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Adhesives Engineering
Editor(s): Eric A. Norland; Kenneth M. Liechti

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Volume Details

Volume Number: 1999
Date Published: 27 September 1993

Table of Contents
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New perspectives in polymer adhesion mechanisms--importance of diffusion and molecular bonding in adhesion
Author(s): Lieng-Huang Lee
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Minimizing cement strain while cementing thin lenses using ultraviolet light
Author(s): Donald R. Green
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Mechanisms relating to reducing stress in curing thick sections of UV adhesives
Author(s): Eric A. Norland; Frank S. Martin
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Cold lens blocking methods
Author(s): Robert F. Novak; Marlene A. Marro; Joe D. Tipps Jr.; Walter C. Czajkowski
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Effects of military environments on optical adhesives
Author(s): David Henry Krevor; Hargovind N. Vazirani; Antai Xu
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Outgassing: an atypical approach
Author(s): Frank S. Martin; Eric A. Norland
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Finite-element analysis of adhesive butt joints in fiber optic devices
Author(s): John A. Sultana; Daniel R. O'Brien; Steven E. Forman
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Causes for separation in UV adhesive bonded optical assemblies
Author(s): H. Frederick Woods
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Glass-on-chip package for CCDs
Author(s): Maurice S. Karpman; Christopher Reiche
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Inverted microscope refitted for the testing of epoxy coating debonding induced by indenters on the glass substrates
Author(s): Ruiyi Chen
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Dual cracking at polymer/glass interfaces
Author(s): John E. Ritter Jr.; T. J. Lardner; G. C. Prakash; A. J. Stewart; V. Surorova
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Measurement of mixed mode (I,II) stress intensity factors (SIFs) of an interface crack by the optical method of caustics
Author(s): Lyndon Edwards; H. Y. Ahmad
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Measurement of bimaterial interface fracture parameters using modified SEN beam specimens and coherent gradient sensing
Author(s): Hareesh V. Tippur; Sreeganesh Ramaswamy
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Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives
Author(s): Devin E. Mix; Avram Bar-Cohen
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Fracture energy of ice/metal interfaces
Author(s): Yingchang Wei; Robert M. Adamson; John P. Dempsey
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Testing and computer modeling of adhesives in bulk and bonded states
Author(s): Samit Roy; Barry S. Spigel
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Calibration of the plane strain mixed mode pullout delamination specimen
Author(s): Panos G. Charalambides; S. Srikantan
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Nondestructive testing of bonded structures with Reverse Geometry X-ray imaging
Author(s): Thomas Milton Albert
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Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bonds
Author(s): Thomas Bischof; Werner P. O. Jueptner
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Dynamic response of mode III interface crack in bonded materials
Author(s): Ya-Pu Zhao; Jing Fang
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Effect of dislocations in multilayer media
Author(s): Kelin Pan; Jing Fang
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Dynamic failure analysis of bimaterial beam with crack tip terminating interface
Author(s): Jing Fang; Z. D. Jiang; Jiang Qi; Ya-Pu Zhao
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Comparison of numerous lap joint theories for adhesively bonded joints
Author(s): William C. Carpenter
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Suitability of various blister tests for thin film adhesion tests
Author(s): Kenneth M. Liechti; A. Shirani
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Failure analysis of adhesively bonded composite joint: an elasto-plastic approach
Author(s): S. C. Pradhan; N. N. Kishore; N. G. R. Iyengar
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Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure
Author(s): Howard Fein
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