K. Lowell; Lubek Jastrzebski
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Advanced optical characterization techniques for borophosphosilicate films
Author(s): Ronald A. Carpio; Jon Taylor
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Scanning photon microscope based on ac surface photovoltage: applications to nondestructive evaluation of metallic contaminants in silicon wafers
Author(s): Hirofumi Shimizu; Chusuke Munakata
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Advances in infrared spectroscopic methods for epitaxial film characterization
Author(s): Ronald A. Carpio; Burt W. Fowler; Wolfgang Theiss
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Multiparameter process metrology using scatterometry
Author(s): Christopher J. Raymond; Michael R. Murnane; Steven L. Prins; S. Sohail; S. Sohail H. Naqvi; John Robert McNeil
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Energy spectra of electrons emitted from samples with an internal electric field
Author(s): Jadwiga Olesik; Bogdan Calusinski; Zygmunt Olesik
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Oxygen precipitation and denuded zone characterization with ELYMAT technique
Author(s): Guenther Obermeier; Juergen Hage; Norbert Hilger; Diethard Huber
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Novel evaluation method of silicon epitaxial layer lifetimes by photoluminescence technique
Author(s): Yoshinori Hayamizu; Ryoji Hoshi; Yutaka Kitagawara; Takao Takenaka
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Influence of oxygen-iron interaction on the external gettering of Fe in p-Si by polycrystalline silicon film
Author(s): Kamal K. Mishra; Mark Stinson; John K. Lowell
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TD formation in CZ-silicon annealed at 450 degrees C in air ambient
Author(s): Shyam Singh; Om Prakash
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Ellipsometric characterization techniques for Si processing technologies
Author(s): Teruaki Motooka; T. Iwanaga; M. Koutani
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Use of beam profile reflectometry to determine depth of silicon etch damage and contamination
Author(s): Karen A. Reinhardt; Susan M. Kelso
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Advanced ellipsometry for very thin films and multilayers
Author(s): Peter Paduschek; Michael Tamme; Thomas D. Hankey
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Surface photovoltage analysis of iron contamination in silicon processing and the relation to gate oxide integrity
Author(s): Worth B. Henley
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Oxide charging induced by electron exposure in ion implant
Author(s): Alan Stuber; John K. Lowell
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Optical characterization of surface damage of silicon wafers caused by plasma cleaning
Author(s): A. Rahim Forouhi; Iris Bloomer
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Performance optimization of three-dimensional optoelectronic interconnection for intra-multi-chip-module clock signal distribution
Author(s): Chunhe Zhao; Ray T. Chen
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Influence of shape of the illumination aperture on the intrafield image displacement
Author(s): Byeong-Chan Kim; Young Jin Song; Hong-Seok Kim; Jaejeong Kim
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Polygonal gratings for wafer scale one-to-many optical clock signal distribution
Author(s): Ray T. Chen; O. Erchov; Luke A. Graham
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Optical characterization of power devices
Author(s): H.-J. Schulze; G. Deboy
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Optical characterization of surface effects from Cu-contaminated SiO2/Si interfaces
Author(s): Xiaodong Wang; Harold G. Parks; Carolyn Cariss; John K. Lowell
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In-situ wafer contamination detection through rf-PCD Measurements
Author(s): Jurgen Michel; Marcia R. Black; G. J. Norga; Kathryn A. Black; Hichem M'saad; Lionel C. Kimerling
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Evaluation of near-surface microdefects in Czochralski-Si wafers after a CMOS process by an infrared interference method
Author(s): Yutaka Kitagawara; Ken-ichi Aihara; Satoshi Oka; Takao Takenaka
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Light scattering from patterned surfaces and particles on surfaces
Author(s): Brent Martin Nebeker; Greg W. Starr; E. Dan Hirleman
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New laser scanning techniques for wafer inspection
Author(s): Mehrdad Nikoonahad; Brian C. Leslie; Stanley E. Stokowski; Brian M. Trafas; Keith B. Wells
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Optical studies of fluorocarbon film formation by a high-density plasma etcher
Author(s): Ronald A. Carpio; Burt W. Fowler; Thien T. Nguyen
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Package and module substrate interconnect evaluation by thermal time domain reflectometry (TTDR)
Author(s): Sugoog Shon; Robert H. Flake; Anthony Wong
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Manufacturing challenges for sub-half micron technologies
Author(s): Fu-Tai Liou
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