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Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices
Editor(s): Henryk Temkin

*This item is only available on the SPIE Digital Library.

Volume Details

Volume Number: 1851
Date Published: 24 June 1993

Table of Contents
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Buried heterostructure lasers based on InGaAsP/InP
Author(s): Ralph A. Logan; B. Lee; R. F. Karlicek; Sung-Nee G. Chu
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Fabrication processes for GaAs-based high-power diode lasers
Author(s): Kathleen Meehan; Linda S. Heath; Jeannie E. Williams; Tien Yang Wang; Dana M. Beyea; Aland K. Chin; Wolfgang Stutius
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Fast and reliable processing of high-performance InGaAs 0.98-um laser diodes
Author(s): Frank Vermaerke; Peter Van Daele; Gerrit Vermeire; Ingrid Moerman; Piet M. A. Demeester
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1.3-um InGaAsP/InP buried-crescent lasers with narrow spread of threshold currents
Author(s): Ching Long Jiang; Robert J. Miller; Mark Soler; Maria D. Ferreira; Keith Wilder; Eugene A. Imhoff; John D. Kulick; Randy Wilson
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Si-based laser subassembly for telecommunications
Author(s): W. Michael MacDonald; R. E. Fanucci; Greg E. Blonder
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Inexpensive packaging techniques of fiber pigtailed laser diodes
Author(s): Pentti Karioja; Kari Tukkiniemi; Veli Heikkinen; Ilkka P.A. Kaisto
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High-performance packaging of gigabit data communication optical modules
Author(s): Eric M. Foster; K. C. Jen; Carolyn A. Paddock; Jerry K. Radcliffe; William Vetter
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Applications of diamond made by chemical vapor deposition semiconductor laser submounts
Author(s): E. Frederick Borchelt; Grant Lu
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Packaging of optical interconnect arrays for optical signal processing and computing
Author(s): Michael Kevin Kilcoyne; Jeff W. Scott; John J. Plombon
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Coupling four watts cw from a diode-pumped Nd:YAG laser through a 5-um-core single-mode fiber
Author(s): Brian K. Brickeen; David A. Bryan; H. W. Fries
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Micro-optic and microelectronic integrated packaging of vertical-cavity lasers
Author(s): Greg R. Olbright; Jack L. Jewell; Robert P. Bryan; Winston S. Fu
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Vertical-cavity surface-emitting laser technology
Author(s): Frank H. Peters; Marian L. Majewski; Matthew G. Peters; Jeff W. Scott; Brian Thibeault; D. Bruce Young; Larry A. Coldren
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Performance issues related to dielectric stack reflectors for vertical-cavity surface-emitting lasers
Author(s): Dennis G. Deppe; Diana L. Huffaker; Chun Lei
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Molecular beam epitaxy technology for selective area embedded InGaAs layers in InP substrates
Author(s): Alexandros Georgakilas; Aristos Christou; K. Zekentes; K. Tsagaraki; G. Halkias; Pierre Lefebvre; Jacques Allegre
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Direct contact-type image sensor unit
Author(s): Tetsuroh Nakamura; Eiichiroh Tanaka; Shinji Fujiwara
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Laser diode fiber link for the transmitter of the SOUT program and for the beacon of the Silex program
Author(s): Daniel Malaise; Jacques Gollier
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